From 549ef88f703bcf694f12dc0dcf31366c2c7672f2 Mon Sep 17 00:00:00 2001 From: jean-pierre charras Date: Thu, 11 Jan 2024 16:29:41 +0100 Subject: [PATCH] QFNWizard: ensure thermal vias/pads have the property PAD_PROP::HEATSINK set. --- pcbnew/python/plugins/qfn_wizard.py | 2 ++ 1 file changed, 2 insertions(+) diff --git a/pcbnew/python/plugins/qfn_wizard.py b/pcbnew/python/plugins/qfn_wizard.py index 1b65c5469f..d031f4a84c 100644 --- a/pcbnew/python/plugins/qfn_wizard.py +++ b/pcbnew/python/plugins/qfn_wizard.py @@ -178,6 +178,8 @@ class QFNWizard(FootprintWizardBase.FootprintWizard): via_diam = min(aper_pad_w, aper_pad_l) / 2 via_drill = min(via_diam / 2, epad_via_drill) via = PA.PadMaker(self.module).THRoundPad(via_diam, via_drill) + # A thermal via must have the PAD_PROP_HEATSINK set. + via.SetProperty( pcbnew.PAD_PROP_HEATSINK ) layers = pcbnew.LSET.AllCuMask() layers.AddLayer(pcbnew.B_Mask) layers.AddLayer(pcbnew.F_Mask)