/* * This program source code file is part of KiCad, a free EDA CAD application. * * Copyright (C) 2014-2015 Mario Luzeiro * Copyright (C) 1992-2015 KiCad Developers, see AUTHORS.txt for contributors. * * This program is free software; you can redistribute it and/or * modify it under the terms of the GNU General Public License * as published by the Free Software Foundation; either version 2 * of the License, or (at your option) any later version. * * This program is distributed in the hope that it will be useful, * but WITHOUT ANY WARRANTY; without even the implied warranty of * MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the * GNU General Public License for more details. * * You should have received a copy of the GNU General Public License * along with this program; if not, you may find one here: * http://www.gnu.org/licenses/old-licenses/gpl-2.0.html * or you may search the http://www.gnu.org website for the version 2 license, * or you may write to the Free Software Foundation, Inc., * 51 Franklin Street, Fifth Floor, Boston, MA 02110-1301, USA */ /** * @file 3d_draw_board_body.cpp * */ #include #include #include #include #include #include #include #include #include #include #include #include #include #include #include #include #define GLM_FORCE_RADIANS #include #include #ifdef __WINDOWS__ #include // must be included before gl.h #endif #include <3d_viewer.h> #include <3d_canvas.h> #include #include #include <3d_draw_basic_functions.h> #include #include #include #include // An option for all operations on polygons: // when useFastModeForPolygons = true, calculations can be *a lot* faster. // but created polygons can be not stricty simple (can share edges) // Although stricty simple are better for glu tesselation functions, I do not see // any issue when allowing not stricty simple polygons. // But I see *very* long calculations when setting useFastMode to false. // So, be careful if changing thie option bool useFastModeForPolygons = true; /* returns the Z orientation parameter 1.0 or -1.0 for aLayer * Z orientation is 1.0 for all layers but "back" layers: * B_Cu , B_Adhes, B_Paste ), B_SilkS * used to calculate the Z orientation parameter for glNormal3f */ GLfloat Get3DLayer_Z_Orientation( LAYER_NUM aLayer ); void EDA_3D_CANVAS::buildBoardThroughHolesPolygonList( SHAPE_POLY_SET& allBoardHoles, int aSegCountPerCircle, bool aOptimizeLargeCircles ) { // hole diameter value to change seg count by circle: int small_hole_limit = Millimeter2iu( 1.0 ); int copper_thickness = GetPrm3DVisu().GetCopperThicknessBIU(); BOARD* pcb = GetBoard(); // Build holes of through vias: for( TRACK* track = pcb->m_Track; track; track = track->Next() ) { if( track->Type() != PCB_VIA_T ) continue; VIA *via = static_cast( track ); if( via->GetViaType() != VIA_THROUGH ) continue; int holediameter = via->GetDrillValue(); int hole_outer_radius = (holediameter + copper_thickness) / 2; TransformCircleToPolygon( allBoardHoles, via->GetStart(), hole_outer_radius, aSegCountPerCircle ); } // Build holes of through pads: for( MODULE* footprint = pcb->m_Modules; footprint; footprint = footprint->Next() ) { for( D_PAD* pad = footprint->Pads(); pad; pad = pad->Next() ) { // Calculate a factor to apply to segcount for large holes ( > 1 mm) // (bigger pad drill size -> more segments) because holes in pads can have // very different sizes and optimizing this segcount gives a better look // Mainly mounting holes have a size bigger than small_hole_limit wxSize padHole = pad->GetDrillSize(); if( ! padHole.x ) // Not drilled pad like SMD pad continue; // we use the hole diameter to calculate the seg count. // for round holes, padHole.x == padHole.y // for oblong holes, the diameter is the smaller of (padHole.x, padHole.y) int diam = std::min( padHole.x, padHole.y ); int segcount = aSegCountPerCircle; if( diam > small_hole_limit ) { double segFactor = (double)diam / small_hole_limit; segcount = (int)(aSegCountPerCircle * segFactor); // limit segcount to 48. For a circle this is a very good approx. if( segcount > 48 ) segcount = 48; } // The hole in the body is inflated by copper thickness. int inflate = copper_thickness; // If not plated, no copper. if( pad->GetAttribute () == PAD_ATTRIB_HOLE_NOT_PLATED ) inflate = 0; pad->BuildPadDrillShapePolygon( allBoardHoles, inflate, segcount ); } } allBoardHoles.Simplify( useFastModeForPolygons ); } void EDA_3D_CANVAS::buildBoard3DView( GLuint aBoardList, GLuint aBodyOnlyList, REPORTER* aErrorMessages, REPORTER* aActivity ) { BOARD* pcb = GetBoard(); // If FL_RENDER_SHOW_HOLES_IN_ZONES is true, holes are correctly removed from copper zones areas. // If FL_RENDER_SHOW_HOLES_IN_ZONES is false, holes are not removed from copper zones areas, // but the calculation time is twice shorter. bool remove_Holes = isEnabled( FL_RENDER_SHOW_HOLES_IN_ZONES ); bool realistic_mode = isRealisticMode(); bool useTextures = isRealisticMode() && isEnabled( FL_RENDER_TEXTURES ); // Number of segments to convert a circle to polygon // We use 2 values: the first gives a good shape (for instanes rond pads) // the second is used to speed up calculations, when a poor approximation is acceptable (holes) const int segcountforcircle = 18; double correctionFactor = 1.0 / cos( M_PI / (segcountforcircle * 2.0) ); const int segcountLowQuality = 12; // segments to draw a circle with low quality // to reduce time calculations // for holes and items which do not need // a fine representation double correctionFactorLQ = 1.0 / cos( M_PI / (segcountLowQuality * 2.0) ); SHAPE_POLY_SET bufferPolys; // copper areas: tracks, pads and filled zones areas // when holes are removed from zones SHAPE_POLY_SET bufferPcbOutlines; // stores the board main outlines SHAPE_POLY_SET bufferZonesPolys; // copper filled zones areas // when holes are not removed from zones SHAPE_POLY_SET currLayerHoles; // Contains holes for the current layer SHAPE_POLY_SET allLayerHoles; // Contains holes for all layers // Build a polygon from edge cut items wxString msg; if( !pcb->GetBoardPolygonOutlines( bufferPcbOutlines, allLayerHoles, &msg ) ) { if( aErrorMessages ) { msg << wxT("\n") << _("Unable to calculate the board outlines.\n" "Therefore use the board boundary box.") << wxT("\n\n"); aErrorMessages->Report( msg, REPORTER::RPT_WARNING ); } } // Build board holes, with optimization of large holes shape. buildBoardThroughHolesPolygonList( allLayerHoles, segcountLowQuality, true ); LSET cu_set = LSET::AllCuMask( GetPrm3DVisu().m_CopperLayersCount ); glNewList( aBoardList, GL_COMPILE ); for( LSEQ cu = cu_set.CuStack(); cu; ++cu ) { LAYER_ID layer = *cu; // Skip non enabled layers in normal mode, // and internal layers in realistic mode if( !is3DLayerEnabled( layer ) ) continue; if( aActivity ) aActivity->Report( wxString::Format( _( "Build layer %s" ), LSET::Name( layer ) ) ); bufferPolys.RemoveAllContours(); bufferZonesPolys.RemoveAllContours(); currLayerHoles.RemoveAllContours(); // Draw track shapes: for( TRACK* track = pcb->m_Track; track; track = track->Next() ) { if( !track->IsOnLayer( layer ) ) continue; track->TransformShapeWithClearanceToPolygon( bufferPolys, 0, segcountforcircle, correctionFactor ); // Add blind/buried via holes if( track->Type() == PCB_VIA_T ) { VIA *via = static_cast( track ); if( via->GetViaType() == VIA_THROUGH ) continue; // already done int holediameter = via->GetDrillValue(); int thickness = GetPrm3DVisu().GetCopperThicknessBIU(); int hole_outer_radius = (holediameter + thickness) / 2; TransformCircleToPolygon( currLayerHoles, via->GetStart(), hole_outer_radius, segcountLowQuality ); } } // draw pad shapes for( MODULE* module = pcb->m_Modules; module; module = module->Next() ) { // Note: NPTH pads are not drawn on copper layers when the pad // has same shape as its hole module->TransformPadsShapesWithClearanceToPolygon( layer, bufferPolys, 0, segcountforcircle, correctionFactor, true ); // Micro-wave modules may have items on copper layers module->TransformGraphicShapesWithClearanceToPolygonSet( layer, bufferPolys, 0, segcountforcircle, correctionFactor ); // pad holes are already in list. } // Draw copper zones. Note: // * if the holes are removed from copper zones // the polygons are stored in bufferPolys (which contains all other polygons) // * if the holes are NOT removed from copper zones // the polygons are stored in bufferZonesPolys if( isEnabled( FL_ZONE ) ) { for( int ii = 0; ii < pcb->GetAreaCount(); ii++ ) { ZONE_CONTAINER* zone = pcb->GetArea( ii ); LAYER_NUM zonelayer = zone->GetLayer(); if( zonelayer == layer ) { zone->TransformSolidAreasShapesToPolygonSet( remove_Holes ? bufferPolys : bufferZonesPolys, segcountLowQuality, correctionFactorLQ ); } } } // draw graphic items on copper layers (texts) for( BOARD_ITEM* item = pcb->m_Drawings; item; item = item->Next() ) { if( !item->IsOnLayer( layer ) ) continue; switch( item->Type() ) { case PCB_LINE_T: // should not exist on copper layers ( (DRAWSEGMENT*) item )->TransformShapeWithClearanceToPolygon( bufferPolys, 0, segcountforcircle, correctionFactor ); break; case PCB_TEXT_T: ( (TEXTE_PCB*) item )->TransformShapeWithClearanceToPolygonSet( bufferPolys, 0, segcountLowQuality, correctionFactor ); break; default: break; } } // bufferPolys contains polygons to merge. Many overlaps . // Calculate merged polygons if( bufferPolys.IsEmpty() ) continue; // Use Clipper lib to subtract holes to copper areas if( currLayerHoles.OutlineCount() ) { currLayerHoles.Append(allLayerHoles); currLayerHoles.Simplify( useFastModeForPolygons ); bufferPolys.BooleanSubtract( currLayerHoles, useFastModeForPolygons ); } else bufferPolys.BooleanSubtract( allLayerHoles, useFastModeForPolygons ); int thickness = GetPrm3DVisu().GetLayerObjectThicknessBIU( layer ); int zpos = GetPrm3DVisu().GetLayerZcoordBIU( layer ); float zNormal = 1.0f; // When using thickness it will draw first the top and then botton (with z inverted) // If we are not using thickness, then the z-normal has to match the layer direction // because just one plane will be drawn if( !thickness ) zNormal = Get3DLayer_Z_Orientation( layer ); if( realistic_mode ) { setGLCopperColor(); } else { EDA_COLOR_T color = g_ColorsSettings.GetLayerColor( layer ); SetGLColor( color ); } // If holes are removed from copper zones, bufferPolys contains all polygons // to draw (tracks+zones+texts). Draw3D_SolidHorizontalPolyPolygons( bufferPolys, zpos, thickness, GetPrm3DVisu().m_BiuTo3Dunits, useTextures, zNormal ); // If holes are not removed from copper zones (for calculation time reasons, // the zone polygons are stored in bufferZonesPolys and have to be drawn now: if( !bufferZonesPolys.IsEmpty() ) { Draw3D_SolidHorizontalPolyPolygons( bufferZonesPolys, zpos, thickness, GetPrm3DVisu().m_BiuTo3Dunits, useTextures, zNormal ); } } if( aActivity ) aActivity->Report( _( "Build board body" ) ); // Draw plated vertical holes inside the board, but not always. They are drawn: // - if the board body is not shown, to show the holes. // - or if the copper thickness is shown if( !isEnabled( FL_SHOW_BOARD_BODY ) || isEnabled( FL_USE_COPPER_THICKNESS ) ) { // Draw vias holes (vertical cylinders) for( const TRACK* track = pcb->m_Track; track; track = track->Next() ) { if( track->Type() == PCB_VIA_T ) { const VIA *via = static_cast(track); draw3DViaHole( via ); } } // Draw pads holes (vertical cylinders) for( const MODULE* module = pcb->m_Modules; module; module = module->Next() ) { for( D_PAD* pad = module->Pads(); pad; pad = pad->Next() ) if( pad->GetAttribute () != PAD_ATTRIB_HOLE_NOT_PLATED ) draw3DPadHole( pad ); } } glEndList(); // Build the body board: glNewList( aBodyOnlyList, GL_COMPILE ); if( isRealisticMode() ) { setGLEpoxyColor( 1.00 ); } else { EDA_COLOR_T color = g_ColorsSettings.GetLayerColor( Edge_Cuts ); SetGLColor( color, 0.7 ); } float copper_thickness = GetPrm3DVisu().GetCopperThicknessBIU(); // a small offset between substrate and external copper layer to avoid artifacts // when drawing copper items on board float epsilon = Millimeter2iu( 0.01 ); float zpos = GetPrm3DVisu().GetLayerZcoordBIU( B_Cu ); float board_thickness = GetPrm3DVisu().GetLayerZcoordBIU( F_Cu ) - GetPrm3DVisu().GetLayerZcoordBIU( B_Cu ); // items on copper layers and having a thickness = copper_thickness // are drawn from zpos - copper_thickness/2 to zpos + copper_thickness // therefore substrate position is copper_thickness/2 to // substrate_height - copper_thickness/2 zpos += (copper_thickness + epsilon) / 2.0f; board_thickness -= copper_thickness + epsilon; bufferPcbOutlines.BooleanSubtract( allLayerHoles, useFastModeForPolygons ); if( !bufferPcbOutlines.IsEmpty() ) { Draw3D_SolidHorizontalPolyPolygons( bufferPcbOutlines, zpos + board_thickness / 2.0, board_thickness, GetPrm3DVisu().m_BiuTo3Dunits, useTextures, 1.0f ); } glEndList(); } void EDA_3D_CANVAS::buildTechLayers3DView( REPORTER* aErrorMessages, REPORTER* aActivity ) { BOARD* pcb = GetBoard(); bool useTextures = isRealisticMode() && isEnabled( FL_RENDER_TEXTURES ); // Number of segments to draw a circle using segments const int segcountforcircle = 18; double correctionFactor = 1.0 / cos( M_PI / (segcountforcircle * 2) ); const int segcountLowQuality = 12; // segments to draw a circle with low quality // to reduce time calculations // for holes and items which do not need // a fine representation double correctionFactorLQ = 1.0 / cos( M_PI / (segcountLowQuality * 2) ); // segments to draw a circle to build texts. Is is used only to build // the shape of each segment of the stroke font, therefore no need to have // many segments per circle. const int segcountInStrokeFont = 8; SHAPE_POLY_SET bufferPolys; SHAPE_POLY_SET allLayerHoles; // Contains through holes, calculated only once SHAPE_POLY_SET bufferPcbOutlines; // stores the board main outlines // Build a polygon from edge cut items wxString msg; if( !pcb->GetBoardPolygonOutlines( bufferPcbOutlines, allLayerHoles, &msg ) ) { if( aErrorMessages ) { msg << wxT("\n") << _("Unable to calculate the board outlines.\n" "Therefore use the board boundary box.") << wxT("\n\n"); aErrorMessages->Report( msg, REPORTER::RPT_WARNING ); } } // Build board holes, with no optimization of large holes shape. buildBoardThroughHolesPolygonList( allLayerHoles, segcountLowQuality, false ); // draw graphic items, on technical layers static const LAYER_ID teckLayerList[] = { B_Adhes, F_Adhes, B_Paste, F_Paste, B_SilkS, F_SilkS, B_Mask, F_Mask, }; // User layers are not drawn here, only technical layers for( LSEQ seq = LSET::AllTechMask().Seq( teckLayerList, DIM( teckLayerList ) ); seq; ++seq ) { LAYER_ID layer = *seq; if( !is3DLayerEnabled( layer ) ) continue; if( layer == Edge_Cuts && isEnabled( FL_SHOW_BOARD_BODY ) ) continue; if( aActivity ) aActivity->Report( wxString::Format( _( "Build layer %s" ), LSET::Name( layer ) ) ); bufferPolys.RemoveAllContours(); for( BOARD_ITEM* item = pcb->m_Drawings; item; item = item->Next() ) { if( !item->IsOnLayer( layer ) ) continue; switch( item->Type() ) { case PCB_LINE_T: ( (DRAWSEGMENT*) item )->TransformShapeWithClearanceToPolygon( bufferPolys, 0, segcountforcircle, correctionFactor ); break; case PCB_TEXT_T: ( (TEXTE_PCB*) item )->TransformShapeWithClearanceToPolygonSet( bufferPolys, 0, segcountLowQuality, 1.0 ); break; default: break; } } for( MODULE* module = pcb->m_Modules; module; module = module->Next() ) { if( layer == F_SilkS || layer == B_SilkS ) { // On silk screen layers, the pad shape is only the pad outline // never a filled shape D_PAD* pad = module->Pads(); int linewidth = g_DrawDefaultLineThickness; for( ; pad; pad = pad->Next() ) { if( !pad->IsOnLayer( layer ) ) continue; buildPadShapeThickOutlineAsPolygon( pad, bufferPolys, linewidth, segcountforcircle, correctionFactor ); } } else module->TransformPadsShapesWithClearanceToPolygon( layer, bufferPolys, 0, segcountforcircle, correctionFactor ); // On tech layers, use a poor circle approximation, only for texts (stroke font) module->TransformGraphicShapesWithClearanceToPolygonSet( layer, bufferPolys, 0, segcountforcircle, correctionFactor, segcountInStrokeFont ); } // Draw non copper zones if( isEnabled( FL_ZONE ) ) { for( int ii = 0; ii < pcb->GetAreaCount(); ii++ ) { ZONE_CONTAINER* zone = pcb->GetArea( ii ); if( !zone->IsOnLayer( layer ) ) continue; zone->TransformSolidAreasShapesToPolygonSet( bufferPolys, segcountLowQuality, correctionFactorLQ ); } } // bufferPolys contains polygons to merge. Many overlaps . // Calculate merged polygons and remove pads and vias holes if( bufferPolys.IsEmpty() ) continue; // Solder mask layers are "negative" layers. // Shapes should be removed from the full board area. if( layer == B_Mask || layer == F_Mask ) { SHAPE_POLY_SET cuts = bufferPolys; bufferPolys = bufferPcbOutlines; cuts.Append(allLayerHoles); cuts.Simplify( useFastModeForPolygons ); bufferPolys.BooleanSubtract( cuts, useFastModeForPolygons ); } // Remove holes from Solder paste layers and silkscreen else if( layer == B_Paste || layer == F_Paste || layer == B_SilkS || layer == F_SilkS ) { bufferPolys.BooleanSubtract( allLayerHoles, useFastModeForPolygons ); } int thickness = 0; if( layer != B_Mask && layer != F_Mask ) thickness = GetPrm3DVisu().GetLayerObjectThicknessBIU( layer ); int zpos = GetPrm3DVisu().GetLayerZcoordBIU( layer ); if( layer == Edge_Cuts ) { thickness = GetPrm3DVisu().GetLayerZcoordBIU( F_Cu ) - GetPrm3DVisu().GetLayerZcoordBIU( B_Cu ); zpos = GetPrm3DVisu().GetLayerZcoordBIU( B_Cu ) + (thickness / 2); } else { // for Draw3D_SolidHorizontalPolyPolygons, zpos it the middle between bottom and top // sides. // However for top layers, zpos should be the bottom layer pos, // and for bottom layers, zpos should be the top layer pos. if( Get3DLayer_Z_Orientation( layer ) > 0 ) zpos += thickness/2; else zpos -= thickness/2 ; } float zNormal = 1.0f; // When using thickness it will draw first the top and then botton (with z inverted) // If we are not using thickness, then the znormal must face the layer direction // because it will draw just one plane if( !thickness ) zNormal = Get3DLayer_Z_Orientation( layer ); setGLTechLayersColor( layer ); Draw3D_SolidHorizontalPolyPolygons( bufferPolys, zpos, thickness, GetPrm3DVisu().m_BiuTo3Dunits, useTextures, zNormal ); } }