/* * This program source code file is part of KiCad, a free EDA CAD application. * * Copyright (C) 2015-2022 Mario Luzeiro * Copyright (C) 1992-2023 KiCad Developers, see AUTHORS.txt for contributors. * * This program is free software; you can redistribute it and/or * modify it under the terms of the GNU General Public License * as published by the Free Software Foundation; either version 2 * of the License, or (at your option) any later version. * * This program is distributed in the hope that it will be useful, * but WITHOUT ANY WARRANTY; without even the implied warranty of * MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the * GNU General Public License for more details. * * You should have received a copy of the GNU General Public License * along with this program; if not, you may find one here: * http://www.gnu.org/licenses/old-licenses/gpl-2.0.html * or you may search the http://www.gnu.org website for the version 2 license, * or you may write to the Free Software Foundation, Inc., * 51 Franklin Street, Fifth Floor, Boston, MA 02110-1301, USA */ #include "../3d_rendering/camera.h" #include "board_adapter.h" #include #include #include #include <3d_rendering/raytracing/shapes2D/polygon_2d.h> #include #include #include <3d_math.h> #include "3d_fastmath.h" #include #include #include #include #include #include #define DEFAULT_BOARD_THICKNESS pcbIUScale.mmToIU( 1.6 ) #define DEFAULT_COPPER_THICKNESS pcbIUScale.mmToIU( 0.035 ) // for 35 um // The solder mask layer (and silkscreen) thickness #define DEFAULT_TECH_LAYER_THICKNESS pcbIUScale.mmToIU( 0.025 ) // The solder paste thickness is chosen bigger than the solder mask layer // to be sure is covers the mask when overlapping. #define SOLDERPASTE_LAYER_THICKNESS pcbIUScale.mmToIU( 0.04 ) CUSTOM_COLORS_LIST BOARD_ADAPTER::g_SilkscreenColors; CUSTOM_COLORS_LIST BOARD_ADAPTER::g_MaskColors; CUSTOM_COLORS_LIST BOARD_ADAPTER::g_PasteColors; CUSTOM_COLORS_LIST BOARD_ADAPTER::g_FinishColors; CUSTOM_COLORS_LIST BOARD_ADAPTER::g_BoardColors; KIGFX::COLOR4D BOARD_ADAPTER::g_DefaultBackgroundTop; KIGFX::COLOR4D BOARD_ADAPTER::g_DefaultBackgroundBot; KIGFX::COLOR4D BOARD_ADAPTER::g_DefaultSilkscreen; KIGFX::COLOR4D BOARD_ADAPTER::g_DefaultSolderMask; KIGFX::COLOR4D BOARD_ADAPTER::g_DefaultSolderPaste; KIGFX::COLOR4D BOARD_ADAPTER::g_DefaultSurfaceFinish; KIGFX::COLOR4D BOARD_ADAPTER::g_DefaultBoardBody; // To be used in Raytracing render to create bevels on layer items float g_BevelThickness3DU = 0.0f; static bool g_ColorsLoaded = false; /** * Trace mask used to enable or disable the trace output of this class. * The debug output can be turned on by setting the WXTRACE environment variable to * "KI_TRACE_EDA_CINFO3D_VISU". See the wxWidgets documentation on wxLogTrace for * more information. * * @ingroup trace_env_vars */ const wxChar *BOARD_ADAPTER::m_logTrace = wxT( "KI_TRACE_EDA_CINFO3D_VISU" ); BOARD_ADAPTER::BOARD_ADAPTER() : m_Cfg( nullptr ), m_IsBoardView( true ), m_MousewheelPanning( true ), m_IsPreviewer( false ), m_board( nullptr ), m_3dModelManager( nullptr ), m_renderSettings( nullptr ), m_colors( nullptr ), m_layerZcoordTop(), m_layerZcoordBottom() { wxLogTrace( m_logTrace, wxT( "BOARD_ADAPTER::BOARD_ADAPTER" ) ); ReloadColorSettings(); m_boardPos = VECTOR2I(); m_boardSize = VECTOR2I(); m_boardCenter = SFVEC3F( 0.0f ); m_boardBoundingBox.Reset(); m_throughHoleIds.Clear(); m_throughHoleOds.Clear(); m_throughHoleAnnularRings.Clear(); m_copperLayersCount = 2; m_biuTo3Dunits = 1.0; m_boardBodyThickness3DU = DEFAULT_BOARD_THICKNESS * m_biuTo3Dunits; m_frontCopperThickness3DU = DEFAULT_COPPER_THICKNESS * m_biuTo3Dunits; m_backCopperThickness3DU = DEFAULT_COPPER_THICKNESS * m_biuTo3Dunits; m_nonCopperLayerThickness3DU = DEFAULT_TECH_LAYER_THICKNESS * m_biuTo3Dunits; m_solderPasteLayerThickness3DU = SOLDERPASTE_LAYER_THICKNESS * m_biuTo3Dunits; m_trackCount = 0; m_viaCount = 0; m_averageViaHoleDiameter = 0.0f; m_holeCount = 0; m_averageHoleDiameter = 0.0f; m_averageTrackWidth = 0.0f; m_BgColorBot = SFVEC4F( 0.4, 0.4, 0.5, 1.0 ); m_BgColorTop = SFVEC4F( 0.8, 0.8, 0.9, 1.0 ); m_BoardBodyColor = SFVEC4F( 0.4, 0.4, 0.5, 0.9 ); m_SolderMaskColorTop = SFVEC4F( 0.1, 0.2, 0.1, 0.83 ); m_SolderMaskColorBot = SFVEC4F( 0.1, 0.2, 0.1, 0.83 ); m_SolderPasteColor = SFVEC4F( 0.4, 0.4, 0.4, 1.0 ); m_SilkScreenColorTop = SFVEC4F( 0.9, 0.9, 0.9, 1.0 ); m_SilkScreenColorBot = SFVEC4F( 0.9, 0.9, 0.9, 1.0 ); m_CopperColor = SFVEC4F( 0.75, 0.61, 0.23, 1.0 ); m_platedPadsFront = nullptr; m_platedPadsBack = nullptr; m_frontPlatedPadPolys = nullptr; m_backPlatedPadPolys = nullptr; if( !g_ColorsLoaded ) { #define ADD_COLOR( list, r, g, b, a, name ) \ list.emplace_back( r/255.0, g/255.0, b/255.0, a, name ) ADD_COLOR( g_SilkscreenColors, 245, 245, 245, 1.0, NotSpecifiedPrm() ); // White ADD_COLOR( g_SilkscreenColors, 20, 51, 36, 1.0, wxT( "Green" ) ); ADD_COLOR( g_SilkscreenColors, 181, 19, 21, 1.0, wxT( "Red" ) ); ADD_COLOR( g_SilkscreenColors, 2, 59, 162, 1.0, wxT( "Blue" ) ); ADD_COLOR( g_SilkscreenColors, 11, 11, 11, 1.0, wxT( "Black" ) ); ADD_COLOR( g_SilkscreenColors, 245, 245, 245, 1.0, wxT( "White" ) ); ADD_COLOR( g_SilkscreenColors, 32, 2, 53, 1.0, wxT( "Purple" ) ); ADD_COLOR( g_SilkscreenColors, 194, 195, 0, 1.0, wxT( "Yellow" ) ); ADD_COLOR( g_MaskColors, 20, 51, 36, 0.83, NotSpecifiedPrm() ); // Green ADD_COLOR( g_MaskColors, 20, 51, 36, 0.83, wxT( "Green" ) ); ADD_COLOR( g_MaskColors, 91, 168, 12, 0.83, wxT( "Light Green" ) ); ADD_COLOR( g_MaskColors, 13, 104, 11, 0.83, wxT( "Saturated Green" ) ); ADD_COLOR( g_MaskColors, 181, 19, 21, 0.83, wxT( "Red" ) ); ADD_COLOR( g_MaskColors, 210, 40, 14, 0.83, wxT( "Light Red" ) ); ADD_COLOR( g_MaskColors, 239, 53, 41, 0.83, wxT( "Red/Orange" ) ); ADD_COLOR( g_MaskColors, 2, 59, 162, 0.83, wxT( "Blue" ) ); ADD_COLOR( g_MaskColors, 54, 79, 116, 0.83, wxT( "Light Blue 1" ) ); ADD_COLOR( g_MaskColors, 61, 85, 130, 0.83, wxT( "Light Blue 2" ) ); ADD_COLOR( g_MaskColors, 21, 70, 80, 0.83, wxT( "Green/Blue" ) ); ADD_COLOR( g_MaskColors, 11, 11, 11, 0.83, wxT( "Black" ) ); ADD_COLOR( g_MaskColors, 245, 245, 245, 0.83, wxT( "White" ) ); ADD_COLOR( g_MaskColors, 32, 2, 53, 0.83, wxT( "Purple" ) ); ADD_COLOR( g_MaskColors, 119, 31, 91, 0.83, wxT( "Light Purple" ) ); ADD_COLOR( g_MaskColors, 194, 195, 0, 0.83, wxT( "Yellow" ) ); ADD_COLOR( g_PasteColors, 128, 128, 128, 1.0, wxT( "Grey" ) ); ADD_COLOR( g_PasteColors, 90, 90, 90, 1.0, wxT( "Dark Grey" ) ); ADD_COLOR( g_PasteColors, 213, 213, 213, 1.0, wxT( "Silver" ) ); ADD_COLOR( g_FinishColors, 184, 115, 50, 1.0, wxT( "Copper" ) ); ADD_COLOR( g_FinishColors, 178, 156, 0, 1.0, wxT( "Gold" ) ); ADD_COLOR( g_FinishColors, 213, 213, 213, 1.0, wxT( "Silver" ) ); ADD_COLOR( g_FinishColors, 160, 160, 160, 1.0, wxT( "Tin" ) ); ADD_COLOR( g_BoardColors, 51, 43, 22, 0.83, wxT( "FR4 natural, dark" ) ); ADD_COLOR( g_BoardColors, 109, 116, 75, 0.83, wxT( "FR4 natural" ) ); ADD_COLOR( g_BoardColors, 252, 252, 250, 0.90, wxT( "PTFE natural" ) ); ADD_COLOR( g_BoardColors, 205, 130, 0, 0.68, wxT( "Polyimide" ) ); ADD_COLOR( g_BoardColors, 92, 17, 6, 0.90, wxT( "Phenolic natural" ) ); ADD_COLOR( g_BoardColors, 146, 99, 47, 0.83, wxT( "Brown 1" ) ); ADD_COLOR( g_BoardColors, 160, 123, 54, 0.83, wxT( "Brown 2" ) ); ADD_COLOR( g_BoardColors, 146, 99, 47, 0.83, wxT( "Brown 3" ) ); ADD_COLOR( g_BoardColors, 213, 213, 213, 1.0, wxT( "Aluminum" ) ); g_DefaultBackgroundTop = COLOR4D( 0.80, 0.80, 0.90, 1.0 ); g_DefaultBackgroundBot = COLOR4D( 0.40, 0.40, 0.50, 1.0 ); g_DefaultSilkscreen = COLOR4D( 0.94, 0.94, 0.94, 1.0 ); g_DefaultSolderMask = COLOR4D( 0.08, 0.20, 0.14, 0.83 ); g_DefaultSolderPaste = COLOR4D( 0.50, 0.50, 0.50, 1.0 ); g_DefaultSurfaceFinish = COLOR4D( 0.75, 0.61, 0.23, 1.0 ); g_DefaultBoardBody = COLOR4D( 0.43, 0.45, 0.30, 0.90 ); g_ColorsLoaded = true; } #undef ADD_COLOR } BOARD_ADAPTER::~BOARD_ADAPTER() { destroyLayers(); } void BOARD_ADAPTER::ReloadColorSettings() noexcept { wxASSERT( PgmOrNull() ); PCBNEW_SETTINGS* settings = Pgm().GetSettingsManager().GetAppSettings(); m_colors = Pgm().GetSettingsManager().GetColorSettings( settings->m_ColorTheme ); } bool BOARD_ADAPTER::Is3dLayerEnabled( PCB_LAYER_ID aLayer ) const { wxASSERT( aLayer < PCB_LAYER_ID_COUNT ); if( m_board && !m_board->IsLayerEnabled( aLayer ) ) return false; // see if layer needs to be shown // check the flags switch( aLayer ) { case B_Adhes: case F_Adhes: return m_Cfg->m_Render.show_adhesive; case B_Paste: case F_Paste: return m_Cfg->m_Render.show_solderpaste; case B_SilkS: case F_SilkS: return m_Cfg->m_Render.show_silkscreen; case B_Mask: case F_Mask: return m_Cfg->m_Render.show_soldermask; case Dwgs_User: case Cmts_User: return !m_Cfg->m_Render.realistic && m_Cfg->m_Render.show_comments; case Eco1_User: case Eco2_User: return !m_Cfg->m_Render.realistic && m_Cfg->m_Render.show_eco; case Edge_Cuts: return !m_Cfg->m_Render.realistic && !m_Cfg->m_Render.show_board_body; case Margin: return !m_Cfg->m_Render.realistic; case B_Cu: case F_Cu: return !m_board || m_board->IsLayerVisible( aLayer ) || m_Cfg->m_Render.realistic || m_board->IsFootprintHolder(); default: // the layer is an internal copper layer, used the visibility return m_board && m_board->IsLayerVisible( aLayer ); } } bool BOARD_ADAPTER::IsFootprintShown( FOOTPRINT_ATTR_T aFPAttributes ) const { if( m_IsPreviewer ) // In panel Preview, footprints are always shown, of course return true; if( aFPAttributes & FP_EXCLUDE_FROM_POS_FILES ) { if( !m_Cfg->m_Render.show_footprints_not_in_posfile ) return false; } if( aFPAttributes & FP_DNP ) { if( !m_Cfg->m_Render.show_footprints_dnp ) return false; } if( aFPAttributes & FP_SMD ) return m_Cfg->m_Render.show_footprints_insert; if( aFPAttributes & FP_THROUGH_HOLE ) return m_Cfg->m_Render.show_footprints_normal; return m_Cfg->m_Render.show_footprints_virtual; } int BOARD_ADAPTER::GetHolePlatingThickness() const noexcept { return m_board ? m_board->GetDesignSettings().GetHolePlatingThickness() : DEFAULT_COPPER_THICKNESS; } unsigned int BOARD_ADAPTER::GetCircleSegmentCount( float aDiameter3DU ) const { wxASSERT( aDiameter3DU > 0.0f ); return GetCircleSegmentCount( (int)( aDiameter3DU / m_biuTo3Dunits ) ); } unsigned int BOARD_ADAPTER::GetCircleSegmentCount( int aDiameterBIU ) const { wxASSERT( aDiameterBIU > 0 ); return GetArcToSegmentCount( aDiameterBIU / 2, ARC_HIGH_DEF, FULL_CIRCLE ); } void BOARD_ADAPTER::InitSettings( REPORTER* aStatusReporter, REPORTER* aWarningReporter ) { wxLogTrace( m_logTrace, wxT( "BOARD_ADAPTER::InitSettings" ) ); if( aStatusReporter ) aStatusReporter->Report( _( "Build board outline" ) ); wxString msg; const bool haveOutline = createBoardPolygon( &msg ); if( aWarningReporter ) { if( !haveOutline ) aWarningReporter->Report( msg, RPT_SEVERITY_WARNING ); else aWarningReporter->Report( wxEmptyString ); } BOX2I bbbox; if( m_board ) { bbbox = m_board->ComputeBoundingBox( !m_board->IsFootprintHolder() && m_Cfg->m_Render.realistic && haveOutline ); } // Gives a non null size to avoid issues in zoom / scale calculations if( ( bbbox.GetWidth() == 0 ) && ( bbbox.GetHeight() == 0 ) ) bbbox.Inflate( pcbIUScale.mmToIU( 10 ) ); m_boardSize = bbbox.GetSize(); m_boardPos = bbbox.Centre(); wxASSERT( (m_boardSize.x > 0) && (m_boardSize.y > 0) ); m_boardPos.y = -m_boardPos.y; // The y coord is inverted in 3D viewer m_copperLayersCount = m_board ? m_board->GetCopperLayerCount() : 2; // Ensure the board has 2 sides for 3D views, because it is hard to find // a *really* single side board in the true life... if( m_copperLayersCount < 2 ) m_copperLayersCount = 2; // Calculate the conversion to apply to all positions. m_biuTo3Dunits = RANGE_SCALE_3D / std::max( m_boardSize.x, m_boardSize.y ); m_boardBodyThickness3DU = DEFAULT_BOARD_THICKNESS * m_biuTo3Dunits; m_frontCopperThickness3DU = DEFAULT_COPPER_THICKNESS * m_biuTo3Dunits; m_backCopperThickness3DU = DEFAULT_COPPER_THICKNESS * m_biuTo3Dunits; m_nonCopperLayerThickness3DU = DEFAULT_TECH_LAYER_THICKNESS * m_biuTo3Dunits; m_solderPasteLayerThickness3DU = SOLDERPASTE_LAYER_THICKNESS * m_biuTo3Dunits; g_BevelThickness3DU = pcbIUScale.mmToIU( ADVANCED_CFG::GetCfg().m_3DRT_BevelHeight_um / 1000.0 ) * m_biuTo3Dunits; if( m_board ) { const BOARD_DESIGN_SETTINGS& bds = m_board->GetDesignSettings(); if( bds.GetStackupDescriptor().GetCount() ) { int thickness = 0; for( BOARD_STACKUP_ITEM* item : bds.GetStackupDescriptor().GetList() ) { switch( item->GetType() ) { case BS_ITEM_TYPE_DIELECTRIC: for( int sublayer = 0; sublayer < item->GetSublayersCount(); sublayer++ ) thickness += item->GetThickness( sublayer ); break; case BS_ITEM_TYPE_COPPER: if( item->GetBrdLayerId() == F_Cu ) m_frontCopperThickness3DU = item->GetThickness() * m_biuTo3Dunits; else if( item->GetBrdLayerId() == B_Cu ) m_backCopperThickness3DU = item->GetThickness() * m_biuTo3Dunits; else if( item->IsEnabled() ) thickness += item->GetThickness(); break; default: break; } } m_boardBodyThickness3DU = thickness * m_biuTo3Dunits; } } // Init Z position of each layer // calculate z position for each copper layer // Zstart = -m_epoxyThickness / 2.0 is the z position of the back (bottom layer) (layer id = 31) // Zstart = +m_epoxyThickness / 2.0 is the z position of the front (top layer) (layer id = 0) // ____==__________==________==______ <- Bottom = +m_epoxyThickness / 2.0, // | | Top = Bottom + m_copperThickness // |__________________________________| // == == == == <- Bottom = -m_epoxyThickness / 2.0, // Top = Bottom - m_copperThickness unsigned int layer; for( layer = 0; layer < m_copperLayersCount; ++layer ) { // This approximates internal layer positions (because we're treating all the dielectric // layers as having the same thickness). But we don't render them anyway so it doesn't // really matter. m_layerZcoordBottom[layer] = m_boardBodyThickness3DU / 2.0f - (m_boardBodyThickness3DU * layer / (m_copperLayersCount - 1) ); if( layer < (m_copperLayersCount / 2) ) m_layerZcoordTop[layer] = m_layerZcoordBottom[layer] + m_frontCopperThickness3DU; else m_layerZcoordTop[layer] = m_layerZcoordBottom[layer] - m_backCopperThickness3DU; } #define layerThicknessMargin 1.1 const float zpos_offset = m_nonCopperLayerThickness3DU * layerThicknessMargin; // Fill remaining unused copper layers and back layer zpos with -m_boardBodyThickness / 2.0 for( ; layer < MAX_CU_LAYERS; layer++ ) { m_layerZcoordBottom[layer] = -( m_boardBodyThickness3DU / 2.0f ); m_layerZcoordTop[layer] = -( m_boardBodyThickness3DU / 2.0f ) - m_backCopperThickness3DU; } // This is the top of the copper layer thickness. const float zpos_copperTop_back = m_layerZcoordTop[B_Cu]; const float zpos_copperTop_front = m_layerZcoordTop[F_Cu]; // calculate z position for each non copper layer // Solder mask and Solder paste have the same Z position for( int layer_id = MAX_CU_LAYERS; layer_id < PCB_LAYER_ID_COUNT; ++layer_id ) { float zposTop; float zposBottom; switch( layer_id ) { case B_Adhes: zposBottom = zpos_copperTop_back - 2.0f * zpos_offset; zposTop = zposBottom - m_nonCopperLayerThickness3DU; break; case F_Adhes: zposBottom = zpos_copperTop_front + 2.0f * zpos_offset; zposTop = zposBottom + m_nonCopperLayerThickness3DU; break; case B_Mask: zposBottom = zpos_copperTop_back; zposTop = zpos_copperTop_back - m_nonCopperLayerThickness3DU; break; case B_Paste: zposBottom = zpos_copperTop_back; zposTop = zpos_copperTop_back - m_solderPasteLayerThickness3DU; break; case F_Mask: zposBottom = zpos_copperTop_front; zposTop = zpos_copperTop_front + m_nonCopperLayerThickness3DU; break; case F_Paste: zposBottom = zpos_copperTop_front; zposTop = zpos_copperTop_front + m_solderPasteLayerThickness3DU; break; case B_SilkS: zposBottom = zpos_copperTop_back - 1.0f * zpos_offset; zposTop = zposBottom - m_nonCopperLayerThickness3DU; break; case F_SilkS: zposBottom = zpos_copperTop_front + 1.0f * zpos_offset; zposTop = zposBottom + m_nonCopperLayerThickness3DU; break; // !TODO: review default: zposTop = zpos_copperTop_front + (layer_id - MAX_CU_LAYERS + 3.0f) * zpos_offset; zposBottom = zposTop - m_nonCopperLayerThickness3DU; break; } m_layerZcoordTop[layer_id] = zposTop; m_layerZcoordBottom[layer_id] = zposBottom; } m_boardCenter = SFVEC3F( m_boardPos.x * m_biuTo3Dunits, m_boardPos.y * m_biuTo3Dunits, 0.0f ); SFVEC3F boardSize = SFVEC3F( m_boardSize.x * m_biuTo3Dunits, m_boardSize.y * m_biuTo3Dunits, 0.0f ); boardSize /= 2.0f; SFVEC3F boardMin = ( m_boardCenter - boardSize ); SFVEC3F boardMax = ( m_boardCenter + boardSize ); boardMin.z = m_layerZcoordTop[B_Adhes]; boardMax.z = m_layerZcoordTop[F_Adhes]; m_boardBoundingBox = BBOX_3D( boardMin, boardMax ); #ifdef PRINT_STATISTICS_3D_VIEWER unsigned stats_startCreateBoardPolyTime = GetRunningMicroSecs(); #endif if( aStatusReporter ) aStatusReporter->Report( _( "Create layers" ) ); createLayers( aStatusReporter ); COLOR_SETTINGS* colors = Pgm().GetSettingsManager().GetColorSettings(); auto to_SFVEC4F = []( const COLOR4D& src ) { return SFVEC4F( src.r, src.g, src.b, src.a ); }; m_BgColorTop = to_SFVEC4F( colors->GetColor( LAYER_3D_BACKGROUND_TOP ) ); m_BgColorBot = to_SFVEC4F( colors->GetColor( LAYER_3D_BACKGROUND_BOTTOM ) ); m_SolderPasteColor = to_SFVEC4F( colors->GetColor( LAYER_3D_SOLDERPASTE ) ); if( m_board && colors->GetUseBoardStackupColors() ) { const BOARD_STACKUP& stackup = m_board->GetDesignSettings().GetStackupDescriptor(); auto findColor = []( const wxString& aColorName, const CUSTOM_COLORS_LIST& aColorSet ) { if( aColorName.StartsWith( wxT( "#" ) ) ) { return KIGFX::COLOR4D( aColorName ); } else { for( const CUSTOM_COLOR_ITEM& color : aColorSet ) { if( color.m_ColorName == aColorName ) return color.m_Color; } } return KIGFX::COLOR4D(); }; m_SilkScreenColorTop = to_SFVEC4F( g_DefaultSilkscreen ); m_SilkScreenColorBot = to_SFVEC4F( g_DefaultSilkscreen ); m_SolderMaskColorTop = to_SFVEC4F( g_DefaultSolderMask ); m_SolderMaskColorBot = to_SFVEC4F( g_DefaultSolderMask ); KIGFX::COLOR4D bodyColor( 0, 0, 0, 0 ); for( const BOARD_STACKUP_ITEM* stackupItem : stackup.GetList() ) { wxString colorName = stackupItem->GetColor(); switch( stackupItem->GetType() ) { case BS_ITEM_TYPE_SILKSCREEN: if( stackupItem->GetBrdLayerId() == F_SilkS ) m_SilkScreenColorTop = to_SFVEC4F( findColor( colorName, g_SilkscreenColors ) ); else m_SilkScreenColorBot = to_SFVEC4F( findColor( colorName, g_SilkscreenColors ) ); break; case BS_ITEM_TYPE_SOLDERMASK: if( stackupItem->GetBrdLayerId() == F_Mask ) m_SolderMaskColorTop = to_SFVEC4F( findColor( colorName, g_MaskColors ) ); else m_SolderMaskColorBot = to_SFVEC4F( findColor( colorName, g_MaskColors ) ); break; case BS_ITEM_TYPE_DIELECTRIC: { KIGFX::COLOR4D layerColor = findColor( colorName, g_BoardColors ); if( bodyColor == COLOR4D( 0, 0, 0, 0 ) ) bodyColor = layerColor; else bodyColor = bodyColor.Mix( layerColor, 1.0 - layerColor.a ); bodyColor.a += ( 1.0 - bodyColor.a ) * layerColor.a / 2; break; } default: break; } } if( bodyColor != COLOR4D( 0, 0, 0, 0 ) ) m_BoardBodyColor = to_SFVEC4F( bodyColor ); else m_BoardBodyColor = to_SFVEC4F( g_DefaultBoardBody ); const wxString& finishName = stackup.m_FinishType; if( finishName.EndsWith( wxT( "OSP" ) ) ) { m_CopperColor = to_SFVEC4F( findColor( wxT( "Copper" ), g_FinishColors ) ); } else if( finishName.EndsWith( wxT( "IG" ) ) || finishName.EndsWith( wxT( "gold" ) ) ) { m_CopperColor = to_SFVEC4F( findColor( wxT( "Gold" ), g_FinishColors ) ); } else if( finishName.StartsWith( wxT( "HAL" ) ) || finishName.StartsWith( wxT( "HASL" ) ) || finishName.EndsWith( wxT( "tin" ) ) || finishName.EndsWith( wxT( "nickel" ) ) ) { m_CopperColor = to_SFVEC4F( findColor( wxT( "Tin" ), g_FinishColors ) ); } else if( finishName.EndsWith( wxT( "silver" ) ) ) { m_CopperColor = to_SFVEC4F( findColor( wxT( "Silver" ), g_FinishColors ) ); } else { m_CopperColor = to_SFVEC4F( g_DefaultSurfaceFinish ); } } else { m_SilkScreenColorBot = to_SFVEC4F( colors->GetColor( LAYER_3D_SILKSCREEN_BOTTOM ) ); m_SilkScreenColorTop = to_SFVEC4F( colors->GetColor( LAYER_3D_SILKSCREEN_TOP ) ); m_SolderMaskColorBot = to_SFVEC4F( colors->GetColor( LAYER_3D_SOLDERMASK_BOTTOM ) ); m_SolderMaskColorTop = to_SFVEC4F( colors->GetColor( LAYER_3D_SOLDERMASK_TOP ) ); m_CopperColor = to_SFVEC4F( colors->GetColor( LAYER_3D_COPPER ) ); m_BoardBodyColor = to_SFVEC4F( colors->GetColor( LAYER_3D_BOARD ) ); } } bool BOARD_ADAPTER::createBoardPolygon( wxString* aErrorMsg ) { m_board_poly.RemoveAllContours(); if( !m_board ) return false; bool success; if( m_board->IsFootprintHolder() ) { if( !m_board->GetFirstFootprint() ) { if( aErrorMsg ) *aErrorMsg = _( "No footprint loaded." ); return false; } // max dist from one endPt to next startPt int chainingEpsilon = m_board->GetOutlinesChainingEpsilon(); success = BuildFootprintPolygonOutlines( m_board, m_board_poly, m_board->GetDesignSettings().m_MaxError, chainingEpsilon ); // Make polygon strictly simple to avoid issues (especially in 3D viewer) m_board_poly.Simplify( SHAPE_POLY_SET::PM_STRICTLY_SIMPLE ); if( !success && aErrorMsg ) { *aErrorMsg = _( "Footprint outline is missing or malformed. Run Footprint Checker for " "a full analysis." ); } } else { success = m_board->GetBoardPolygonOutlines( m_board_poly ); if( !success && aErrorMsg ) *aErrorMsg = _( "Board outline is missing or malformed. Run DRC for a full analysis." ); } return success; } float BOARD_ADAPTER::GetFootprintZPos( bool aIsFlipped ) const { if( aIsFlipped ) { if( m_Cfg->m_Render.show_solderpaste ) return m_layerZcoordBottom[B_SilkS]; else return m_layerZcoordBottom[B_Paste]; } else { if( m_Cfg->m_Render.show_solderpaste ) return m_layerZcoordTop[F_SilkS]; else return m_layerZcoordTop[F_Paste]; } } SFVEC4F BOARD_ADAPTER::GetLayerColor( PCB_LAYER_ID aLayerId ) const { wxASSERT( aLayerId < PCB_LAYER_ID_COUNT ); const COLOR4D color = m_colors->GetColor( aLayerId ); return SFVEC4F( color.r, color.g, color.b, color.a ); } SFVEC4F BOARD_ADAPTER::GetItemColor( int aItemId ) const { return GetColor( m_colors->GetColor( aItemId ) ); } SFVEC4F BOARD_ADAPTER::GetColor( const COLOR4D& aColor ) const { return SFVEC4F( aColor.r, aColor.g, aColor.b, aColor.a ); } SFVEC2F BOARD_ADAPTER::GetSphericalCoord( int i ) const { SFVEC2F sphericalCoord = SFVEC2F( ( m_Cfg->m_Render.raytrace_lightElevation[i] + 90.0f ) / 180.0f, m_Cfg->m_Render.raytrace_lightAzimuth[i] / 180.0f ); sphericalCoord.x = glm::clamp( sphericalCoord.x, 0.0f, 1.0f ); sphericalCoord.y = glm::clamp( sphericalCoord.y, 0.0f, 2.0f ); return sphericalCoord; }