300 lines
12 KiB
C++
300 lines
12 KiB
C++
/**************************************************************/
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/* pcbstruct.h : definition des structures de donnees type PCB */
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/**************************************************************/
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#ifndef PCBSTRUCT_H
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#define PCBSTRUCT_H
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#include "base_struct.h"
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// Definitions relatives aux libariries
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#define ENTETE_LIBRAIRIE "PCBNEW-LibModule-V1"
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#define ENTETE_LIBDOC "PCBNEW-LibDoc----V1"
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#define L_ENTETE_LIB 18
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#define EXT_CMP wxT( ".emp" )
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#define EXT_CMP_MASK wxT( "*.emp" )
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#define EXT_DOC wxT( ".mdc" )
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/* Bits indicateurs du membre .Status, pour pistes, modules... */
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#define FLAG1 0x2000 /* flag libre pour calculs locaux */
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#define FLAG0 0x1000 /* flag libre pour calculs locaux */
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#define BEGIN_ONPAD 0x800 /* flag indiquant un debut de segment sur pad */
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#define END_ONPAD 0x400 /* flag indiquant une fin de segment sur pad */
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#define BUSY 0x0200 /* flag indiquant que la structure a deja
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* ete examinee, dans certaines routines */
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#define DELETED 0x0100 /* Bit flag de Status pour structures effacee
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* et mises en chaine "DELETED" */
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#define NO_TRACE 0x80 /* l'element ne doit pas etre affiche */
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#define SURBRILL 0x20 /* element en surbrillance */
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#define DRAG 0x10 /* segment en mode drag */
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#define EDIT 0x8 /* element en cours d'edition */
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#define SEGM_FIXE 0x04 /* segment FIXE ( pas d'effacement global ) */
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#define SEGM_AR 0x02 /* segment Auto_Route */
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#define CHAIN 0x01 /* segment marque */
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/* Layer identification (layer number) */
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#define FIRST_COPPER_LAYER 0
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#define COPPER_LAYER_N 0
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#define LAYER_N_2 1 /* Numero layer 2 */
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#define LAYER_N_3 2 /* Numero layer 3 */
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#define LAYER_N_4 3 /* Numero layer 4 */
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#define LAYER_N_5 4 /* Numero layer 5 */
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#define LAYER_N_6 5 /* Numero layer 6 */
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#define LAYER_N_7 6 /* Numero layer 7 */
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#define LAYER_N_8 7 /* Numero layer 8 */
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#define LAYER_N_9 8 /* Numero layer 9 */
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#define LAYER_N_10 9 /* Numero layer 10 */
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#define LAYER_N_11 10 /* Numero layer 11 */
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#define LAYER_N_12 11 /* Numero layer 12 */
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#define LAYER_N_13 12 /* Numero layer 13 */
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#define LAYER_N_14 13 /* Numero layer 14 */
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#define LAYER_N_15 14 /* Numero layer 15 */
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#define LAYER_CMP_N 15
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#define CMP_N 15
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#define LAST_COPPER_LAYER 15
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#define NB_COPPER_LAYERS (LAST_COPPER_LAYER + 1)
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#define FIRST_NO_COPPER_LAYER 16
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#define ADHESIVE_N_CU 16
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#define ADHESIVE_N_CMP 17
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#define SOLDERPASTE_N_CU 18
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#define SOLDERPASTE_N_CMP 19
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#define SILKSCREEN_N_CU 20
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#define SILKSCREEN_N_CMP 21
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#define SOLDERMASK_N_CU 22
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#define SOLDERMASK_N_CMP 23
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#define DRAW_N 24
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#define COMMENT_N 25
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#define ECO1_N 26
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#define ECO2_N 27
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#define EDGE_N 28
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#define LAST_NO_COPPER_LAYER 28
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#define NB_LAYERS (LAST_NO_COPPER_LAYER + 1)
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#define LAYER_COUNT 32
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/*************************************/
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/* constantes de gestion des couches */
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/*************************************/
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#define CUIVRE_LAYER (1 << COPPER_LAYER_N) ///< bit mask for copper layer
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#define LAYER_2 (1 << LAYER_N_2) ///< bit mask for layer 2
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#define LAYER_3 (1 << LAYER_N_3) ///< bit mask for layer 3
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#define LAYER_4 (1 << LAYER_N_4) ///< bit mask for layer 4
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#define LAYER_5 (1 << LAYER_N_5) ///< bit mask for layer 5
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#define LAYER_6 (1 << LAYER_N_6) ///< bit mask for layer 6
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#define LAYER_7 (1 << LAYER_N_7) ///< bit mask for layer 7
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#define LAYER_8 (1 << LAYER_N_8) ///< bit mask for layer 8
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#define LAYER_9 (1 << LAYER_N_9) ///< bit mask for layer 9
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#define LAYER_10 (1 << LAYER_N_10) ///< bit mask for layer 10
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#define LAYER_11 (1 << LAYER_N_11) ///< bit mask for layer 11
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#define LAYER_12 (1 << LAYER_N_12) ///< bit mask for layer 12
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#define LAYER_13 (1 << LAYER_N_13) ///< bit mask for layer 13
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#define LAYER_14 (1 << LAYER_N_14) ///< bit mask for layer 14
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#define LAYER_15 (1 << LAYER_N_15) ///< bit mask for layer 15
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#define CMP_LAYER (1 << LAYER_CMP_N) ///< bit mask for component layer
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#define ADHESIVE_LAYER_CU (1 << ADHESIVE_N_CU)
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#define ADHESIVE_LAYER_CMP (1 << ADHESIVE_N_CMP)
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#define SOLDERPASTE_LAYER_CU (1 << SOLDERPASTE_N_CU)
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#define SOLDERPASTE_LAYER_CMP (1 << SOLDERPASTE_N_CMP)
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#define SILKSCREEN_LAYER_CU (1 << SILKSCREEN_N_CU)
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#define SILKSCREEN_LAYER_CMP (1 << SILKSCREEN_N_CMP)
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#define SOLDERMASK_LAYER_CU (1 << SOLDERMASK_N_CU)
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#define SOLDERMASK_LAYER_CMP (1 << SOLDERMASK_N_CMP)
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#define DRAW_LAYER (1 << DRAW_N)
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#define COMMENT_LAYER (1 << COMMENT_N)
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#define ECO1_LAYER (1 << ECO1_N)
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#define ECO2_LAYER (1 << ECO2_N)
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#define EDGE_LAYER (1 << EDGE_N)
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#define FIRST_NON_COPPER_LAYER ADHESIVE_N_CU
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#define LAST_NON_COPPER_LAYER EDGE_N
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// extra bits 0xE0000000
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/* masques generaux : */
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#define ALL_LAYERS 0x1FFFFFFF
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#define ALL_NO_CU_LAYERS 0x1FFF0000
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#define ALL_CU_LAYERS 0x0000FFFF
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#define INTERNAL_LAYERS 0x00007FFE /* Bits layers internes */
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#define EXTERNAL_LAYERS 0x00008001
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/* Forme des segments (pistes, contours ..) ( parametre .shape ) */
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enum Track_Shapes {
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S_SEGMENT = 0, /* segment rectiligne */
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S_RECT, /* segment forme rect (i.e. bouts non arrondis) */
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S_ARC, /* segment en arc de cercle (bouts arrondis)*/
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S_CIRCLE, /* segment en cercle (anneau)*/
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S_ARC_RECT, /* segment en arc de cercle (bouts droits) (GERBER)*/
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S_SPOT_OVALE, /* spot ovale (for GERBER)*/
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S_SPOT_CIRCLE, /* spot rond (for GERBER)*/
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S_SPOT_RECT, /* spot rect (for GERBER)*/
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S_POLYGON /* polygon shape */
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};
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/* Forward declaration */
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class EQUIPOT;
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class MARKER;
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struct CHEVELU;
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//class Ki_PageDescr;
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//class DrawBlockStruct;
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/* main window classes : */
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#include "wxPcbStruct.h"
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/* Class to handle a board */
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#include "class_board.h"
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// Class for handle current printed board design settings
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#define HISTORY_NUMBER 8
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class EDA_BoardDesignSettings
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{
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public:
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int m_CopperLayerCount; // Number of copper layers for this design
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int m_ViaDrill; // via drill (for the entire board)
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int m_ViaDrillCustomValue; // via drill for vias which must have a defined drill value
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int m_MicroViaDrill; // micro via drill (for the entire board)
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int m_CurrentViaSize; // Current via size
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int m_CurrentMicroViaSize; // Current micro via size
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bool m_MicroViasAllowed; // true to allow micro vias
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int m_ViaSizeHistory[HISTORY_NUMBER]; // Last HISTORY_NUMBER used via sizes
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int m_CurrentViaType; // via type (VIA_BLIND_BURIED, VIA_TROUGHT VIA_MICROVIA)
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int m_CurrentTrackWidth; // current track width
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bool m_UseConnectedTrackWidth; // if true, when creating a new track starting on an existing track, use this track width
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int m_TrackWidthHistory[HISTORY_NUMBER]; // Last HISTORY_NUMBER used track widths
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int m_DrawSegmentWidth; // current graphic line width (not EDGE layer)
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int m_EdgeSegmentWidth; // current graphic line width (EDGE layer only)
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int m_PcbTextWidth; // current Pcb (not module) Text width
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wxSize m_PcbTextSize; // current Pcb (not module) Text size
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int m_TrackClearence; // track to track and track to pads clearance
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int m_ZoneClearence; // zone to track and zone to pads clearance
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int m_MaskMargin; // Solder mask margin
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// Color options for screen display of the Printed Board:
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int m_PcbGridColor; // Grid color
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int m_LayerColor[32]; // Layer colors (tracks and graphic items)
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int m_ViaColor[4]; // Via color (depending on is type)
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int m_ModuleTextCMPColor; // Text module color for modules on the COMPONENT layer
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int m_ModuleTextCUColor; // Text module color for modules on the COPPER layer
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int m_ModuleTextNOVColor; // Text module color for "invisible" texts (must be BLACK if really not displayed)
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int m_AnchorColor; // Anchor color for modules and texts
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int m_PadCUColor; // Pad color for the COPPER side of the pad
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int m_PadCMPColor; // Pad color for the COMPONENT side of the pad
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// Pad color for the pads of both sides is m_PadCUColor OR m_PadCMPColor (in terms of colors)
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int m_RatsnestColor; // Ratsnest color
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public:
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EDA_BoardDesignSettings();
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/**
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* Function GetVisibleLayers
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* returns a bit-map of all the layers that are visible.
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* @return int - the visible layers in bit-mapped form.
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*/
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int GetVisibleLayers() const;
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};
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// Values for m_DisplayViaMode member:
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enum DisplayViaMode {
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VIA_HOLE_NOT_SHOW = 0,
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VIA_SPECIAL_HOLE_SHOW,
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ALL_VIA_HOLE_SHOW,
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OPT_VIA_HOLE_END
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};
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/* Handle info to display a board */
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class PCB_SCREEN : public BASE_SCREEN
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{
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public:
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int m_Active_Layer; /* ref couche active */
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int m_Route_Layer_TOP; /* ref couches actives */
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int m_Route_Layer_BOTTOM; /* pour placement vias et routage 2 couches */
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public:
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PCB_SCREEN( int idscreen );
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~PCB_SCREEN();
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PCB_SCREEN* Next() { return (PCB_SCREEN*) Pnext; }
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void Init();
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void SetNextZoom();
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void SetPreviousZoom();
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void SetLastZoom();
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/**
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* Function GetCurItem
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* returns the currently selected BOARD_ITEM, overriding BASE_SCREEN::GetCurItem().
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* @return BOARD_ITEM* - the one selected, or NULL.
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*/
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BOARD_ITEM* GetCurItem() const { return (BOARD_ITEM*) BASE_SCREEN::GetCurItem(); }
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/* Return true if a microvia can be put on board
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* A microvia ia a small via restricted to 2 near neighbour layers
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* because its is hole is made by laser which can penetrate only one layer
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* It is mainly used to connect BGA to the first inner layer
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* And it is allowed from an external layer to the first inner layer
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*/
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bool IsMicroViaAcceptable( void );
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};
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/**********************************/
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/* Module (Footprint) description */
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/**********************************/
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#include "class_pad.h" // class for pads
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#include "class_edge_mod.h" // Class for footprint graphic elements
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#include "class_text_mod.h" // Class for footprint fields
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#include "class_module.h" // Class for the footprint
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#include "class_equipot.h"
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/***********************************/
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/* Description des elements du PCB */
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/***********************************/
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#include "class_drawsegment.h"
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#include "class_pcb_text.h"
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#include "class_cotation.h"
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#include "class_mire.h"
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#include "class_track.h"
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#include "class_marker.h"
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#include "class_zone.h"
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class DISPLAY_OPTIONS
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{
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public:
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bool DisplayPadFill;
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bool DisplayPadNum;
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bool DisplayPadNoConn;
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bool DisplayPadIsol;
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int DisplayModEdge;
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int DisplayModText;
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bool DisplayPcbTrackFill; /* FALSE = sketch , TRUE = filled */
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bool DisplayTrackIsol;
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int m_DisplayViaMode; /* 0 do not show via hole,
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* 1 show via hole for non default value
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* 2 show all via hole */
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bool DisplayPolarCood;
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bool DisplayZones;
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bool Show_Modules_Cmp;
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bool Show_Modules_Cu;
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int DisplayDrawItems;
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bool ContrastModeDisplay;
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public:
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DISPLAY_OPTIONS();
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};
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#endif /* PCBSTRUCT_H */
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