/** * @file zones_convert_brd_items_to_polygons_with_Boost.cpp */ /* * This program source code file is part of KiCad, a free EDA CAD application. * * Copyright (C) 2012 Jean-Pierre Charras, jean-pierre.charras@ujf-grenoble.fr * Copyright (C) 1992-2012 KiCad Developers, see AUTHORS.txt for contributors. * * This program is free software; you can redistribute it and/or * modify it under the terms of the GNU General Public License * as published by the Free Software Foundation; either version 2 * of the License, or (at your option) any later version. * * This program is distributed in the hope that it will be useful, * but WITHOUT ANY WARRANTY; without even the implied warranty of * MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the * GNU General Public License for more details. * * You should have received a copy of the GNU General Public License * along with this program; if not, you may find one here: * http://www.gnu.org/licenses/old-licenses/gpl-2.0.html * or you may search the http://www.gnu.org website for the version 2 license, * or you may write to the Free Software Foundation, Inc., * 51 Franklin Street, Fifth Floor, Boston, MA 02110-1301, USA */ /* Functions to convert some board items to polygons * (pads, tracks ..) * This is used to calculate filled areas in copper zones. * Filled areas are areas remainder of the full zone area after removed all polygons * calculated from these items shapes and the clearance area * * Important note: * Because filled areas must have a minimum thickness to match with Design rule, they are * draw in 2 step: * 1 - filled polygons are drawn * 2 - polygon outlines are drawn with a "minimum thickness width" ( or with a minimum * thickness pen ) * So outlines of filled polygons are calculated with the constraint they match with clearance, * taking in account outlines have thickness * This ensures: * - areas meet the minimum thickness requirement. * - shapes are smoothed. */ #include #include #include #include #include #include #include #include #include #include #include #include #include #include #include #include #include #include #include extern void BuildUnconnectedThermalStubsPolygonList( SHAPE_POLY_SET& aCornerBuffer, BOARD* aPcb, ZONE_CONTAINER* aZone, double aArcCorrection, double aRoundPadThermalRotation); extern void Test_For_Copper_Island_And_Remove( BOARD* aPcb, ZONE_CONTAINER* aZone_container ); extern void CreateThermalReliefPadPolygon( SHAPE_POLY_SET& aCornerBuffer, D_PAD& aPad, int aThermalGap, int aCopperThickness, int aMinThicknessValue, int aCircleToSegmentsCount, double aCorrectionFactor, double aThermalRot ); // Local Variables: static double s_thermalRot = 450; // angle of stubs in thermal reliefs for round pads void ZONE_CONTAINER::buildFeatureHoleList( BOARD* aPcb, SHAPE_POLY_SET& aFeatures ) { int segsPerCircle; double correctionFactor; // Set the number of segments in arc approximations if( m_ArcToSegmentsCount == ARC_APPROX_SEGMENTS_COUNT_HIGHT_DEF ) segsPerCircle = ARC_APPROX_SEGMENTS_COUNT_HIGHT_DEF; else segsPerCircle = ARC_APPROX_SEGMENTS_COUNT_LOW_DEF; /* calculates the coeff to compensate radius reduction of holes clearance * due to the segment approx. * For a circle the min radius is radius * cos( 2PI / s_CircleToSegmentsCount / 2) * s_Correction is 1 /cos( PI/s_CircleToSegmentsCount ) */ correctionFactor = 1.0 / cos( M_PI / (double) segsPerCircle ); aFeatures.RemoveAllContours(); int outline_half_thickness = m_ZoneMinThickness / 2; int zone_clearance = std::max( m_ZoneClearance, GetClearance() ); zone_clearance += outline_half_thickness; /* store holes (i.e. tracks and pads areas as polygons outlines) * in a polygon list */ /* items ouside the zone bounding box are skipped * the bounding box is the zone bounding box + the biggest clearance found in Netclass list */ EDA_RECT item_boundingbox; EDA_RECT zone_boundingbox = GetBoundingBox(); int biggest_clearance = aPcb->GetDesignSettings().GetBiggestClearanceValue(); biggest_clearance = std::max( biggest_clearance, zone_clearance ); zone_boundingbox.Inflate( biggest_clearance ); /* * First : Add pads. Note: pads having the same net as zone are left in zone. * Thermal shapes will be created later if necessary */ int item_clearance; /* Use a dummy pad to calculate hole clerance when a pad is not on all copper layers * and this pad has a hole * This dummy pad has the size and shape of the hole * Therefore, this dummy pad is a circle or an oval. * A pad must have a parent because some functions expect a non null parent * to find the parent board, and some other data */ MODULE dummymodule( aPcb ); // Creates a dummy parent D_PAD dummypad( &dummymodule ); for( MODULE* module = aPcb->m_Modules; module; module = module->Next() ) { D_PAD* nextpad; for( D_PAD* pad = module->Pads(); pad != NULL; pad = nextpad ) { nextpad = pad->Next(); // pad pointer can be modified by next code, so // calculate the next pad here if( !pad->IsOnLayer( GetLayer() ) ) { /* Test for pads that are on top or bottom only and have a hole. * There are curious pads but they can be used for some components that are * inside the board (in fact inside the hole. Some photo diodes and Leds are * like this) */ if( pad->GetDrillSize().x == 0 && pad->GetDrillSize().y == 0 ) continue; // Use a dummy pad to calculate a hole shape that have the same dimension as // the pad hole dummypad.SetSize( pad->GetDrillSize() ); dummypad.SetOrientation( pad->GetOrientation() ); dummypad.SetShape( pad->GetDrillShape() == PAD_DRILL_SHAPE_OBLONG ? PAD_SHAPE_OVAL : PAD_SHAPE_CIRCLE ); dummypad.SetPosition( pad->GetPosition() ); pad = &dummypad; } // Note: netcode <=0 means not connected item if( ( pad->GetNetCode() != GetNetCode() ) || ( pad->GetNetCode() <= 0 ) ) { item_clearance = pad->GetClearance() + outline_half_thickness; item_boundingbox = pad->GetBoundingBox(); item_boundingbox.Inflate( item_clearance ); if( item_boundingbox.Intersects( zone_boundingbox ) ) { int clearance = std::max( zone_clearance, item_clearance ); pad->TransformShapeWithClearanceToPolygon( aFeatures, clearance, segsPerCircle, correctionFactor ); } continue; } if( GetPadConnection( pad ) == PAD_ZONE_CONN_NONE ) { int gap = zone_clearance; int thermalGap = GetThermalReliefGap( pad ); gap = std::max( gap, thermalGap ); item_boundingbox = pad->GetBoundingBox(); if( item_boundingbox.Intersects( zone_boundingbox ) ) { pad->TransformShapeWithClearanceToPolygon( aFeatures, gap, segsPerCircle, correctionFactor ); } } } } /* Add holes (i.e. tracks and vias areas as polygons outlines) * in cornerBufferPolysToSubstract */ for( TRACK* track = aPcb->m_Track; track; track = track->Next() ) { if( !track->IsOnLayer( GetLayer() ) ) continue; if( track->GetNetCode() == GetNetCode() && (GetNetCode() != 0) ) continue; item_clearance = track->GetClearance() + outline_half_thickness; item_boundingbox = track->GetBoundingBox(); if( item_boundingbox.Intersects( zone_boundingbox ) ) { int clearance = std::max( zone_clearance, item_clearance ); track->TransformShapeWithClearanceToPolygon( aFeatures, clearance, segsPerCircle, correctionFactor ); } } /* Add module edge items that are on copper layers * Pcbnew allows these items to be on copper layers in microwave applictions * This is a bad thing, but must be handled here, until a better way is found */ for( MODULE* module = aPcb->m_Modules; module; module = module->Next() ) { for( BOARD_ITEM* item = module->GraphicalItems(); item; item = item->Next() ) { if( !item->IsOnLayer( GetLayer() ) && !item->IsOnLayer( Edge_Cuts ) ) continue; if( item->Type() != PCB_MODULE_EDGE_T ) continue; item_boundingbox = item->GetBoundingBox(); if( item_boundingbox.Intersects( zone_boundingbox ) ) { ( (EDGE_MODULE*) item )->TransformShapeWithClearanceToPolygon( aFeatures, zone_clearance, segsPerCircle, correctionFactor ); } } } // Add graphic items (copper texts) and board edges for( BOARD_ITEM* item = aPcb->m_Drawings; item; item = item->Next() ) { if( item->GetLayer() != GetLayer() && item->GetLayer() != Edge_Cuts ) continue; switch( item->Type() ) { case PCB_LINE_T: ( (DRAWSEGMENT*) item )->TransformShapeWithClearanceToPolygon( aFeatures, zone_clearance, segsPerCircle, correctionFactor ); break; case PCB_TEXT_T: ( (TEXTE_PCB*) item )->TransformBoundingBoxWithClearanceToPolygon( aFeatures, zone_clearance ); break; default: break; } } // Add zones outlines having an higher priority and keepout for( int ii = 0; ii < GetBoard()->GetAreaCount(); ii++ ) { ZONE_CONTAINER* zone = GetBoard()->GetArea( ii ); if( zone->GetLayer() != GetLayer() ) continue; if( !zone->GetIsKeepout() && zone->GetPriority() <= GetPriority() ) continue; if( zone->GetIsKeepout() && ! zone->GetDoNotAllowCopperPour() ) continue; // A highter priority zone or keepout area is found: remove this area item_boundingbox = zone->GetBoundingBox(); if( !item_boundingbox.Intersects( zone_boundingbox ) ) continue; // Add the zone outline area. // However if the zone has the same net as the current zone, // do not add any clearance. // the zone will be connected to the current zone, but filled areas // will use different parameters (clearance, thermal shapes ) bool same_net = GetNetCode() == zone->GetNetCode(); bool use_net_clearance = true; int min_clearance = zone_clearance; // Do not forget to make room to draw the thick outlines // of the hole created by the area of the zone to remove int holeclearance = zone->GetClearance() + outline_half_thickness; // The final clearance is obviously the max value of each zone clearance min_clearance = std::max( min_clearance, holeclearance ); if( zone->GetIsKeepout() || same_net ) { // Just take in account the fact the outline has a thickness, so // the actual area to substract is inflated to take in account this fact min_clearance = outline_half_thickness; use_net_clearance = false; } zone->TransformOutlinesShapeWithClearanceToPolygon( aFeatures, min_clearance, use_net_clearance ); } // Remove thermal symbols for( MODULE* module = aPcb->m_Modules; module; module = module->Next() ) { for( D_PAD* pad = module->Pads(); pad != NULL; pad = pad->Next() ) { // Rejects non-standard pads with tht-only thermal reliefs if( GetPadConnection( pad ) == PAD_ZONE_CONN_THT_THERMAL && pad->GetAttribute() != PAD_ATTRIB_STANDARD ) continue; if( GetPadConnection( pad ) != PAD_ZONE_CONN_THERMAL && GetPadConnection( pad ) != PAD_ZONE_CONN_THT_THERMAL ) continue; if( !pad->IsOnLayer( GetLayer() ) ) continue; if( pad->GetNetCode() != GetNetCode() ) continue; item_boundingbox = pad->GetBoundingBox(); int thermalGap = GetThermalReliefGap( pad ); item_boundingbox.Inflate( thermalGap, thermalGap ); if( item_boundingbox.Intersects( zone_boundingbox ) ) { CreateThermalReliefPadPolygon( aFeatures, *pad, thermalGap, GetThermalReliefCopperBridge( pad ), m_ZoneMinThickness, segsPerCircle, correctionFactor, s_thermalRot ); } } } } /** * Function AddClearanceAreasPolygonsToPolysList * Supports a min thickness area constraint. * Add non copper areas polygons (pads and tracks with clearance) * to the filled copper area found * in BuildFilledPolysListData after calculating filled areas in a zone * Non filled copper areas are pads and track and their clearance areas * The filled copper area must be computed just before. * BuildFilledPolysListData() call this function just after creating the * filled copper area polygon (without clearance areas) * to do that this function: * 1 - Creates the main outline (zone outline) using a correction to shrink the resulting area * with m_ZoneMinThickness/2 value. * The result is areas with a margin of m_ZoneMinThickness/2 * When drawing outline with segments having a thickness of m_ZoneMinThickness, the * outlines will match exactly the initial outlines * 3 - Add all non filled areas (pads, tracks) in group B with a clearance of m_Clearance + * m_ZoneMinThickness/2 * in a buffer * - If Thermal shapes are wanted, add non filled area, in order to create these thermal shapes * 4 - calculates the polygon A - B * 5 - put resulting list of polygons (filled areas) in m_FilledPolysList * This zone contains pads with the same net. * 6 - Remove insulated copper islands * 7 - If Thermal shapes are wanted, remove unconnected stubs in thermal shapes: * creates a buffer of polygons corresponding to stubs to remove * sub them to the filled areas. * Remove new insulated copper islands */ void ZONE_CONTAINER::AddClearanceAreasPolygonsToPolysList_NG( BOARD* aPcb ) { int segsPerCircle; double correctionFactor; int outline_half_thickness = m_ZoneMinThickness / 2; std::auto_ptr dumper( new SHAPE_FILE_IO( g_DumpZonesWhenFilling ? "zones_dump.txt" : "", SHAPE_FILE_IO::IOM_APPEND ) ); // Set the number of segments in arc approximations if( m_ArcToSegmentsCount == ARC_APPROX_SEGMENTS_COUNT_HIGHT_DEF ) segsPerCircle = ARC_APPROX_SEGMENTS_COUNT_HIGHT_DEF; else segsPerCircle = ARC_APPROX_SEGMENTS_COUNT_LOW_DEF; /* calculates the coeff to compensate radius reduction of holes clearance * due to the segment approx. * For a circle the min radius is radius * cos( 2PI / s_CircleToSegmentsCount / 2) * s_Correction is 1 /cos( PI/s_CircleToSegmentsCount ) */ correctionFactor = 1.0 / cos( M_PI / (double) segsPerCircle ); CPOLYGONS_LIST tmp; if(g_DumpZonesWhenFilling) dumper->BeginGroup("clipper-zone"); SHAPE_POLY_SET solidAreas = ConvertPolyListToPolySet( m_smoothedPoly->m_CornersList ); solidAreas.Inflate( -outline_half_thickness, segsPerCircle ); solidAreas.Simplify(); SHAPE_POLY_SET holes; if(g_DumpZonesWhenFilling) dumper->Write( &solidAreas, "solid-areas" ); tmp.RemoveAllContours(); buildFeatureHoleList( aPcb, holes ); if(g_DumpZonesWhenFilling) dumper->Write( &holes, "feature-holes" ); holes.Simplify(); if (g_DumpZonesWhenFilling) dumper->Write( &holes, "feature-holes-postsimplify" ); solidAreas.BooleanSubtract( holes ); if (g_DumpZonesWhenFilling) dumper->Write( &solidAreas, "solid-areas-minus-holes" ); SHAPE_POLY_SET fractured = solidAreas; fractured.Fracture(); if (g_DumpZonesWhenFilling) dumper->Write( &fractured, "fractured" ); m_FilledPolysList = fractured; // Remove insulated islands: if( GetNetCode() > 0 ) TestForCopperIslandAndRemoveInsulatedIslands( aPcb ); SHAPE_POLY_SET thermalHoles; // Test thermal stubs connections and add polygons to remove unconnected stubs. // (this is a refinement for thermal relief shapes) if( GetNetCode() > 0 ) BuildUnconnectedThermalStubsPolygonList( thermalHoles, aPcb, this, correctionFactor, s_thermalRot ); // remove copper areas corresponding to not connected stubs if( !thermalHoles.IsEmpty() ) { thermalHoles.Simplify(); // Remove unconnected stubs solidAreas.BooleanSubtract( thermalHoles ); if( g_DumpZonesWhenFilling ) dumper->Write( &thermalHoles, "thermal-holes" ); // put these areas in m_FilledPolysList SHAPE_POLY_SET fractured = solidAreas; fractured.Fracture(); if( g_DumpZonesWhenFilling ) dumper->Write ( &fractured, "fractured" ); m_FilledPolysList = fractured; if( GetNetCode() > 0 ) TestForCopperIslandAndRemoveInsulatedIslands( aPcb ); } if(g_DumpZonesWhenFilling) dumper->EndGroup(); } void ZONE_CONTAINER::AddClearanceAreasPolygonsToPolysList( BOARD* aPcb ) { }