ADDED zone_connection constraint.
ADDED thermal_relief_gap and thermal_spoke_width constraints.
ADDED angle override for thermal relief spokes in Pad Properties.
Fixes https://gitlab.com/kicad/code/kicad/issues/4067
These objects can now be used in advanced DRC rules and
not just for keeping things out. Also remove the restriction
that at least one of the "basic" keepout rules must be set,
so that these areas can be used for more advanced rules.
CHANGED: Settings are now stored in versioned sub-directories
ADDED: First-run dialog for migrating settings from a previous version
CHANGED: Settings are now stored as JSON files instead of wxConfig-style INI files
CHANGED: Color settings are now all stored in a separate settings file
CHANGED: The symbol editor and footprint editor now have their own settings files
CHANGED: Color settings are no longer exposed through BOARD object
CHANGED: Page layout editor now uses Eeschema's color scheme
Settings are now managed through a central SETTINGS_MANAGER held by PGM_BASE.
Existing settings will be migrated from the wxConfig format on first run of each application.
Per-application settings are now stored in one class for each application.
Also includes a bunch of changes to simplifiy the terminology
and unify the copper, non-copper and keepout versions.
Also removes some legacy features:
Removes contol for fill method. If the fill method is currently
segments the dialog will ask if you want to convert to polygons
on OK.
Removes control of boundary resolution. We've done this with trig
since 5.0.
(cherry picked from commit 487aaeb)
* Cleanup namespace in enum ZoneConnection in pcbnew/zones.h to self-explained names unification: PAD_ZONE_CONN_INHERITED, PAD_ZONE_CONN_NONE,PAD_ZONE_CONN_THERMAL,PAD_ZONE_CONN_FULL, PAD_ZONE_CONN_THT_THERMAL
This is *a work in progress*, so some features are missing, and/or could be modified.
Mainly keepout zones are not yet exported to autorouters, and pads are not taken in account.
Some code cleanup in polygon.*