/* * This program source code file is part of KiCad, a free EDA CAD application. * * Copyright (C) 2019 Jean-Pierre Charras, jp.charras at wanadoo.fr * Copyright (C) 2009-2020 KiCad Developers, see AUTHORS.txt for contributors. * * This program is free software; you can redistribute it and/or * modify it under the terms of the GNU General Public License * as published by the Free Software Foundation; either version 3 * of the License, or (at your option) any later version. * * This program is distributed in the hope that it will be useful, * but WITHOUT ANY WARRANTY; without even the implied warranty of * MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the * GNU General Public License for more details. * * You should have received a copy of the GNU General Public License along * with this program. If not, see . */ #include "class_board_stackup.h" #include #include #include #include #include #include // For _HKI definition #include "stackup_predefined_prms.h" BOARD_STACKUP_ITEM::BOARD_STACKUP_ITEM( BOARD_STACKUP_ITEM_TYPE aType ) { DIELECTRIC_PRMS item_prms; m_DielectricPrmsList.emplace_back( item_prms ); m_LayerId = UNDEFINED_LAYER; m_Type = aType; SetDielectricLayerId( 1 ); SetEnabled( true ); // Initialize parameters to a usual value for allowed types: switch( m_Type ) { case BS_ITEM_TYPE_COPPER: m_TypeName = KEY_COPPER; SetThickness( GetCopperDefaultThickness() ); break; case BS_ITEM_TYPE_DIELECTRIC: m_TypeName = KEY_CORE; // or prepreg SetMaterial( "FR4" ); // or other dielectric name SetLossTangent( 0.02 ); // for FR4 SetEpsilonR( 4.5 ); // for FR4 break; case BS_ITEM_TYPE_SOLDERPASTE: m_TypeName = "solderpaste"; break; case BS_ITEM_TYPE_SOLDERMASK: m_TypeName = "soldermask"; m_Color = "Green"; SetMaterial( NotSpecifiedPrm() ); // or other solder mask material name SetThickness( GetMaskDefaultThickness() ); SetEpsilonR( DEFAULT_EPSILON_R_SOLDERMASK ); break; case BS_ITEM_TYPE_SILKSCREEN: m_TypeName = "silkscreen"; m_Color = NotSpecifiedPrm(); SetMaterial( NotSpecifiedPrm() ); // or other silkscreen material name SetEpsilonR( DEFAULT_EPSILON_R_SILKSCREEN ); break; case BS_ITEM_TYPE_UNDEFINED: break; } } BOARD_STACKUP_ITEM::BOARD_STACKUP_ITEM( const BOARD_STACKUP_ITEM& aOther ) { m_LayerId = aOther.m_LayerId; m_DielectricLayerId = aOther.m_DielectricLayerId; m_Type = aOther.m_Type; m_enabled = aOther.m_enabled; m_DielectricPrmsList = aOther.m_DielectricPrmsList; m_TypeName = aOther.m_TypeName; m_LayerName = aOther.m_LayerName; m_Color = aOther.GetColor(); } void BOARD_STACKUP_ITEM::AddDielectricPrms( int aDielectricPrmsIdx ) { // add a DIELECTRIC_PRMS item to m_DielectricPrmsList DIELECTRIC_PRMS new_prms; m_DielectricPrmsList.emplace( m_DielectricPrmsList.begin() + aDielectricPrmsIdx, new_prms ); } void BOARD_STACKUP_ITEM::RemoveDielectricPrms( int aDielectricPrmsIdx ) { // Remove a DIELECTRIC_PRMS item from m_DielectricPrmsList if possible if( GetSublayersCount() < 2 || aDielectricPrmsIdx < 0 || aDielectricPrmsIdx >= GetSublayersCount() ) return; m_DielectricPrmsList.erase( m_DielectricPrmsList.begin() + aDielectricPrmsIdx ); } int BOARD_STACKUP_ITEM::GetCopperDefaultThickness() { // A reasonable thickness for copper layers: return Millimeter2iu( 0.035 ); } int BOARD_STACKUP_ITEM::GetMaskDefaultThickness() { // A reasonable thickness for solder mask: return Millimeter2iu( 0.01 ); } // Getters: int BOARD_STACKUP_ITEM::GetThickness( int aDielectricSubLayer ) const { wxASSERT( aDielectricSubLayer >= 0 && aDielectricSubLayer < GetSublayersCount() ); return m_DielectricPrmsList[aDielectricSubLayer].m_Thickness; } double BOARD_STACKUP_ITEM::GetLossTangent( int aDielectricSubLayer ) const { wxASSERT( aDielectricSubLayer >= 0 && aDielectricSubLayer < GetSublayersCount() ); return m_DielectricPrmsList[aDielectricSubLayer].m_LossTangent; } double BOARD_STACKUP_ITEM::GetEpsilonR( int aDielectricSubLayer ) const { wxASSERT( aDielectricSubLayer >= 0 && aDielectricSubLayer < GetSublayersCount() ); return m_DielectricPrmsList[aDielectricSubLayer].m_EpsilonR; } bool BOARD_STACKUP_ITEM::IsThicknessLocked( int aDielectricSubLayer ) const { wxASSERT( aDielectricSubLayer >= 0 && aDielectricSubLayer < GetSublayersCount() ); return m_DielectricPrmsList[aDielectricSubLayer].m_ThicknessLocked; } wxString BOARD_STACKUP_ITEM::GetMaterial( int aDielectricSubLayer ) const { wxASSERT( aDielectricSubLayer >= 0 && aDielectricSubLayer < GetSublayersCount() ); return m_DielectricPrmsList[aDielectricSubLayer].m_Material; } // Setters: void BOARD_STACKUP_ITEM::SetThickness( int aThickness, int aDielectricSubLayer ) { wxASSERT( aDielectricSubLayer >= 0 && aDielectricSubLayer < GetSublayersCount() ); if( aDielectricSubLayer >= 0 && aDielectricSubLayer < GetSublayersCount() ) m_DielectricPrmsList[aDielectricSubLayer].m_Thickness = aThickness; } void BOARD_STACKUP_ITEM::SetLossTangent( double aTg, int aDielectricSubLayer ) { wxASSERT( aDielectricSubLayer >= 0 && aDielectricSubLayer < GetSublayersCount() ); if( aDielectricSubLayer >= 0 && aDielectricSubLayer < GetSublayersCount() ) m_DielectricPrmsList[aDielectricSubLayer].m_LossTangent = aTg; } void BOARD_STACKUP_ITEM::SetEpsilonR( double aEpsilon, int aDielectricSubLayer ) { wxASSERT( aDielectricSubLayer >= 0 && aDielectricSubLayer < GetSublayersCount() ); if( aDielectricSubLayer >= 0 && aDielectricSubLayer < GetSublayersCount() ) m_DielectricPrmsList[aDielectricSubLayer].m_EpsilonR = aEpsilon; } void BOARD_STACKUP_ITEM::SetThicknessLocked( bool aLocked, int aDielectricSubLayer ) { wxASSERT( aDielectricSubLayer >= 0 && aDielectricSubLayer < GetSublayersCount() ); if( aDielectricSubLayer >= 0 && aDielectricSubLayer < GetSublayersCount() ) m_DielectricPrmsList[aDielectricSubLayer].m_ThicknessLocked = aLocked; } void BOARD_STACKUP_ITEM::SetMaterial( const wxString& aName, int aDielectricSubLayer ) { wxASSERT( aDielectricSubLayer >= 0 && aDielectricSubLayer < GetSublayersCount() ); if( aDielectricSubLayer >= 0 && aDielectricSubLayer < GetSublayersCount() ) m_DielectricPrmsList[aDielectricSubLayer].m_Material = aName; } bool BOARD_STACKUP_ITEM::HasEpsilonRValue() const { return m_Type == BS_ITEM_TYPE_DIELECTRIC || m_Type == BS_ITEM_TYPE_SOLDERMASK //|| m_Type == BS_ITEM_TYPE_SILKSCREEN ; }; bool BOARD_STACKUP_ITEM::HasLossTangentValue() const { return m_Type == BS_ITEM_TYPE_DIELECTRIC || m_Type == BS_ITEM_TYPE_SOLDERMASK; }; bool BOARD_STACKUP_ITEM::HasMaterialValue( int aDielectricSubLayer ) const { // return true if the material is specified return IsMaterialEditable() && IsPrmSpecified( GetMaterial( aDielectricSubLayer ) ); } bool BOARD_STACKUP_ITEM::IsMaterialEditable() const { // The material is editable only for dielectric return m_Type == BS_ITEM_TYPE_DIELECTRIC || m_Type == BS_ITEM_TYPE_SOLDERMASK || m_Type == BS_ITEM_TYPE_SILKSCREEN; } bool BOARD_STACKUP_ITEM::IsColorEditable() const { return m_Type == BS_ITEM_TYPE_SOLDERMASK || m_Type == BS_ITEM_TYPE_SILKSCREEN; } bool BOARD_STACKUP_ITEM::IsThicknessEditable() const { switch( m_Type ) { case BS_ITEM_TYPE_COPPER: return true; case BS_ITEM_TYPE_DIELECTRIC: return true; case BS_ITEM_TYPE_SOLDERMASK: return true; case BS_ITEM_TYPE_SOLDERPASTE: return false; case BS_ITEM_TYPE_SILKSCREEN: return false; default: break; } return false; } wxString BOARD_STACKUP_ITEM::FormatEpsilonR( int aDielectricSubLayer ) const { // return a wxString to print/display Epsilon R wxString txt; txt.Printf( "%.2f", GetEpsilonR( aDielectricSubLayer ) ); return txt; } wxString BOARD_STACKUP_ITEM::FormatLossTangent( int aDielectricSubLayer ) const { // return a wxString to print/display Loss Tangent wxString txt; txt.Printf( "%g", GetLossTangent( aDielectricSubLayer ) ); return txt; } wxString BOARD_STACKUP_ITEM::FormatDielectricLayerName() const { // return a wxString to print/display a dielectric name wxString lname; lname.Printf( _( "Dielectric %d" ), GetDielectricLayerId() ); return lname; } BOARD_STACKUP::BOARD_STACKUP() { m_HasDielectricConstrains = false; // True if some dielectric layers have constrains // (Loss tg and Epison R) m_HasThicknessConstrains = false; // True if some dielectric or copper layers have constrains m_EdgeConnectorConstraints = BS_EDGE_CONNECTOR_NONE; m_CastellatedPads = false; // True if some castellated pads exist m_EdgePlating = false; // True if edge board is plated m_FinishType = "None"; // undefined finish type } BOARD_STACKUP::BOARD_STACKUP( const BOARD_STACKUP& aOther ) { m_HasDielectricConstrains = aOther.m_HasDielectricConstrains; m_HasThicknessConstrains = aOther.m_HasThicknessConstrains; m_EdgeConnectorConstraints = aOther.m_EdgeConnectorConstraints; m_CastellatedPads = aOther.m_CastellatedPads; m_EdgePlating = aOther.m_EdgePlating; m_FinishType = aOther.m_FinishType; // All items in aOther.m_list have to be duplicated, because aOther.m_list // manage pointers to these items for( auto item : aOther.m_list ) { BOARD_STACKUP_ITEM* dup_item = new BOARD_STACKUP_ITEM( *item ); Add( dup_item ); } } BOARD_STACKUP& BOARD_STACKUP::operator=( const BOARD_STACKUP& aOther ) { m_HasDielectricConstrains = aOther.m_HasDielectricConstrains; m_HasThicknessConstrains = aOther.m_HasThicknessConstrains; m_EdgeConnectorConstraints = aOther.m_EdgeConnectorConstraints; m_CastellatedPads = aOther.m_CastellatedPads; m_EdgePlating = aOther.m_EdgePlating; m_FinishType = aOther.m_FinishType; RemoveAll(); // All items in aOther.m_list have to be duplicated, because aOther.m_list // manage pointers to these items for( auto item : aOther.m_list ) { BOARD_STACKUP_ITEM* dup_item = new BOARD_STACKUP_ITEM( *item ); Add( dup_item ); } return *this; } void BOARD_STACKUP::RemoveAll() { for( auto item : m_list ) delete item; m_list.clear(); } BOARD_STACKUP_ITEM* BOARD_STACKUP::GetStackupLayer( int aIndex ) { if( aIndex < 0 || aIndex >= GetCount() ) return nullptr; return GetList()[aIndex]; } int BOARD_STACKUP::BuildBoardThicknessFromStackup() const { // return the board thickness from the thickness of BOARD_STACKUP_ITEM list int thickness = 0; for( auto item : m_list ) { if( item->IsThicknessEditable() && item->IsEnabled() ) thickness += item->GetThickness(); } return thickness; } bool BOARD_STACKUP::SynchronizeWithBoard( BOARD_DESIGN_SETTINGS* aSettings ) { bool change = false; // Build the suitable stackup: BOARD_STACKUP stackup; stackup.BuildDefaultStackupList( aSettings ); // First, find removed layers: for( BOARD_STACKUP_ITEM* curr_item: m_list ) { bool found = false; for( BOARD_STACKUP_ITEM* item: stackup.GetList() ) { if( curr_item->GetBrdLayerId() != UNDEFINED_LAYER ) { if( item->GetBrdLayerId() == curr_item->GetBrdLayerId() ) { found = true; break; } } else // curr_item = dielectric layer { if( item->GetBrdLayerId() != UNDEFINED_LAYER ) continue; if( item->GetDielectricLayerId() == curr_item->GetDielectricLayerId() ) { found = true; break; } } } if( !found ) // a layer was removed: a change is found { change = true; break; } } // Now initialize all stackup items to the initial values, when exist for( BOARD_STACKUP_ITEM* item : stackup.GetList() ) { bool found = false; // Search for initial settings: for( const BOARD_STACKUP_ITEM* initial_item : m_list ) { if( item->GetBrdLayerId() != UNDEFINED_LAYER ) { if( item->GetBrdLayerId() == initial_item->GetBrdLayerId() ) { *item = *initial_item; found = true; break; } } else // dielectric layer: see m_DielectricLayerId for identification { // Compare dielectric layer with dielectric layer if( initial_item->GetBrdLayerId() != UNDEFINED_LAYER ) continue; if( item->GetDielectricLayerId() == initial_item->GetDielectricLayerId() ) { *item = *initial_item; found = true; break; } } } if( !found ) { change = true; } } // Transfer other stackup settings from aSettings const BOARD_STACKUP& source_stackup = aSettings->GetStackupDescriptor(); m_HasDielectricConstrains = source_stackup.m_HasDielectricConstrains; m_EdgeConnectorConstraints = source_stackup.m_EdgeConnectorConstraints; m_CastellatedPads = source_stackup.m_CastellatedPads; m_EdgePlating = source_stackup.m_EdgePlating; m_FinishType = source_stackup.m_FinishType; *this = stackup; return change; } void BOARD_STACKUP::BuildDefaultStackupList( const BOARD_DESIGN_SETTINGS* aSettings, int aActiveCopperLayersCount ) { // Creates a default stackup, according to the current BOARD_DESIGN_SETTINGS settings. // Note: the m_TypeName string is made translatable using _HKI marker, but is not // translated when building the stackup. // It will be used as this in files, and can be translated only in dialog // if aSettings == NULL, build a full stackup (with 32 copper layers) LSET enabledLayer = aSettings ? aSettings->GetEnabledLayers() : StackupAllowedBrdLayers(); int copperLayerCount = aSettings ? aSettings->GetCopperLayerCount() : B_Cu+1; // We need to calculate a suitable dielectric layer thickness. // If no settings, and if aActiveCopperLayersCount is given, use it // (If no settings, and no aActiveCopperLayersCount, the full 32 layers are used) int activeCuLayerCount = copperLayerCount; if( aSettings == nullptr && aActiveCopperLayersCount > 0 ) activeCuLayerCount = aActiveCopperLayersCount; int brd__thickness = aSettings ? aSettings->GetBoardThickness() : Millimeter2iu( 1.6 ); int diel_thickness = brd__thickness - ( BOARD_STACKUP_ITEM::GetCopperDefaultThickness() * activeCuLayerCount ); // Take in account the solder mask thickness: int sm_count = ( enabledLayer & LSET( 2, F_Mask, B_Mask) ).count(); diel_thickness -= BOARD_STACKUP_ITEM::GetMaskDefaultThickness() * sm_count; int dielectric_idx = 0; // Add silk screen, solder mask and solder paste layers on top if( enabledLayer[F_SilkS] ) { BOARD_STACKUP_ITEM* item = new BOARD_STACKUP_ITEM( BS_ITEM_TYPE_SILKSCREEN ); item->SetBrdLayerId( F_SilkS ); item->SetTypeName( _HKI( "Top Silk Screen" ) ); Add( item ); } if( enabledLayer[F_Paste] ) { BOARD_STACKUP_ITEM* item = new BOARD_STACKUP_ITEM( BS_ITEM_TYPE_SOLDERPASTE ); item->SetBrdLayerId( F_Paste ); item->SetTypeName( _HKI( "Top Solder Paste" ) ); Add( item ); } if( enabledLayer[F_Mask] ) { BOARD_STACKUP_ITEM* item = new BOARD_STACKUP_ITEM( BS_ITEM_TYPE_SOLDERMASK ); item->SetBrdLayerId( F_Mask ); item->SetTypeName( _HKI( "Top Solder Mask" ) ); Add( item ); } // Add copper and dielectric layers for( int ii = 0; ii < copperLayerCount; ii++ ) { BOARD_STACKUP_ITEM* item = new BOARD_STACKUP_ITEM( BS_ITEM_TYPE_COPPER ); item->SetBrdLayerId( ( PCB_LAYER_ID )ii ); item->SetTypeName( KEY_COPPER ); Add( item ); if( ii == copperLayerCount-1 ) { item->SetBrdLayerId( B_Cu ); break; } // Add the dielectric layer: item = new BOARD_STACKUP_ITEM( BS_ITEM_TYPE_DIELECTRIC ); item->SetThickness( diel_thickness ); item->SetDielectricLayerId( dielectric_idx + 1 ); // Display a dielectric default layer name: if( (dielectric_idx & 1) == 0 ) { item->SetTypeName( KEY_CORE ); item->SetMaterial( "FR4" ); } else { item->SetTypeName( KEY_PREPREG ); item->SetMaterial( "FR4" ); } Add( item ); dielectric_idx++; } // Add silk screen, solder mask and solder paste layers on bottom if( enabledLayer[B_Mask] ) { BOARD_STACKUP_ITEM* item = new BOARD_STACKUP_ITEM( BS_ITEM_TYPE_SOLDERMASK ); item->SetBrdLayerId( B_Mask ); item->SetTypeName( _HKI( "Bottom Solder Mask" ) ); Add( item ); } if( enabledLayer[B_Paste] ) { BOARD_STACKUP_ITEM* item = new BOARD_STACKUP_ITEM( BS_ITEM_TYPE_SOLDERPASTE ); item->SetBrdLayerId( B_Paste ); item->SetTypeName( _HKI( "Bottom Solder Paste" ) ); Add( item ); } if( enabledLayer[B_SilkS] ) { BOARD_STACKUP_ITEM* item = new BOARD_STACKUP_ITEM( BS_ITEM_TYPE_SILKSCREEN ); item->SetBrdLayerId( B_SilkS ); item->SetTypeName( _HKI( "Bottom Silk Screen" ) ); Add( item ); } // Transfer other stackup settings from aSettings if( aSettings ) { const BOARD_STACKUP& source_stackup = aSettings->GetStackupDescriptor(); m_EdgeConnectorConstraints = source_stackup.m_EdgeConnectorConstraints; m_CastellatedPads = source_stackup.m_CastellatedPads; m_EdgePlating = source_stackup.m_EdgePlating; m_FinishType = source_stackup.m_FinishType; } } void BOARD_STACKUP::FormatBoardStackup( OUTPUTFORMATTER* aFormatter, const BOARD* aBoard, int aNestLevel ) const { // Board stackup is the ordered list from top to bottom of // physical layers and substrate used to build the board. if( m_list.empty() ) return; aFormatter->Print( aNestLevel, "(stackup\n" ); int nest_level = aNestLevel+1; // Note: // Unspecified parameters are not stored in file. for( BOARD_STACKUP_ITEM* item: m_list ) { wxString layer_name; if( item->GetBrdLayerId() == UNDEFINED_LAYER ) layer_name.Printf( "dielectric %d", item->GetDielectricLayerId() ); else layer_name = LSET::Name( item->GetBrdLayerId() ); aFormatter->Print( nest_level, "(layer %s (type %s)", aFormatter->Quotew( layer_name ).c_str(), aFormatter->Quotew( item->GetTypeName() ).c_str() ); if( item->IsColorEditable() && IsPrmSpecified( item->GetColor() ) ) aFormatter->Print( 0, " (color %s)", aFormatter->Quotew( item->GetColor() ).c_str() ); for( int idx = 0; idx < item->GetSublayersCount(); idx++ ) { if( idx ) // not for the main (first) layer. { aFormatter->Print( 0, "\n" ); aFormatter->Print( nest_level+1, "addsublayer" ); } if( item->IsThicknessEditable() ) { if( item->GetType() == BS_ITEM_TYPE_DIELECTRIC && item->IsThicknessLocked( idx ) ) aFormatter->Print( 0, " (thickness %s locked)", FormatInternalUnits( item->GetThickness( idx ) ).c_str() ); else aFormatter->Print( 0, " (thickness %s)", FormatInternalUnits( item->GetThickness( idx ) ).c_str() ); } if( item->HasMaterialValue( idx ) ) aFormatter->Print( 0, " (material %s)", aFormatter->Quotew( item->GetMaterial( idx ) ).c_str() ); if( item->HasEpsilonRValue() && item->HasMaterialValue( idx ) ) aFormatter->Print( 0, " (epsilon_r %g)", item->GetEpsilonR( idx ) ); if( item->HasLossTangentValue() && item->HasMaterialValue( idx ) ) aFormatter->Print( 0, " (loss_tangent %s)", Double2Str(item->GetLossTangent( idx ) ).c_str() ); } aFormatter->Print( 0, ")\n" ); } // Other infos about board, related to layers and other fabrication specifications if( IsPrmSpecified( m_FinishType ) ) aFormatter->Print( nest_level, "(copper_finish %s)\n", aFormatter->Quotew( m_FinishType ).c_str() ); aFormatter->Print( nest_level, "(dielectric_constraints %s)\n", m_HasDielectricConstrains ? "yes" : "no" ); if( m_EdgeConnectorConstraints > 0 ) aFormatter->Print( nest_level, "(edge_connector %s)\n", m_EdgeConnectorConstraints > 1 ? "bevelled": "yes" ); if( m_CastellatedPads ) aFormatter->Print( nest_level, "(castellated_pads yes)\n" ); if( m_EdgePlating ) aFormatter->Print( nest_level, "(edge_plating yes)\n" ); aFormatter->Print( aNestLevel, ")\n" ); } bool IsPrmSpecified( const wxString& aPrmValue ) { // return true if the param value is specified: if( !aPrmValue.IsEmpty() && ( aPrmValue.CmpNoCase( NotSpecifiedPrm() ) != 0 ) && aPrmValue != wxGetTranslation( NotSpecifiedPrm() ) ) return true; return false; }