(footprint "Espressif ESP32-WROOM-32" (version 20220308) (generator pcbnew)
  (layer "F.Cu")
  (descr "39-SMD Module")
  (fp_text reference "REF**" (at 0 0) (layer "F.SilkS")
      (effects (font (size 1.27 1.27) (thickness 0.15)))
    (tstamp 04716587-a44e-418d-ba57-60afa7c0605e)
  )
  (fp_text value "Espressif ESP32-WROOM-32" (at 0 0) (layer "F.SilkS")
      (effects (font (size 1.27 1.27) (thickness 0.15)))
    (tstamp 42ff79f5-7aba-4233-be21-4072d4762c22)
  )
  (fp_rect (start -4 3) (end 2 -3)
    (stroke (width 0) (type default)) (fill solid) (layer "F.Cu") (tstamp 4af93b7f-4d56-4dd6-8b00-fbfc2a1f8cef))
  (fp_rect (start -4 3) (end 2 -3)
    (stroke (width 0) (type default)) (fill solid) (layer "B.Cu") (tstamp 226a922f-5ac2-439b-a85a-8f1e92b1c5fa))
  (fp_line (start -9 -15) (end 9 -15)
    (stroke (width 0.2) (type solid)) (layer "F.SilkS") (tstamp 51f3d9d7-479c-459d-8df1-2e59f12da1f0))
  (fp_line (start -9 -8.3) (end -9 -15)
    (stroke (width 0.2) (type solid)) (layer "F.SilkS") (tstamp 12b20531-f70d-425e-aa6b-9f8c1dc05208))
  (fp_line (start -9 10.5) (end -9 9.6)
    (stroke (width 0.2) (type solid)) (layer "F.SilkS") (tstamp 47531507-ee9d-4c3f-8806-390d7f3631d2))
  (fp_line (start -9 10.5) (end -6.4 10.5)
    (stroke (width 0.2) (type solid)) (layer "F.SilkS") (tstamp 256ea15b-8858-4372-812f-a1876e96250a))
  (fp_line (start 6.4 10.5) (end 9 10.5)
    (stroke (width 0.2) (type solid)) (layer "F.SilkS") (tstamp de1b4a89-62ac-4fd3-b54c-5043156a6d87))
  (fp_line (start 9 -8.3) (end 9 -15)
    (stroke (width 0.2) (type solid)) (layer "F.SilkS") (tstamp 18180f33-f49e-4c81-ba1c-70cdc7e98126))
  (fp_line (start 9 10.5) (end 9 9.6)
    (stroke (width 0.2) (type solid)) (layer "F.SilkS") (tstamp 19193437-c06a-480c-b1cd-bc034912a3cc))
  (fp_circle (center -10.4648 -7.62) (end -10.4648 -7.87)
    (stroke (width 0.75) (type solid)) (fill none) (layer "F.SilkS") (tstamp 93aec781-9154-453b-9543-70ddd0ef21fb))
  (fp_line (start -9.7 -15.2) (end 9.7 -15.2)
    (stroke (width 0.05) (type solid)) (layer "Eco2.User") (tstamp 53d636c0-d779-477e-bcc1-0f4fec21faf9))
  (fp_line (start -9.7 11.2) (end -9.7 -15.2)
    (stroke (width 0.05) (type solid)) (layer "Eco2.User") (tstamp e3788626-21d5-4a01-b4d2-0008805cb618))
  (fp_line (start -9.7 11.2) (end 9.7 11.2)
    (stroke (width 0.05) (type solid)) (layer "Eco2.User") (tstamp 0921b09f-b713-4233-9a1b-9196bdd42a5f))
  (fp_line (start -0.5 -0.001) (end 0.5 -0.001)
    (stroke (width 0.05) (type solid)) (layer "Eco2.User") (tstamp a866eb7c-5c72-495b-a9ae-87d9107a0e89))
  (fp_line (start 0 0.499) (end 0 -0.501)
    (stroke (width 0.05) (type solid)) (layer "Eco2.User") (tstamp 61c2e5e7-c8a6-40b6-ad8a-380fcca5b46b))
  (fp_line (start 9.7 11.2) (end 9.7 -15.2)
    (stroke (width 0.05) (type solid)) (layer "Eco2.User") (tstamp 2cf9c3f1-0d50-48cb-ab20-2dde6aa507ea))
  (fp_line (start -9 -15) (end 9 -15)
    (stroke (width 0.1) (type solid)) (layer "B.Fab") (tstamp 1c0ca95e-1ebf-4fcc-b5f0-fb87d0329255))
  (fp_line (start -9 10.5) (end -9 -15)
    (stroke (width 0.1) (type solid)) (layer "B.Fab") (tstamp c02f0c67-be29-4695-acb9-81afacbcd384))
  (fp_line (start -9 10.5) (end 9 10.5)
    (stroke (width 0.1) (type solid)) (layer "B.Fab") (tstamp e46dd247-41ab-4a11-88ca-2cd335bf69f8))
  (fp_line (start 9 10.5) (end 9 -15)
    (stroke (width 0.1) (type solid)) (layer "B.Fab") (tstamp fa4189a4-5ba5-44e0-8ed3-4dc58a3055a6))
  (fp_circle (center -7.9 -7.6) (end -7.9 -8.1)
    (stroke (width 0.1) (type solid)) (fill none) (layer "B.Fab") (tstamp 603fc6dd-4690-4fc8-8b44-56d17ed63c5e))
  (pad "1" smd roundrect (at -8.5 -7.51) (size 2 0.9) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.05)
    (solder_mask_margin 0.05) (thermal_bridge_angle 45) (tstamp 6686c5fd-67b3-4c26-a60c-b979aa371890))
  (pad "2" smd roundrect (at -8.5 -6.24) (size 2 0.9) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.05)
    (solder_mask_margin 0.05) (thermal_bridge_angle 45) (tstamp 706b9dd2-3531-464e-accb-a6626ab67dbc))
  (pad "3" smd roundrect (at -8.5 -4.97) (size 2 0.9) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.05)
    (solder_mask_margin 0.05) (thermal_bridge_angle 45) (tstamp b3540e45-a8cd-4dc7-8320-bbe8c718bdc3))
  (pad "4" smd roundrect (at -8.5 -3.7) (size 2 0.9) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.05)
    (solder_mask_margin 0.05) (thermal_bridge_angle 45) (tstamp 09a01d93-288f-4506-a562-b85215b34258))
  (pad "5" smd roundrect (at -8.5 -2.43) (size 2 0.9) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.05)
    (solder_mask_margin 0.05) (thermal_bridge_angle 45) (tstamp 694fd5f4-c111-44b1-b42c-1b87063c8ba5))
  (pad "6" smd roundrect (at -8.5 -1.16) (size 2 0.9) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.05)
    (solder_mask_margin 0.05) (thermal_bridge_angle 45) (tstamp 0887c206-3a66-4b5e-82d7-7c21128b49d4))
  (pad "7" smd roundrect (at -8.5 0.11) (size 2 0.9) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.05)
    (solder_mask_margin 0.05) (thermal_bridge_angle 45) (tstamp 9e15554b-96c3-44f9-8766-e34e18f4ddac))
  (pad "8" smd roundrect (at -8.5 1.38) (size 2 0.9) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.05)
    (solder_mask_margin 0.05) (thermal_bridge_angle 45) (tstamp 71325b6b-d379-4e71-8141-87a630c26595))
  (pad "9" smd roundrect (at -8.5 2.65) (size 2 0.9) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.05)
    (solder_mask_margin 0.05) (thermal_bridge_angle 45) (tstamp 0f50dd5f-d876-4d43-ac7b-6e954bac87c9))
  (pad "10" smd roundrect (at -8.5 3.92) (size 2 0.9) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.05)
    (solder_mask_margin 0.05) (thermal_bridge_angle 45) (tstamp 0fd0a8e5-ed02-4447-873f-d5ab65d011c1))
  (pad "11" smd roundrect (at -8.5 5.19 180) (size 2 0.9) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.05)
    (solder_mask_margin 0.05) (thermal_bridge_angle 45) (tstamp 15a4c1d4-79e8-4410-9a73-87109bcb7f5c))
  (pad "12" smd roundrect (at -8.5 6.46 180) (size 2 0.9) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.05)
    (solder_mask_margin 0.05) (thermal_bridge_angle 45) (tstamp f548aee8-7faa-4c61-b7a3-1d37f296e1b4))
  (pad "13" smd roundrect (at -8.5 7.73 180) (size 2 0.9) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.05)
    (solder_mask_margin 0.05) (thermal_bridge_angle 45) (tstamp 0c2378e7-98b6-4341-a606-7013471a0b87))
  (pad "14" smd roundrect (at -8.5 9 180) (size 2 0.9) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.05)
    (solder_mask_margin 0.05) (thermal_bridge_angle 45) (tstamp 60a2b3b7-beef-4c20-99f6-d269a14e54d2))
  (pad "15" smd roundrect (at -5.715 10 270) (size 2 0.9) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.05)
    (solder_mask_margin 0.05) (thermal_bridge_angle 45) (tstamp 7ab03288-9a32-4011-99c1-1d80fbbcd678))
  (pad "16" smd roundrect (at -4.445 10 90) (size 2 0.9) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.05)
    (solder_mask_margin 0.05) (thermal_bridge_angle 45) (tstamp bc947ef2-1a25-4fc3-90a8-e452619c96c9))
  (pad "17" smd roundrect (at -3.175 10 90) (size 2 0.9) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.05)
    (solder_mask_margin 0.05) (thermal_bridge_angle 45) (tstamp 18b5c696-1093-40c2-b2ef-33cde1543082))
  (pad "18" smd roundrect (at -1.905 10 90) (size 2 0.9) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.05)
    (solder_mask_margin 0.05) (thermal_bridge_angle 45) (tstamp 8affbbfc-7a19-4367-8cbf-abdf4e25dcaa))
  (pad "19" smd roundrect (at -0.635 10 90) (size 2 0.9) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.05)
    (solder_mask_margin 0.05) (thermal_bridge_angle 45) (tstamp 26ba2f46-130d-4a69-ac1f-d3ba99b6ab50))
  (pad "20" smd roundrect (at 0.635 10 90) (size 2 0.9) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.05)
    (solder_mask_margin 0.05) (thermal_bridge_angle 45) (tstamp 69b756a3-12a8-42b0-8021-0e5a4af9ef03))
  (pad "21" smd roundrect (at 1.905 10 90) (size 2 0.9) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.05)
    (solder_mask_margin 0.05) (thermal_bridge_angle 45) (tstamp a3d0b657-8288-4493-8b1a-0f7c5cf670c8))
  (pad "22" smd roundrect (at 3.175 10 90) (size 2 0.9) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.05)
    (solder_mask_margin 0.05) (thermal_bridge_angle 45) (tstamp afc5f493-e4c7-4a7e-91ca-7829b912a44e))
  (pad "23" smd roundrect (at 4.445 10 90) (size 2 0.9) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.05)
    (solder_mask_margin 0.05) (thermal_bridge_angle 45) (tstamp 18824509-dd9a-4fc2-8c0e-e217ed58e26e))
  (pad "24" smd roundrect (at 5.715 10 90) (size 2 0.9) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.05)
    (solder_mask_margin 0.05) (thermal_bridge_angle 45) (tstamp 86d2adea-a062-4d19-91e5-ed0affac8199))
  (pad "25" smd roundrect (at 8.5 9) (size 2 0.9) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.05)
    (solder_mask_margin 0.05) (thermal_bridge_angle 45) (tstamp 59d13ece-c564-4c59-bfd9-780db895bcc2))
  (pad "26" smd roundrect (at 8.5 7.73) (size 2 0.9) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.05)
    (solder_mask_margin 0.05) (thermal_bridge_angle 45) (tstamp d84d5d47-57a7-42ec-b083-1ded8201a6ac))
  (pad "27" smd roundrect (at 8.5 6.46) (size 2 0.9) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.05)
    (solder_mask_margin 0.05) (thermal_bridge_angle 45) (tstamp be51fd1f-bf89-42bd-97b2-4dab1b586650))
  (pad "28" smd roundrect (at 8.5 5.19) (size 2 0.9) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.05)
    (solder_mask_margin 0.05) (thermal_bridge_angle 45) (tstamp 2d911663-0d4a-4001-a82d-07da47674458))
  (pad "29" smd roundrect (at 8.5 3.92) (size 2 0.9) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.05)
    (solder_mask_margin 0.05) (thermal_bridge_angle 45) (tstamp bf36e9d5-29fc-4979-9020-81e493e3b1c6))
  (pad "30" smd roundrect (at 8.5 2.65) (size 2 0.9) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.05)
    (solder_mask_margin 0.05) (thermal_bridge_angle 45) (tstamp ee9cca1e-67e0-423d-81dd-8e074c191193))
  (pad "31" smd rect (at 8.5 1.38) (size 2 0.9) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.05) (thermal_bridge_angle 45) (tstamp 098109b6-bfed-41e1-9593-bddad016ea18))
  (pad "32" smd rect (at 8.5 0.11) (size 2 0.9) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.05) (thermal_bridge_angle 45) (tstamp 70e27f74-f7b1-45cd-a08a-ab1763b1011f))
  (pad "33" smd rect (at 8.5 -1.16) (size 2 0.9) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.05) (thermal_bridge_angle 45) (tstamp 21abc1b5-4c19-42cf-97fb-c6c42a0b3939))
  (pad "34" smd rect (at 8.5 -2.43) (size 2 0.9) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.05) (thermal_bridge_angle 45) (tstamp 2a9dc246-15a7-4c3b-a212-00808becdc42))
  (pad "35" smd rect (at 8.5 -3.7) (size 2 0.9) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.05) (thermal_bridge_angle 45) (tstamp 97207351-f8d4-4db3-9d58-7a9819e97ecc))
  (pad "36" smd rect (at 8.5 -4.97) (size 2 0.9) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.05) (thermal_bridge_angle 45) (tstamp 84172753-dc4b-4e2f-8009-fedcb93b8b2e))
  (pad "37" smd rect (at 8.5 -6.24) (size 2 0.9) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.05) (thermal_bridge_angle 45) (tstamp 4725caf9-fd3b-453d-bc25-8fa970919cfc))
  (pad "38" smd rect (at 8.5 -7.51) (size 2 0.9) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.05) (thermal_bridge_angle 45) (tstamp 197ee073-8df2-40ec-bccc-00e85fb1ca6e))
  (pad "39" smd rect (at -2.835 -1.835) (size 1.33 1.33) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.05) (thermal_bridge_angle 45) (tstamp 0fcc6589-13d0-41b2-aeda-e70f5127a2c7))
  (pad "39" smd rect (at -2.835 0 90) (size 1.33 1.33) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.05) (thermal_bridge_angle 45) (tstamp 1009eeb8-4be8-49ff-871d-1e30079ffe54))
  (pad "39" smd rect (at -2.835 1.835 180) (size 1.33 1.33) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.05) (thermal_bridge_angle 45) (tstamp f21e0d2f-30e3-44a7-b089-f9815487c7f8))
  (pad "39" smd rect (at -1.000003 0) (size 1.33 1.33) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.05) (thermal_bridge_angle 45) (tstamp 047aa3bb-6884-4df5-83ed-7ea551b329b1))
  (pad "39" smd rect (at -1 -1.835) (size 1.33 1.33) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.05) (thermal_bridge_angle 45) (tstamp c35a9928-3453-4c10-b581-c909a87ff023))
  (pad "39" smd rect (at -1 1.835 180) (size 1.33 1.33) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.05) (thermal_bridge_angle 45) (tstamp c91644e3-e2e9-476e-bec0-d28e2c21a011))
  (pad "39" smd rect (at 0.835 -1.835) (size 1.33 1.33) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.05) (thermal_bridge_angle 45) (tstamp 8774f0a1-1469-43a9-96cb-2dc2471a56a4))
  (pad "39" smd rect (at 0.835 0 270) (size 1.33 1.33) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.05) (thermal_bridge_angle 45) (tstamp f57881b5-c9c9-4bcf-be4b-dd8cfd505873))
  (pad "39" smd rect (at 0.835 1.835 180) (size 1.33 1.33) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.05) (thermal_bridge_angle 45) (tstamp 7c70a95d-e021-4338-a3de-d7656880600e))
  (zone (net 0) (net_name "") (layers *.Cu) (tstamp da4ad6f3-5f0a-4c19-ae8d-5aa0f1ec37b7) (hatch edge 0.508)
    (connect_pads (clearance 0))
    (min_thickness 0.254) (filled_areas_thickness no)
    (keepout (tracks not_allowed) (vias not_allowed) (pads not_allowed ) (copperpour not_allowed) (footprints allowed))
    (fill (thermal_gap 0.508) (thermal_bridge_width 0.508) (island_removal_mode 2) (island_area_min 10))
    (polygon
      (pts
        (xy -9 -15)
        (xy 9 -15)
        (xy 9 -8.7)
        (xy -9 -8.7)
      )
    )
  )
)