kicad/demos/tiny_tapeout/pcba/gerber/v0p9p4/tinytapeout-demo-job.gbrjob

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{
"Header": {
"GenerationSoftware": {
"Vendor": "KiCad",
"Application": "Pcbnew",
"Version": "7.0.9-7.0.9~ubuntu22.04.1"
},
"CreationDate": "2023-12-15T15:20:45-05:00"
},
"GeneralSpecs": {
"ProjectId": {
"Name": "tinytapeout-demo",
"GUID": "74696e79-7461-4706-956f-75742d64656d",
"Revision": "0.9.4"
},
"Size": {
"X": 104.6,
"Y": 81.1
},
"LayerNumber": 4,
"BoardThickness": 1.5625,
"Finish": "None",
"ImpedanceControlled": true
},
"DesignRules": [
{
"Layers": "Outer",
"PadToPad": 0.18,
"PadToTrack": 0.18,
"TrackToTrack": 0.2,
"MinLineWidth": 0.16,
"TrackToRegion": 0.25,
"RegionToRegion": 0.25
},
{
"Layers": "Inner",
"PadToPad": 0.18,
"PadToTrack": 0.18,
"TrackToTrack": 0.2,
"MinLineWidth": 0.23,
"TrackToRegion": 0.25,
"RegionToRegion": 0.25
}
],
"FilesAttributes": [
{
"Path": "tinytapeout-demo-F_Cu.gbr",
"FileFunction": "Copper,L1,Top",
"FilePolarity": "Positive"
},
{
"Path": "tinytapeout-demo-In1_Cu.gbr",
"FileFunction": "Copper,L2,Inr",
"FilePolarity": "Positive"
},
{
"Path": "tinytapeout-demo-In2_Cu.gbr",
"FileFunction": "Copper,L3,Inr",
"FilePolarity": "Positive"
},
{
"Path": "tinytapeout-demo-B_Cu.gbr",
"FileFunction": "Copper,L4,Bot",
"FilePolarity": "Positive"
},
{
"Path": "tinytapeout-demo-F_Paste.gbr",
"FileFunction": "SolderPaste,Top",
"FilePolarity": "Positive"
},
{
"Path": "tinytapeout-demo-B_Paste.gbr",
"FileFunction": "SolderPaste,Bot",
"FilePolarity": "Positive"
},
{
"Path": "tinytapeout-demo-F_Silkscreen.gbr",
"FileFunction": "Legend,Top",
"FilePolarity": "Positive"
},
{
"Path": "tinytapeout-demo-B_Silkscreen.gbr",
"FileFunction": "Legend,Bot",
"FilePolarity": "Positive"
},
{
"Path": "tinytapeout-demo-F_Mask.gbr",
"FileFunction": "SolderMask,Top",
"FilePolarity": "Negative"
},
{
"Path": "tinytapeout-demo-B_Mask.gbr",
"FileFunction": "SolderMask,Bot",
"FilePolarity": "Negative"
},
{
"Path": "tinytapeout-demo-Edge_Cuts.gbr",
"FileFunction": "Profile",
"FilePolarity": "Positive"
},
{
"Path": "tinytapeout-demo-User_2.gbr",
"FileFunction": "Other,User",
"FilePolarity": "Positive"
}
],
"MaterialStackup": [
{
"Type": "Legend",
"Color": "White",
"Name": "Top Silk Screen"
},
{
"Type": "SolderPaste",
"Name": "Top Solder Paste"
},
{
"Type": "SolderMask",
"Color": "Green",
"Thickness": 0.01,
"Name": "Top Solder Mask"
},
{
"Type": "Copper",
"Thickness": 0.035,
"Name": "F.Cu"
},
{
"Type": "Dielectric",
"Color": "R109G116B75",
"Thickness": 0.0681,
"Material": "R-1551(W)",
"DielectricConstant": "4.3",
"LossTangent": "0.02",
"Name": "F.Cu/In1.Cu (1/2)",
"Notes": "Type: dielectric layer 1 - 1/2 (from F.Cu to In1.Cu)"
},
{
"Type": "Dielectric",
"Color": "R109G116B75",
"Thickness": 0.0681,
"Material": "R-1551(W)",
"DielectricConstant": "4.3",
"LossTangent": "0.02",
"Name": "F.Cu/In1.Cu (2/2)",
"Notes": "Type: dielectric layer 1 - 2/2 (from F.Cu to In1.Cu)"
},
{
"Type": "Copper",
"Thickness": 0.035,
"Name": "In1.Cu"
},
{
"Type": "Dielectric",
"Color": "R109G116B75",
"Thickness": 1.13,
"Material": "R-1566(W)",
"DielectricConstant": "4.6",
"LossTangent": "0.02",
"Name": "In1.Cu/In2.Cu",
"Notes": "Type: dielectric layer 2 (from In1.Cu to In2.Cu)"
},
{
"Type": "Copper",
"Thickness": 0.035,
"Name": "In2.Cu"
},
{
"Type": "Dielectric",
"Color": "R109G116B75",
"Thickness": 0.0681,
"Material": "R-1551(W)",
"DielectricConstant": "4.3",
"LossTangent": "0.02",
"Name": "In2.Cu/B.Cu (1/2)",
"Notes": "Type: dielectric layer 3 - 1/2 (from In2.Cu to B.Cu)"
},
{
"Type": "Dielectric",
"Color": "R109G116B75",
"Thickness": 0.0681,
"Material": "R-1551(W)",
"DielectricConstant": "4.3",
"LossTangent": "0.02",
"Name": "In2.Cu/B.Cu (2/2)",
"Notes": "Type: dielectric layer 3 - 2/2 (from In2.Cu to B.Cu)"
},
{
"Type": "Copper",
"Thickness": 0.035,
"Name": "B.Cu"
},
{
"Type": "SolderMask",
"Color": "Green",
"Thickness": 0.01,
"Name": "Bottom Solder Mask"
},
{
"Type": "SolderPaste",
"Name": "Bottom Solder Paste"
},
{
"Type": "Legend",
"Color": "White",
"Name": "Bottom Silk Screen"
}
]
}