/* * This program source code file is part of KiCad, a free EDA CAD application. * * Copyright (C) 2016 Cirilo Bernardo * Copyright (C) 2021-2024 KiCad Developers, see AUTHORS.txt for contributors. * * This program is free software; you can redistribute it and/or * modify it under the terms of the GNU General Public License * as published by the Free Software Foundation; either version 2 * of the License, or (at your option) any later version. * * This program is distributed in the hope that it will be useful, * but WITHOUT ANY WARRANTY; without even the implied warranty of * MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the * GNU General Public License for more details. * * You should have received a copy of the GNU General Public License * along with this program; if not, you may find one here: * http://www.gnu.org/licenses/old-licenses/gpl-2.0.html * or you may search the http://www.gnu.org website for the version 2 license, * or you may write to the Free Software Foundation, Inc., * 51 Franklin Street, Fifth Floor, Boston, MA 02110-1301, USA */ #ifndef OCE_VIS_OCE_UTILS_H #define OCE_VIS_OCE_UTILS_H #include #include #include #include #include #include #include #include #include #include #include #include /** * Default distance between points to treat them as separate ones (mm) * 0.001 mm or less is a reasonable value. A too large value creates issues by * merging points that should be different. * Remember we are a 3D space, so a thin shape can be broken if 2 points * are merged (in X, Y, Z coords) when they should not. * round shapes converted to polygon can also be not good with a to large value */ static constexpr double OCC_MAX_DISTANCE_TO_MERGE_POINTS = 0.001; // default PCB thickness in mm static constexpr double BOARD_THICKNESS_DEFAULT_MM = 1.6; // minimum PCB thickness in mm (10 microns assumes a very thin polyimide film) // must be > OCC_MAX_DISTANCE_TO_MERGE_POINTS static constexpr double BOARD_THICKNESS_MIN_MM = 0.01; // default copper thickness in mm // must be > OCC_MAX_DISTANCE_TO_MERGE_POINTS static constexpr double COPPER_THICKNESS_DEFAULT_MM = 0.035; // Max error to approximate an arc by segments (in mm) static constexpr double ARC_TO_SEGMENT_MAX_ERROR_MM = 0.005; class PAD; class TDocStd_Document; class XCAFApp_Application; class XCAFDoc_ShapeTool; typedef std::pair< std::string, TDF_Label > MODEL_DATUM; typedef std::map< std::string, TDF_Label > MODEL_MAP; extern void ReportMessage( const wxString& aMessage ); class STEP_PCB_MODEL { public: STEP_PCB_MODEL( const wxString& aPcbName ); virtual ~STEP_PCB_MODEL(); // add a pad shape (must be in final position) bool AddPadShape( const PAD* aPad, const VECTOR2D& aOrigin, bool aVia ); // add a pad hole or slot (must be in final position) bool AddHole( const SHAPE_SEGMENT& aShape, int aPlatingThickness, PCB_LAYER_ID aLayerTop, PCB_LAYER_ID aLayerBot, bool aVia, const VECTOR2D& aOrigin ); // add a plated hole shape (without the hole) bool AddBarrel( const SHAPE_SEGMENT& aShape, PCB_LAYER_ID aLayerTop, PCB_LAYER_ID aLayerBot, bool aVia, const VECTOR2D& aOrigin ); // add a set of polygons (must be in final position) bool AddPolygonShapes( const SHAPE_POLY_SET* aPolyShapes, PCB_LAYER_ID aLayer, const VECTOR2D& aOrigin ); // add a component at the given position and orientation bool AddComponent( const std::string& aFileName, const std::string& aRefDes, bool aBottom, VECTOR2D aPosition, double aRotation, VECTOR3D aOffset, VECTOR3D aOrientation, VECTOR3D aScale, bool aSubstituteModels = true ); void SetCopperColor( double r, double g, double b ); void SetPadColor( double r, double g, double b ); void SetEnabledLayers( const LSET& aLayers ); void SetFuseShapes( bool aValue ); void SetSimplifyShapes( bool aValue ); void SetAddVisMaterials( bool aValue ); void SetStackup( const BOARD_STACKUP& aStackup ); void SetNetFilter( const wxString& aFilter ); // Set the max distance (in mm) to consider 2 points have the same coordinates // and can be merged void OCCSetMergeMaxDistance( double aDistance = OCC_MAX_DISTANCE_TO_MERGE_POINTS ); void SetMaxError( int aMaxError ) { m_maxError = aMaxError; } // create the PCB model using the current outlines and drill holes bool CreatePCB( SHAPE_POLY_SET& aOutline, VECTOR2D aOrigin, bool aPushBoardBody ); /** * Convert a SHAPE_POLY_SET to TopoDS_Shape's (polygonal vertical prisms, or flat faces) * @param aShapes is the TopoDS_Shape list to append to * @param aPolySet is a polygon set * @param aConvertToArcs set to approximate with arcs * @param aThickness is the height of the created prism, or 0.0: flat face pointing up, -0.0: down. * @param aOrigin is the origin of the coordinates * @return true if success */ bool MakeShapes( std::vector& aShapes, const SHAPE_POLY_SET& aPolySet, bool aConvertToArcs, double aThickness, double aZposition, const VECTOR2D& aOrigin ); /** * Make a segment shape based on start and end point. If they're too close, make a cylinder. * It is a specialized version of MakeShape() * @param aShape is the TopoDS_Shape to initialize (must be empty) * @param aStartPoint is the start point of the segment * @param aEndPoint is the end point of the segment * @param aWidth is the width of the segment * @param aThickness is the height of the created segment, or 0.0: flat face pointing up, -0.0: down. * @param aOrigin is the origin of the coordinates * @return true if success */ bool MakeShapeAsThickSegment( TopoDS_Shape& aShape, VECTOR2D aStartPoint, VECTOR2D aEndPoint, double aWidth, double aThickness, double aZposition, const VECTOR2D& aOrigin ); #ifdef SUPPORTS_IGES // write the assembly model in IGES format bool WriteIGES( const wxString& aFileName ); #endif // write the assembly model in STEP format bool WriteSTEP( const wxString& aFileName, bool aOptimize ); // write the assembly in BREP format bool WriteBREP( const wxString& aFileName ); // write the assembly in XAO format with pad faces as groups bool WriteXAO( const wxString& aFileName ); /** * Write the assembly in binary GLTF Format * * We only support binary GLTF because GLTF is weird * Officially, binary GLTF is actually json+binary in one file * If we elected non-binary output with opecascade, it will generate * that one file as two separate files, one containing json that references the binary * Which is actually more annoying to deal with (to do the temp file rename, since we dont * control the binary name) and silly when you can just have the one file. * * @param aFileName Output file path * * @return true if the write succeeded without error */ bool WriteGLTF( const wxString& aFileName ); private: /** * @return true if the board(s) outline is valid. False otherwise */ bool isBoardOutlineValid(); void getLayerZPlacement( const PCB_LAYER_ID aLayer, double& aZPos, double& aThickness ); void getCopperLayerZPlacement( const PCB_LAYER_ID aLayer, double& aZPos, double& aThickness ); void getBoardBodyZPlacement( double& aZPos, double& aThickness ); /** * Load a 3D model data. * * @param aFileNameUTF8 is the filename encoded UTF8 (different formats allowed) * but for WRML files a model data can be loaded instead of the vrml data, * not suitable in a step file. * @param aScale is the X,Y,Z scaling factors. * @param aLabel is the TDF_Label to store the data. * @param aSubstituteModels = true to allows data substitution, false to disallow. * @param aErrorMessage (can be nullptr) is an error message to be displayed on error. * @return true if successfully loaded, false on error. */ bool getModelLabel( const std::string& aFileNameUTF8, VECTOR3D aScale, TDF_Label& aLabel, bool aSubstituteModels, wxString* aErrorMessage = nullptr ); bool getModelLocation( bool aBottom, VECTOR2D aPosition, double aRotation, VECTOR3D aOffset, VECTOR3D aOrientation, TopLoc_Location& aLocation ); bool readIGES( Handle( TDocStd_Document ) & aDoc, const char* aFname ); bool readSTEP( Handle( TDocStd_Document ) & aDoc, const char* aFname ); bool readVRML( Handle( TDocStd_Document ) & aDoc, const char* aFname ); TDF_Label transferModel( Handle( TDocStd_Document )& source, Handle( TDocStd_Document ) & dest, VECTOR3D aScale ); Handle( XCAFApp_Application ) m_app; Handle( TDocStd_Document ) m_doc; Handle( XCAFDoc_ShapeTool ) m_assy; TDF_Label m_assy_label; bool m_hasPCB; // set true if CreatePCB() has been invoked bool m_simplifyShapes; // convert parts of outlines to arcs where possible bool m_fuseShapes; // fuse geometry together std::vector m_pcb_labels; // labels for the PCB model (one by main outline) MODEL_MAP m_models; // map of file names to model labels int m_components; // number of successfully loaded components; double m_precision; // model (length unit) numeric precision double m_angleprec; // angle numeric precision double m_copperColor[3]; // copper, RGB values double m_padColor[3]; // pads, RGB values BOARD_STACKUP m_stackup; // board stackup LSET m_enabledLayers; // a set of layers enabled for export wxString m_netFilter; // remove nets not matching this wildcard double m_minx; // leftmost curve point double m_mergeOCCMaxDist; // minimum distance (mm) below which two // points are considered coincident by OCC // Holes in copper and main outlines std::vector m_copperCutouts; std::vector m_boardCutouts; // Main outlines (more than one board) std::vector m_board_outlines; std::vector m_board_copper; std::vector m_board_copper_pads; std::vector m_board_copper_vias; std::vector m_board_copper_fused; std::vector m_board_silkscreen; std::vector m_board_soldermask; // Data for pads std::map> m_pad_points; /// Name of the PCB, which will most likely be the file name of the path. wxString m_pcbName; int m_maxError; }; #endif // OCE_VIS_OCE_UTILS_H