diff --git a/pcbnew/exporters/export_d356.cpp b/pcbnew/exporters/export_d356.cpp index b5d0b11d48..865986acc9 100644 --- a/pcbnew/exporters/export_d356.cpp +++ b/pcbnew/exporters/export_d356.cpp @@ -50,14 +50,14 @@ * Useful because 356A (when implemented) must be sorted before outputting it */ struct D356_RECORD { - bool smd; - bool hole; - wxString netname; - wxString refdes; - wxString pin; - bool midpoint; + bool smd; + bool hole; + wxString netname; + wxString refdes; + wxString pin; + bool midpoint; int drill; - bool mechanical; + bool mechanical; int access; // Access 0 is 'both sides' int soldermask; // All these in PCB units, will be output in decimils @@ -74,19 +74,19 @@ static int compute_pad_access_code( BOARD *aPcb, LAYER_MSK aLayerMask ) // Non-copper is not interesting here aLayerMask &= ALL_CU_LAYERS; if( aLayerMask == 0 ) - return -1; + return -1; // Traditional TH pad if( (aLayerMask & LAYER_FRONT) && (aLayerMask & LAYER_BACK) ) - return 0; + return 0; // Front SMD pad if( (aLayerMask & LAYER_FRONT) ) - return 1; + return 1; // Back SMD pad if( (aLayerMask & LAYER_BACK) ) - return aPcb->GetCopperLayerCount(); + return aPcb->GetCopperLayerCount(); // OK, we have an inner-layer only pad (and I have no idea about // what could be used for); anyway, find the first copper layer @@ -129,36 +129,36 @@ static void build_pad_testpoints( BOARD *aPcb, // It could be a mask only pad, we only handle pads with copper here if( rk.access != -1 ) { - rk.netname = pad->GetNetname(); - rk.refdes = module->GetReference(); - pad->StringPadName( rk.pin ); - rk.midpoint = false; // XXX MAYBE need to be computed (how?) - const wxSize& drill = pad->GetDrillSize(); - rk.drill = std::min( drill.x, drill.y ); - rk.hole = (rk.drill != 0); - rk.smd = pad->GetAttribute() == PAD_SMD; - rk.mechanical = (pad->GetAttribute() == PAD_HOLE_NOT_PLATED); - rk.x_location = pad->GetPosition().x - origin.x; - rk.y_location = origin.y - pad->GetPosition().y; - rk.x_size = pad->GetSize().x; + rk.netname = pad->GetNetname(); + rk.refdes = module->GetReference(); + pad->StringPadName( rk.pin ); + rk.midpoint = false; // XXX MAYBE need to be computed (how?) + const wxSize& drill = pad->GetDrillSize(); + rk.drill = std::min( drill.x, drill.y ); + rk.hole = (rk.drill != 0); + rk.smd = pad->GetAttribute() == PAD_SMD; + rk.mechanical = (pad->GetAttribute() == PAD_HOLE_NOT_PLATED); + rk.x_location = pad->GetPosition().x - origin.x; + rk.y_location = origin.y - pad->GetPosition().y; + rk.x_size = pad->GetSize().x; - // Rule: round pads have y = 0 - if( pad->GetShape() == PAD_CIRCLE ) - rk.y_size = 0; - else - rk.y_size = pad->GetSize().y; + // Rule: round pads have y = 0 + if( pad->GetShape() == PAD_CIRCLE ) + rk.y_size = 0; + else + rk.y_size = pad->GetSize().y; - rk.rotation = -KiROUND( pad->GetOrientation() ) / 10; - if( rk.rotation < 0 ) rk.rotation += 360; + rk.rotation = -KiROUND( pad->GetOrientation() ) / 10; + if( rk.rotation < 0 ) rk.rotation += 360; - // the value indicates which sides are *not* accessible - rk.soldermask = 3; - if( pad->GetLayerMask() & SOLDERMASK_LAYER_FRONT) - rk.soldermask &= ~1; - if( pad->GetLayerMask() & SOLDERMASK_LAYER_BACK) - rk.soldermask &= ~2; + // the value indicates which sides are *not* accessible + rk.soldermask = 3; + if( pad->GetLayerMask() & SOLDERMASK_LAYER_FRONT) + rk.soldermask &= ~1; + if( pad->GetLayerMask() & SOLDERMASK_LAYER_BACK) + rk.soldermask &= ~2; - aRecords.push_back( rk ); + aRecords.push_back( rk ); } } } @@ -172,15 +172,15 @@ static int via_access_code( BOARD *aPcb, int top_layer, int bottom_layer ) // Easy case for through vias: top_layer is component, bottom_layer is // solder, access code is 0 if( (top_layer == LAYER_N_FRONT) && (bottom_layer == LAYER_N_BACK) ) - return 0; + return 0; // Blind via, reachable from front if( top_layer == LAYER_N_FRONT ) - return 1; + return 1; // Blind via, reachable from bottom if( bottom_layer == LAYER_N_BACK ) - return aPcb->GetCopperLayerCount(); + return aPcb->GetCopperLayerCount(); // It's a buried via, accessible from some inner layer // (maybe could be used for testing before laminating? no idea)