The implementation used to always check F_Cu and B_Cu, rather than
where the via started and ended (which will be different for blind/
buried vias and microvias).
Bitmaps are now identified by an enum class instead of by pointers.
Bitmap loading and caching is now handled by a class in common, and
we no longer compile most bitmaps into the binary, so there is no
longer a bitmaps static library.
Instead, bitmaps are archived to a .tar.gz file which is installed
in ${KICAD_DATA}/resources/images.tar.gz
The source PNGs are checked in to Git as the original CPP files were,
so that people can build without the required dependencies to convert
SVGs to PNGs.
Initial support is also added for dark theme icons, although this
is not yet exposed in the GUI.
Stubs are present for multi-resolution image resources, but this is
not fully-baked yet and could use some refinement.
Keep Through Hole pads on external layers should be ON by default, because
such a pad does not allow soldering/unsoldering, if this option this option is OFF
Also rename dialog_enum_pads.fbp as dialog_enum_pads_base.fbp, as usual
This option removes copper layers from pads and vias where they are not
connected to other board elements. This allows the inner layers to be
more closely routed if the via landing pad is not needed.
Fixes https://gitlab.com/kicad/code/kicad/issues/1835
Jon Evans
jean-pierre charras
Jeff Young
Ian McInerney
Seth Hillbrand