/* * This program source code file is part of KiCad, a free EDA CAD application. * * Copyright (C) 2016 Cirilo Bernardo * Copyright (C) 2021-2023 KiCad Developers, see AUTHORS.txt for contributors. * * This program is free software; you can redistribute it and/or * modify it under the terms of the GNU General Public License * as published by the Free Software Foundation; either version 2 * of the License, or (at your option) any later version. * * This program is distributed in the hope that it will be useful, * but WITHOUT ANY WARRANTY; without even the implied warranty of * MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the * GNU General Public License for more details. * * You should have received a copy of the GNU General Public License * along with this program; if not, you may find one here: * http://www.gnu.org/licenses/old-licenses/gpl-2.0.html * or you may search the http://www.gnu.org website for the version 2 license, * or you may write to the Free Software Foundation, Inc., * 51 Franklin Street, Fifth Floor, Boston, MA 02110-1301, USA */ #ifndef OCE_VIS_OCE_UTILS_H #define OCE_VIS_OCE_UTILS_H #include #include #include #include #include #include #include #include #include #include #include #include #include #include /** * Default distance between points to treat them as separate ones (mm) * 0.001 mm or less is a reasonable value. A too large value creates issues by * merging points that should be different. * Remember we are a 3D space, so a thin shape can be broken if 2 points * are merged (in X, Y, Z coords) when they should not. * round shapes converted to polygon can also be not good with a to large value */ static constexpr double OCC_MAX_DISTANCE_TO_MERGE_POINTS = 0.001; // default PCB thickness in mm static constexpr double BOARD_THICKNESS_DEFAULT_MM = 1.6; // minimum PCB thickness in mm (10 microns assumes a very thin polyimide film) // must be > OCC_MAX_DISTANCE_TO_MERGE_POINTS static constexpr double BOARD_THICKNESS_MIN_MM = 0.01; // default copper thickness in mm // must be > OCC_MAX_DISTANCE_TO_MERGE_POINTS static constexpr double COPPER_THICKNESS_DEFAULT_MM = 0.035; // Max error to approximate an arc by segments (in mm) static constexpr double ARC_TO_SEGMENT_MAX_ERROR_MM = 0.005; class PAD; typedef std::pair< std::string, TDF_Label > MODEL_DATUM; typedef std::map< std::string, TDF_Label > MODEL_MAP; extern void ReportMessage( const wxString& aMessage ); class STEP_PCB_MODEL { public: STEP_PCB_MODEL( const wxString& aPcbName ); virtual ~STEP_PCB_MODEL(); // add a pad hole or slot (must be in final position) bool AddPadHole( const PAD* aPad, const VECTOR2D& aOrigin ); // add a pad/via shape (must be in final position) bool AddPadShape( const PAD* aPad, const VECTOR2D& aOrigin ); // add a set of polygons (must be in final position) on top or bottom of the board as copper bool AddCopperPolygonShapes( const SHAPE_POLY_SET* aPolyShapes, bool aOnTop, const VECTOR2D& aOrigin ); // add a component at the given position and orientation bool AddComponent( const std::string& aFileName, const std::string& aRefDes, bool aBottom, VECTOR2D aPosition, double aRotation, VECTOR3D aOffset, VECTOR3D aOrientation, VECTOR3D aScale, bool aSubstituteModels = true ); void SetBoardColor( double r, double g, double b ); void SetCopperColor( double r, double g, double b ); // set the thickness of the PCB (mm); the top of the PCB shall be at Z = aThickness // aThickness < 0.0 == use default thickness // aThickness <= THICKNESS_MIN == use THICKNESS_MIN // aThickness > THICKNESS_MIN == use aThickness void SetPCBThickness( double aThickness ); // Set the max distance (in mm) to consider 2 points have the same coordinates // and can be merged void OCCSetMergeMaxDistance( double aDistance = OCC_MAX_DISTANCE_TO_MERGE_POINTS ); void SetMaxError( int aMaxError ) { m_maxError = aMaxError; } // create the PCB model using the current outlines and drill holes bool CreatePCB( SHAPE_POLY_SET& aOutline, VECTOR2D aOrigin ); bool MakeShape( TopoDS_Shape& aShape, const SHAPE_LINE_CHAIN& chain, double aThickness, double aZposition, const VECTOR2D& aOrigin ); #ifdef SUPPORTS_IGES // write the assembly model in IGES format bool WriteIGES( const wxString& aFileName ); #endif // write the assembly model in STEP format bool WriteSTEP( const wxString& aFileName ); private: /** * @return true if the board(s) outline is valid. False otherwise */ bool isBoardOutlineValid(); /** create one solid board using current outline and drill holes set * @param aIdx is the main outline index * @param aOutline is the set of outlines with holes * @param aOrigin is the coordinate origin for 3 view */ bool createOneBoard( int aIdx, SHAPE_POLY_SET& aOutline, VECTOR2D aOrigin ); /** * Load a 3D model data. * * @param aFileNameUTF8 is the filename encoded UTF8 (different formats allowed) * but for WRML files a model data can be loaded instead of the vrml data, * not suitable in a step file. * @param aScale is the X,Y,Z scaling factors. * @param aLabel is the TDF_Label to store the data. * @param aSubstituteModels = true to allows data substitution, false to disallow. * @param aErrorMessage (can be nullptr) is an error message to be displayed on error. * @return true if successfully loaded, false on error. */ bool getModelLabel( const std::string& aFileNameUTF8, VECTOR3D aScale, TDF_Label& aLabel, bool aSubstituteModels, wxString* aErrorMessage = nullptr ); bool getModelLocation( bool aBottom, VECTOR2D aPosition, double aRotation, VECTOR3D aOffset, VECTOR3D aOrientation, TopLoc_Location& aLocation ); bool readIGES( Handle( TDocStd_Document )& m_doc, const char* fname ); bool readSTEP( Handle( TDocStd_Document )& m_doc, const char* fname ); TDF_Label transferModel( Handle( TDocStd_Document )& source, Handle( TDocStd_Document ) & dest, VECTOR3D aScale ); Handle( XCAFApp_Application ) m_app; Handle( TDocStd_Document ) m_doc; Handle( XCAFDoc_ShapeTool ) m_assy; TDF_Label m_assy_label; bool m_hasPCB; // set true if CreatePCB() has been invoked std::vector m_pcb_labels; // labels for the PCB model (one by main outline) MODEL_MAP m_models; // map of file names to model labels int m_components; // number of successfully loaded components; double m_precision; // model (length unit) numeric precision double m_angleprec; // angle numeric precision double m_boardColor[3]; // board body, RGB values double m_copperColor[3]; // copper, RGB values double m_boardThickness; // PCB thickness, mm double m_copperThickness; // copper thickness, mm double m_minx; // leftmost curve point double m_mergeOCCMaxDist; // minimum distance (mm) below which two // points are considered coincident by OCC // Holes in main outlines (more than one board) std::vector m_cutouts; // Main outlines (more than one board) std::vector m_board_outlines; /// Name of the PCB, which will most likely be the file name of the path. wxString m_pcbName; int m_maxError; }; #endif // OCE_VIS_OCE_UTILS_H