/* * This program source code file is part of KiCad, a free EDA CAD application. * * Copyright (C) 2019 Jean-Pierre Charras, jp.charras at wanadoo.fr * Copyright (C) 2009-2019 KiCad Developers, see AUTHORS.txt for contributors. * * This program is free software; you can redistribute it and/or * modify it under the terms of the GNU General Public License * as published by the Free Software Foundation; either version 3 * of the License, or (at your option) any later version. * * This program is distributed in the hope that it will be useful, * but WITHOUT ANY WARRANTY; without even the implied warranty of * MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the * GNU General Public License for more details. * * You should have received a copy of the GNU General Public License along * with this program. If not, see . */ #include "class_board_stackup.h" #include #include #include #include #include #include // For _HKI definition #include "stackup_predefined_prms.h" // A reasonable thickness for copper layers: const int copperDefaultThickness = Millimeter2iu( 0.035 ); // A reasonable thickness for solder mask: const int maskDefaultThickness = Millimeter2iu( 0.01 ); BOARD_STACKUP_ITEM::BOARD_STACKUP_ITEM( BOARD_STACKUP_ITEM_TYPE aType ) { m_LayerId = UNDEFINED_LAYER; m_Type = aType; m_DielectricLayerId = 0; m_EpsilonR = 0; m_LossTangent = 0.0; // Initialize parameters to a usual value for allowed types: switch( m_Type ) { case BS_ITEM_TYPE_COPPER: m_TypeName = "copper"; m_Thickness = copperDefaultThickness; break; case BS_ITEM_TYPE_DIELECTRIC: m_TypeName = "core"; // or prepreg m_Material = "FR4"; // or other dielectric name m_DielectricLayerId = 1; m_Thickness = 0; // will be set later m_LossTangent = 0.02; // for FR4 m_EpsilonR = 4.5; // for FR4 break; case BS_ITEM_TYPE_SOLDERPASTE: m_TypeName = "solderpaste"; m_Thickness = 0.0; // Not used break; case BS_ITEM_TYPE_SOLDERMASK: m_TypeName = "soldermask"; m_Color = NOT_SPECIFIED; m_Thickness = maskDefaultThickness; m_EpsilonR = 3.5; m_LossTangent = 0.0; break; case BS_ITEM_TYPE_SILKSCREEN: m_TypeName = "silkscreen"; m_Color = NOT_SPECIFIED; m_Thickness = 0.0; // Not used break; case BS_ITEM_TYPE_UNDEFINED: m_Thickness = 0.0; break; } } BOARD_STACKUP_ITEM::BOARD_STACKUP_ITEM( BOARD_STACKUP_ITEM& aOther ) { m_LayerId = aOther.m_LayerId; m_Type = aOther.m_Type; m_DielectricLayerId = aOther.m_DielectricLayerId; m_TypeName = aOther.m_TypeName; m_Material = aOther.m_Material; m_Color = aOther.m_Color; m_Thickness = aOther.m_Thickness; m_EpsilonR = aOther.m_EpsilonR; m_LossTangent = aOther.m_LossTangent; } bool BOARD_STACKUP_ITEM::HasEpsilonRValue() { return m_Type == BS_ITEM_TYPE_DIELECTRIC || m_Type == BS_ITEM_TYPE_SOLDERMASK; }; bool BOARD_STACKUP_ITEM::HasLossTangentValue() { return m_Type == BS_ITEM_TYPE_DIELECTRIC || m_Type == BS_ITEM_TYPE_SOLDERMASK; }; bool BOARD_STACKUP_ITEM::IsMaterialEditable() { // The material is editable only for dielectric return m_Type == BS_ITEM_TYPE_DIELECTRIC; } bool BOARD_STACKUP_ITEM::IsColorEditable() { return m_Type == BS_ITEM_TYPE_SOLDERMASK || m_Type == BS_ITEM_TYPE_SILKSCREEN; } bool BOARD_STACKUP_ITEM::IsThicknessEditable() { switch( m_Type ) { case BS_ITEM_TYPE_COPPER: return true; case BS_ITEM_TYPE_DIELECTRIC: return true; case BS_ITEM_TYPE_SOLDERMASK: return true; case BS_ITEM_TYPE_SOLDERPASTE: return false; case BS_ITEM_TYPE_SILKSCREEN: return false; default: break; } return false; } BOARD_STACKUP::BOARD_STACKUP() { m_HasDielectricConstrains = false; // True if some dielectric layers have constrains // (Loss tg and Epison R) m_HasThicknessConstrains = false; // True if some dielectric or copper layers have constrains m_EdgeConnectorConstraints = BS_EDGE_CONNECTOR_NONE; m_CastellatedPads = false; // True if some castellated pads exist m_EdgePlating = false; // True if edge board is plated m_FinishType = "None"; // undefined finish type } BOARD_STACKUP::BOARD_STACKUP( BOARD_STACKUP& aOther ) { m_HasDielectricConstrains = aOther.m_HasDielectricConstrains; m_EdgeConnectorConstraints = aOther.m_EdgeConnectorConstraints; m_CastellatedPads = aOther.m_CastellatedPads; m_EdgePlating = aOther.m_EdgePlating; m_FinishType = aOther.m_FinishType; // All items in aOther.m_list have to be duplicated, because aOther.m_list // manage pointers to these items for( auto item : aOther.m_list ) { BOARD_STACKUP_ITEM* dup_item = new BOARD_STACKUP_ITEM( *item ); Add( dup_item ); } } BOARD_STACKUP& BOARD_STACKUP::operator=( const BOARD_STACKUP& aOther ) { m_HasDielectricConstrains = aOther.m_HasDielectricConstrains; m_EdgeConnectorConstraints = aOther.m_EdgeConnectorConstraints; m_CastellatedPads = aOther.m_CastellatedPads; m_EdgePlating = aOther.m_EdgePlating; m_FinishType = aOther.m_FinishType; RemoveAll(); // All items in aOther.m_list have to be duplicated, because aOther.m_list // manage pointers to these items for( auto item : aOther.m_list ) { BOARD_STACKUP_ITEM* dup_item = new BOARD_STACKUP_ITEM( *item ); Add( dup_item ); } return *this; } void BOARD_STACKUP::RemoveAll() { for( auto item : m_list ) delete item; m_list.clear(); } BOARD_STACKUP_ITEM* BOARD_STACKUP::GetStackupLayer( int aIndex ) { if( aIndex < 0 || aIndex >= GetCount() ) return nullptr; return GetList()[aIndex]; } int BOARD_STACKUP::BuildBoardTicknessFromStackup() const { // return the board thickness from the thickness of BOARD_STACKUP_ITEM list int thickness = 0; for( auto item : m_list ) { if( item->IsThicknessEditable() ) thickness += item->m_Thickness; } return thickness; } bool BOARD_STACKUP::SynchronizeWithBoard( BOARD_DESIGN_SETTINGS* aSettings ) { bool change = false; // Build the suitable stackup: BOARD_STACKUP stackup; stackup.BuildDefaultStackupList( aSettings ); // First test for removed layers: for( BOARD_STACKUP_ITEM* old_item: m_list ) { bool found = false; for( BOARD_STACKUP_ITEM* item: stackup.GetList() ) { if( item->m_LayerId == old_item->m_LayerId ) { found = true; break; } } if( !found ) // a layer was removed: a change is found { change = true; break; } } // Now initialize all stackup items to the initial values, when exist for( BOARD_STACKUP_ITEM* item: stackup.GetList() ) { bool found = false; // Search for initial settings: for( BOARD_STACKUP_ITEM* initial_item: m_list ) { if( item->m_LayerId != UNDEFINED_LAYER ) { if( item->m_LayerId == initial_item->m_LayerId ) { *item = *initial_item; found = true; break; } } else // dielectric layer: see m_DielectricLayerId for identification { if( item->m_DielectricLayerId == initial_item->m_DielectricLayerId ) { *item = *initial_item; found = true; break; } } } if( !found ) change = true; } // Transfer other stackup settings from aSettings BOARD_STACKUP& source_stackup = aSettings->GetStackupDescriptor(); m_HasDielectricConstrains = source_stackup.m_HasDielectricConstrains; m_EdgeConnectorConstraints = source_stackup.m_EdgeConnectorConstraints; m_CastellatedPads = source_stackup.m_CastellatedPads; m_EdgePlating = source_stackup.m_EdgePlating; m_FinishType = source_stackup.m_FinishType; *this = stackup; return change; } void BOARD_STACKUP::BuildDefaultStackupList( BOARD_DESIGN_SETTINGS* aSettings ) { // Creates a default stackup, according to the current BOARD_DESIGN_SETTINGS settings. // Note: the m_TypeName string is made translatable using _HKI marker, but is not // translated when building the stackup. // It will be used as this in files, and can be translated only in dialog LSET enabledLayer = aSettings->GetEnabledLayers(); int copperLayerCount = aSettings->GetCopperLayerCount(); double diel_thickness = aSettings->GetBoardThickness() - (copperDefaultThickness * copperLayerCount); diel_thickness /= copperLayerCount - 1; int dielectric_idx = 0; // Add silk screen, solder mask and solder paste layers on top if( enabledLayer[F_SilkS] ) { BOARD_STACKUP_ITEM* item = new BOARD_STACKUP_ITEM( BS_ITEM_TYPE_SILKSCREEN ); item->m_LayerId = F_SilkS; item->m_TypeName = _HKI( "Top Silk Screen" ); Add( item ); } if( enabledLayer[F_Paste] ) { BOARD_STACKUP_ITEM* item = new BOARD_STACKUP_ITEM( BS_ITEM_TYPE_SOLDERPASTE ); item->m_LayerId = F_Paste; item->m_TypeName = _HKI( "Top Solder Paste" ); Add( item ); } if( enabledLayer[F_Mask] ) { BOARD_STACKUP_ITEM* item = new BOARD_STACKUP_ITEM( BS_ITEM_TYPE_SOLDERMASK ); item->m_LayerId = F_Mask; item->m_TypeName = _HKI( "Top Solder Mask" ); Add( item ); } // Add copper and dielectric layers for( int ii = 0; ii < copperLayerCount; ii++ ) { BOARD_STACKUP_ITEM* item = new BOARD_STACKUP_ITEM( BS_ITEM_TYPE_COPPER ); item->m_LayerId = ( PCB_LAYER_ID )ii; Add( item ); if( ii == copperLayerCount-1 ) { item->m_LayerId = B_Cu; break; } // Add the dielectric layer: item = new BOARD_STACKUP_ITEM( BS_ITEM_TYPE_DIELECTRIC ); item->m_Thickness = diel_thickness; item->m_DielectricLayerId = dielectric_idx + 1; // Display a dielectric default layer name: if( (dielectric_idx & 1) == 0 ) { item->m_TypeName = _HKI( "core" ); item->m_Material = "FR4"; } else { item->m_TypeName = _HKI( "prepreg" ); item->m_Material = "FR4"; } Add( item ); dielectric_idx++; } // Add silk screen, solder mask and solder paste layers on bottom if( enabledLayer[B_Mask] ) { BOARD_STACKUP_ITEM* item = new BOARD_STACKUP_ITEM( BS_ITEM_TYPE_SOLDERMASK ); item->m_LayerId = B_Mask; item->m_TypeName = _HKI( "Bottom Solder Mask" ); Add( item ); } if( enabledLayer[B_Paste] ) { BOARD_STACKUP_ITEM* item = new BOARD_STACKUP_ITEM( BS_ITEM_TYPE_SOLDERPASTE ); item->m_LayerId = B_Paste; item->m_TypeName = _HKI( "Bottom Solder Paste" ); Add( item ); } if( enabledLayer[B_SilkS] ) { BOARD_STACKUP_ITEM* item = new BOARD_STACKUP_ITEM( BS_ITEM_TYPE_SILKSCREEN ); item->m_LayerId = B_SilkS; item->m_TypeName = _HKI( "Bottom Silk Screen" ); Add( item ); } // Transfer other stackup settings from aSettings BOARD_STACKUP& source_stackup = aSettings->GetStackupDescriptor(); m_HasDielectricConstrains = source_stackup.m_HasDielectricConstrains; m_EdgeConnectorConstraints = source_stackup.m_EdgeConnectorConstraints; m_CastellatedPads = source_stackup.m_CastellatedPads; m_EdgePlating = source_stackup.m_EdgePlating; m_FinishType = source_stackup.m_FinishType; } void BOARD_STACKUP::FormatBoardStackup( OUTPUTFORMATTER* aFormatter, BOARD* aBoard, int aNestLevel ) const { // Board stackup is the ordered list from top to bottom of // physical layers and substrate used to build the board. if( m_list.empty() ) return; aFormatter->Print( aNestLevel, "(board_stackup\n" ); int nest_level = aNestLevel+1; for( BOARD_STACKUP_ITEM* item: m_list ) { wxString layer_name; if( item->m_LayerId == UNDEFINED_LAYER ) { layer_name.Printf( "dielectric %d", item->m_DielectricLayerId ); } else layer_name = aBoard->GetLayerName( item->m_LayerId ); aFormatter->Print( nest_level, "(layer %s (type %s)", aFormatter->Quotew( layer_name ).c_str(), aFormatter->Quotew( item->m_TypeName ).c_str() ); if( item->IsThicknessEditable() ) aFormatter->Print( 0, " (thickness %s)", FormatInternalUnits( (int)item->m_Thickness ).c_str() ); if( item->m_Type == BS_ITEM_TYPE_DIELECTRIC ) aFormatter->Print( 0, " (material %s)", aFormatter->Quotew( item->m_Material ).c_str() ); if( item->HasEpsilonRValue() ) aFormatter->Print( 0, " (epsilon_r %g)", item->m_EpsilonR ); if( item->HasLossTangentValue() ) aFormatter->Print( 0, " (loss %s)", Double2Str(item->m_LossTangent ).c_str() ); if( item->IsColorEditable() && !item->m_Color.IsEmpty() && item->m_Color != NOT_SPECIFIED ) aFormatter->Print( 0, " (color %s)", aFormatter->Quotew( item->m_Color ).c_str() ); aFormatter->Print( 0, ")\n" ); } // Other infos about board, related to layers and other fabrication specifications if( !m_FinishType.IsEmpty() && m_FinishType != NOT_SPECIFIED ) aFormatter->Print( nest_level, "(copper_finish %s)\n", aFormatter->Quotew( m_FinishType ).c_str() ); aFormatter->Print( nest_level, "(dielectric_constrains %s)\n", m_HasDielectricConstrains ? "yes" : "no" ); if( m_EdgeConnectorConstraints > 0 ) aFormatter->Print( nest_level, "(edge_connector %s)\n", m_EdgeConnectorConstraints > 1 ? "bevelled": "yes" ); if( m_CastellatedPads ) aFormatter->Print( nest_level, "(castellated_pads yes)\n" ); if( m_EdgePlating ) aFormatter->Print( nest_level, "(edge_plating yes)\n" ); aFormatter->Print( aNestLevel, ")\n" ); }