1) The highest priority zone that a via/pad collides with "owns" its
connectivity state. Once set, lower priority zones cannot change it --
and in fact, if they would have connected to it are forced not to.
2) The connectivity state goes with the zone fill state, and therefore
must be saved in the file.
3) Display of remove-unconnected's pads is no longer done in GetViewLOD()
(which isn't called for selected items), and is instead done in PCB_PAINTER.
This allows us to draw the full pad in outline mode when a via/pad is
selected which would otherwise only show the hole.
4) Note that in some cases this will still generate DRC errors -- in
particular when a via nearly collides with a higher priority zone it
won't get "owned" by that zone and may therefore have insufficient
clearance if said zone concludes it's unconnected and a subsequent
(lower priority) zone connects to it (causing it to now become flashed).
Fixes https://gitlab.com/kicad/code/kicad/issues/11299
Each pad group is allowed to short nets with other pads in its group.
Legacy footprints with the "net tie" keyword hack will get a single
group auto-created with all the footprint's pads in it.
DRC and the router now allow a track to collide with copper graphic items
while entering a net-tie pad as long as the closest point in the collision
is within the pad.
DRC (and the footprint checker) now check for copper items in the
footprint shorting pads which are not in the same pad group.
Fixes https://gitlab.com/kicad/code/kicad/issues/2265
the new attribute is:
"(attr (teardrop type padvia)))" or "(attr (teardrop (type track_end)))"
However (Work in Progress) writing this attribute in file is temporarily disabled.
1) Unify metrics between stroke and outline fonts
2) Unify handling of rotation and mirroring
3) Bug fixes in collision handling
4) Use of VECTOR2I (instead of VECTOR2D) for world-coordinates
5) Generate outline font overbar with rounded ends and fix rotation
bugs
6) Generate wxEVT_CHOICE events from FONT_CHOICE::SetFontSelection
7) Change text-item PNS SOLIDs to use compound shapes
ADDED zone_connection constraint.
ADDED thermal_relief_gap and thermal_spoke_width constraints.
ADDED angle override for thermal relief spokes in Pad Properties.
Fixes https://gitlab.com/kicad/code/kicad/issues/4067
CHANGED: manually-placed (stitching) vias won't have their nets automatically updated
(unless the via is placed directly on a track segment)
CHANGED: stitching vias can be placed on footprint pads and pick up their nets
Fixes https://gitlab.com/kicad/code/kicad/-/issues/5484
This allows the parser to properly interpret the sexpr version
of the footprint so that it can throw future format errors or
do version specific parsing properly.
Previously the fill for shapes inside a footprint was not being
properly imported from older versions becase the default of no
flag changed from representing filled to representing no fill.
Introduce explicit filling information, and continue to treat no
flag on a polygon as meaning it is filled (which is the legacy
behavior).
Fixes https://gitlab.com/kicad/code/kicad/-/issues/6393
Fixes https://gitlab.com/kicad/code/kicad/-/issues/6390
This is a board file format change to account for the new properties.
Also, we now only store the critical information about the dimension's
geometry in the board, rather than storing every drawn line.
The DIMENSION object is now an abstract base, and ALIGNED_DIMENSION
is the implementation that exists today (we will add more dimension
types in the future)
This option removes copper layers from pads and vias where they are not
connected to other board elements. This allows the inner layers to be
more closely routed if the via landing pad is not needed.
Fixes https://gitlab.com/kicad/code/kicad/issues/1835
It's currently only supported in the Footprint Editor. It could be
easily added to the board editor (all the code is there), but the board
editor is a little short on room in the drawing tools toolbar.
Property is a pad info used mainly for fabrication or test.
Currently, supported properties are:
BGA property (variant of SMD pad)
Fiducial (global to the board or local to the footprint)
Test Point
Heat sink
Castellated.
And are used in Gerber files (copper layers and drill files)
Increment BOARD_FILE_VERSION to 20200104
The pin name defined in Eeschema is now available as pad info.
Useful for the board designer (the pin function is displayed in the message panel).
Needed for the Gerber P&P files.