eeschema now supports arbitrary colors for all object types, and
pcbnew does in GAL canvas. When switching from GAL to legacy canvas,
pcbnew will convert colors to the nearest legacy color.
This option is not yet activated because the net attributes are not yet fully fixed by Ucamco, in Gerber file format specifications.
(To activate it, see dialog_plot.cpp, line 43)
In polygon calculations (combining polygons, fracture) the mode of calculation (fast or strictly simple polygon option) as no more a default value, because choosing the best mode is better to optimize the calculation time.
PAD_SHAPE_T and PAD_ATTR_T still have a double definition (new names and old names) to be sure python scripts are nor broken by the change.
PAD_DRILL_SHAPE_T does not have a double definition, because it is unlikely oblong holes are used in python scripts.
Double definitions will be removed in the (next) future.
This is due to the fact the boost::pylygon function resize ( a inflate/deflate function) used for calculations does not work with boost version >= 1.56.
Use Clipper inflate/deflate function instead. It is faster and works fine.
2) Change from legacy Cu stack to counting down from top=(F_Cu or 0).
The old Cu stack required knowing the count of Cu layers to make
sense of the layer number when converting to many exported file types.
The new Cu stack is more commonly used, although ours still gives
B_Cu a fixed number.
3) Introduce class LSET and enum LAYER_ID.
4) Change *.kicad_pcb file format version to 4 from 3.
5) Change fixed names Inner1_Cu-Inner14_Cu to In1_Cu-In30_Cu and their
meanings are typically flipped.
6) Moved the #define LAYER_N_* stuff into legacy_plugin.cpp where they
can die a quiet death, and switch to enum LAYER_ID symbols throughout.
7) Removed the LEGACY_PLUGIN::Save() and FootprintSave() functions.
You will need to convert to the format immediately, *.kicad_pcb and
*.kicad_mod (=pretty) since legacy format was never going to know
about 32 Cu layers and additional technical layers and the reversed Cu
stack.
- SEGVIA becomes VIA
- Drill size moved from TRACK to VIA
- Removed shape from TRACK, becomes ViaType in VIA
- GetTrace becomes GetTrack, for uniformity
- Some minor constification and typo fixes
*) add hotkey for setting the grid origin as 'S', in board editor, module editor.
*) re-position the function interface for cursor movement from BASE_SCREEN into
class EDA_DRAW_FRAME. This is a prelude to getting rid of BASE_SCREEN or
splitting it up.
* All items shapes are converted to polygons.
* Polygons are merged layer by layer (for calculation time reasons,zones are not merged)
* for copper layers, vias and pads holes are substracted from polygons (but, for calculation time reasons, not inside zones areas).
* the look is better, mainly when displaying the copper thickness
* solder and paste layers are now shown in 3D viewer.
* the code was seriously cleaned (but still needs to be enhanced).
* Note this is a work in progress which needs refinements.
* Complete encapsulation of the MODULE class.
* Complete encapsulation of the EDA_TEXT class.
* Encapsulate most of the ZONE_CONTAINER class.
* Add pcbcommon library as a dependency for reSWIGging the scripting
support. This should cover most dependency cases.
Jon Evans
Maciej Suminski
jean-pierre charras
Tomasz Wlostowski
unknown
Dick Hollenbeck
Lorenzo Marcantonio
Wayne Stambaugh
Heikki Pulkkinen
Marco Mattila