kicad/pcbnew/padstack.h

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/*
* This program source code file is part of KiCad, a free EDA CAD application.
*
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* Copyright (C) 2024 Jon Evans <jon@craftyjon.com>
* Copyright (C) 2024 KiCad Developers, see AUTHORS.txt for contributors.
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*
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* This program is free software: you can redistribute it and/or modify it
* under the terms of the GNU General Public License as published by the
* Free Software Foundation, either version 3 of the License, or (at your
* option) any later version.
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*
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* This program is distributed in the hope that it will be useful, but
* WITHOUT ANY WARRANTY; without even the implied warranty of
* MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the GNU
* General Public License for more details.
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*
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* You should have received a copy of the GNU General Public License along
* with this program. If not, see <http://www.gnu.org/licenses/>.
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*/
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#ifndef KICAD_PADSTACK_H
#define KICAD_PADSTACK_H
#include <memory>
#include <optional>
#include <wx/string.h>
#include <api/serializable.h>
#include <geometry/eda_angle.h>
#include <layer_ids.h>
#include <math/vector2d.h>
#include <properties/property.h>
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#include <zones.h>
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class BOARD_ITEM;
class PCB_SHAPE;
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/**
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* The set of pad shapes, used with PAD::{Set,Get}Shape()
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*
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* --> DO NOT REORDER, PCB_IO_KICAD_LEGACY is dependent on the integer values <--
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*/
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enum class PAD_SHAPE : int
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{
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CIRCLE,
RECTANGLE, // do not use just RECT: it collides in a header on MSYS2
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OVAL,
TRAPEZOID,
ROUNDRECT,
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// Rectangle with a chamfered corner ( and with rounded other corners).
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CHAMFERED_RECT,
CUSTOM // A shape defined by user, using a set of basic shapes
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// (thick segments, circles, arcs, polygons).
};
/**
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* The set of pad drill shapes, used with PAD::{Set,Get}DrillShape()
*/
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enum class PAD_DRILL_SHAPE
{
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CIRCLE,
OBLONG,
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};
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/**
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* The set of pad shapes, used with PAD::{Set,Get}Attribute().
*
* The double name is for convenience of Python devs
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*/
enum class PAD_ATTRIB
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{
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PTH, ///< Plated through hole pad
SMD, ///< Smd pad, appears on the solder paste layer (default)
CONN, ///< Like smd, does not appear on the solder paste layer (default)
///< Note: also has a special attribute in Gerber X files
///< Used for edgecard connectors for instance
NPTH, ///< like PAD_PTH, but not plated
///< mechanical use only, no connection allowed
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};
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/**
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* The set of pad properties used in Gerber files (Draw files, and P&P files)
* to define some properties in fabrication or test files. Also used by
* DRC to check some properties.
*/
enum class PAD_PROP
{
NONE, ///< no special fabrication property
BGA, ///< Smd pad, used in BGA footprints
FIDUCIAL_GLBL, ///< a fiducial (usually a smd) for the full board
FIDUCIAL_LOCAL, ///< a fiducial (usually a smd) local to the parent footprint
TESTPOINT, ///< a test point pad
HEATSINK, ///< a pad used as heat sink, usually in SMD footprints
CASTELLATED, ///< a pad with a castellated through hole
MECHANICAL, ///< a pad used for mechanical support
};
/**
* A PADSTACK defines the characteristics of a single or multi-layer pad, in the IPC sense of
* the word. This means that a PCB_PAD has a padstack, but also a PCB_VIA. The padstack for
* a pad defines its geometry on copper, soldermask, and paste layers, as well as any drilling
* or milling associated with the pad (round or slot hole, back-drilling, etc). Padstacks also
* define thermal relief settings for all copper layers, clearance overrides for all copper
* layers, and potentially other properties in the future. In other words, the padstack defines
* most of the geometric features of a pad on all layers. It does not define electrical properties
* or other metadata.
*
* For padstacks that do not vary between layers, F_Cu is used as the copper layer to store all
* padstack properties.
*/
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class PADSTACK : public SERIALIZABLE
{
public:
///! Padstack type, mostly for IPC-7351 naming and attributes
///! Note that TYPE::MOUNTING is probably not currently supported by KiCad
enum class TYPE
{
NORMAL, ///< Padstack for a footprint pad
VIA, ///< Padstack for a via
MOUNTING ///< A mounting hole (plated or unplated, not associated with a footprint)
};
enum class MODE
{
NORMAL, ///< Shape is the same on all layers
TOP_INNER_BOTTOM, ///< Up to three shapes can be defined (top, inner, bottom)
CUSTOM ///< Shapes can be defined on arbitrary layers
};
///! Whether or not to remove the copper shape for unconnected layers
enum class UNCONNECTED_LAYER_MODE
{
KEEP_ALL,
REMOVE_ALL,
REMOVE_EXCEPT_START_AND_END
};
enum class CUSTOM_SHAPE_ZONE_MODE
{
OUTLINE,
CONVEXHULL
};
///! The set of properties that define a pad's shape on a given layer
struct SHAPE_PROPS
{
PAD_SHAPE shape; ///< Shape of the pad
PAD_SHAPE anchor_shape; ///< Shape of the anchor when shape == PAD_SHAPE::CUSTOM
VECTOR2I size; ///< Size of the shape, or of the anchor pad for custom shape pads
/*
* Most of the time the hole is the center of the shape (m_Offset = 0). But some designers
* use oblong/rect pads with a hole moved to one of the oblong/rect pad shape ends.
* In all cases the hole is at the pad position. This offset is from the hole to the center
* of the pad shape (ie: the copper area around the hole).
* ShapePos() returns the board shape position according to the offset and the pad rotation.
*/
VECTOR2I offset; ///< Offset of the shape center from the pad center
double round_rect_corner_radius;
double round_rect_radius_ratio;
double chamfered_rect_ratio; ///< Size of chamfer: ratio of smallest of X,Y size
int chamfered_rect_positions; ///< @see RECT_CHAMFER_POSITIONS
/**
* Delta for PAD_SHAPE::TRAPEZOID; half the delta squeezes one end and half expands the
* other. It is only valid to have a single axis be non-zero.
*/
VECTOR2I trapezoid_delta_size;
SHAPE_PROPS();
bool operator==( const SHAPE_PROPS& aOther ) const;
};
/**
* The features of a padstack that can vary between copper layers
* All parameters are optional; leaving them un-set means "use parent/rule defaults"
* Pad clearances, margins, etc. exist in a hierarchy. If a given level is specified then
* the remaining levels are NOT consulted.
*
* LEVEL 1: (highest priority) local overrides (pad, footprint, etc.)
* LEVEL 2: Rules
* LEVEL 3: Accumulated local settings, netclass settings, & board design settings
*
* These are the LEVEL 1 settings (overrides) for a pad.
*/
struct COPPER_LAYER_PROPS
{
SHAPE_PROPS shape;
std::optional<ZONE_CONNECTION> zone_connection;
std::optional<int> thermal_spoke_width;
std::optional<EDA_ANGLE> thermal_spoke_angle;
std::optional<int> thermal_gap;
std::optional<int> clearance;
/*
* Editing definitions of primitives for custom pad shapes. In local coordinates relative
* to m_Pos (NOT shapePos) at orient 0.
*/
std::vector<std::shared_ptr<PCB_SHAPE>> custom_shapes;
bool operator==( const COPPER_LAYER_PROPS& aOther ) const;
};
///! The features of a padstack that can vary on outer layers.
///! All parameters are optional; leaving them un-set means "use parent/rule defaults"
struct MASK_LAYER_PROPS
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{
std::optional<int> solder_mask_margin;
std::optional<int> solder_paste_margin;
std::optional<double> solder_paste_margin_ratio;
std::optional<bool> has_solder_mask; ///< True if this outer layer has mask (is not tented)
std::optional<bool> has_solder_paste; ///< True if this outer layer has solder paste
bool operator==( const MASK_LAYER_PROPS& aOther ) const;
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};
///! The properties of a padstack drill. Drill position is always the pad position (origin).
struct DRILL_PROPS
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{
VECTOR2I size; ///< Drill diameter (x == y) or slot dimensions (x != y)
PAD_DRILL_SHAPE shape;
PCB_LAYER_ID start;
PCB_LAYER_ID end;
bool operator==( const DRILL_PROPS& aOther ) const;
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};
public:
PADSTACK( BOARD_ITEM* aParent );
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virtual ~PADSTACK() = default;
PADSTACK( const PADSTACK& aOther );
PADSTACK& operator=( const PADSTACK &aOther );
bool operator==( const PADSTACK& aOther ) const;
bool operator!=( const PADSTACK& aOther ) const { return !operator==( aOther ); }
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void Serialize( google::protobuf::Any &aContainer ) const override;
bool Deserialize( const google::protobuf::Any &aContainer ) override;
const LSET& LayerSet() const { return m_layerSet; }
LSET& LayerSet() { return m_layerSet; }
void SetLayerSet( const LSET& aSet ) { m_layerSet = aSet; }
PCB_LAYER_ID StartLayer() const;
PCB_LAYER_ID EndLayer() const;
MODE Mode() const { return m_mode; }
void SetMode( MODE aMode ) { m_mode = aMode; }
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///! Returns the name of this padstack in IPC-7351 format
wxString Name() const;
EDA_ANGLE GetOrientation() const { return m_orientation; }
void SetOrientation( EDA_ANGLE aAngle )
{
m_orientation = aAngle;
m_orientation.Normalize();
}
DRILL_PROPS& Drill() { return m_drill; }
const DRILL_PROPS& Drill() const { return m_drill; }
DRILL_PROPS& SecondaryDrill() { return m_secondaryDrill; }
const DRILL_PROPS& SecondaryDrill() const { return m_secondaryDrill; }
UNCONNECTED_LAYER_MODE UnconnectedLayerMode() const { return m_unconnectedLayerMode; }
void SetUnconnectedLayerMode( UNCONNECTED_LAYER_MODE aMode ) { m_unconnectedLayerMode = aMode; }
COPPER_LAYER_PROPS& CopperLayerDefaults() { return m_defaultCopperProps; }
const COPPER_LAYER_PROPS& CopperLayerDefaults() const { return m_defaultCopperProps; }
MASK_LAYER_PROPS& FrontOuterLayers() { return m_frontMaskProps; }
const MASK_LAYER_PROPS& FrontOuterLayers() const { return m_frontMaskProps; }
MASK_LAYER_PROPS& BackOuterLayers() { return m_backMaskProps; }
const MASK_LAYER_PROPS& BackOuterLayers() const { return m_backMaskProps; }
/**
* Checks if this padstack is tented (covered in soldermask) on the given side
* @param aSide is a front or back layer (any will do)
* @return true or false if this padstack contains a tenting override on the given layer, or
* std::nullopt if there is no override (meaning design rules should be used)
*/
std::optional<bool> IsTented( PCB_LAYER_ID aSide ) const;
CUSTOM_SHAPE_ZONE_MODE CustomShapeInZoneMode() const { return m_customShapeInZoneMode; }
void SetCustomShapeInZoneMode( CUSTOM_SHAPE_ZONE_MODE aM ) { m_customShapeInZoneMode = aM; }
// The following section has convenience getters for the padstack properties on a given layer.
PAD_SHAPE Shape( PCB_LAYER_ID aLayer = F_Cu ) const;
void SetShape( PAD_SHAPE aShape, PCB_LAYER_ID aLayer = F_Cu );
VECTOR2I& Size( PCB_LAYER_ID aLayer = F_Cu );
const VECTOR2I& Size( PCB_LAYER_ID aLayer = F_Cu ) const;
PAD_DRILL_SHAPE DrillShape( PCB_LAYER_ID aLayer = F_Cu ) const;
void SetDrillShape( PAD_DRILL_SHAPE aShape, PCB_LAYER_ID aLayer = F_Cu );
VECTOR2I& Offset( PCB_LAYER_ID aLayer = F_Cu );
const VECTOR2I& Offset( PCB_LAYER_ID aLayer = F_Cu ) const;
PAD_SHAPE AnchorShape( PCB_LAYER_ID aLayer = F_Cu ) const;
void SetAnchorShape( PAD_SHAPE aShape, PCB_LAYER_ID aLayer = F_Cu );
VECTOR2I& TrapezoidDeltaSize( PCB_LAYER_ID aLayer = F_Cu );
const VECTOR2I& TrapezoidDeltaSize( PCB_LAYER_ID aLayer = F_Cu ) const;
double RoundRectRadiusRatio( PCB_LAYER_ID aLayer = F_Cu ) const;
void SetRoundRectRadiusRatio( double aRatio, PCB_LAYER_ID aLayer = F_Cu );
int RoundRectRadius( PCB_LAYER_ID aLayer = F_Cu ) const;
void SetRoundRectRadius( double aRadius, PCB_LAYER_ID aLayer = F_Cu );
double ChamferRatio( PCB_LAYER_ID aLayer = F_Cu ) const;
void SetChamferRatio( double aRatio, PCB_LAYER_ID aLayer = F_Cu );
int& ChamferPositions( PCB_LAYER_ID aLayer = F_Cu );
const int& ChamferPositions( PCB_LAYER_ID aLayer = F_Cu ) const;
void SetChamferPositions( int aPositions, PCB_LAYER_ID aLayer = F_Cu );
std::optional<int>& Clearance( PCB_LAYER_ID aLayer = F_Cu );
const std::optional<int>& Clearance( PCB_LAYER_ID aLayer = F_Cu ) const;
std::optional<int>& SolderMaskMargin( PCB_LAYER_ID aLayer = F_Cu );
const std::optional<int>& SolderMaskMargin( PCB_LAYER_ID aLayer = F_Cu ) const;
std::optional<int>& SolderPasteMargin( PCB_LAYER_ID aLayer = F_Cu );
const std::optional<int>& SolderPasteMargin( PCB_LAYER_ID aLayer = F_Cu ) const;
std::optional<double>& SolderPasteMarginRatio( PCB_LAYER_ID aLayer = F_Cu );
const std::optional<double>& SolderPasteMarginRatio( PCB_LAYER_ID aLayer = F_Cu ) const;
std::optional<ZONE_CONNECTION>& ZoneConnection( PCB_LAYER_ID aLayer = F_Cu );
const std::optional<ZONE_CONNECTION>& ZoneConnection( PCB_LAYER_ID aLayer = F_Cu ) const;
std::optional<int>& ThermalSpokeWidth( PCB_LAYER_ID aLayer = F_Cu );
const std::optional<int>& ThermalSpokeWidth( PCB_LAYER_ID aLayer = F_Cu ) const;
std::optional<int>& ThermalGap( PCB_LAYER_ID aLayer = F_Cu );
const std::optional<int>& ThermalGap( PCB_LAYER_ID aLayer = F_Cu ) const;
EDA_ANGLE ThermalSpokeAngle( PCB_LAYER_ID aLayer = F_Cu ) const;
void SetThermalSpokeAngle( EDA_ANGLE aAngle, PCB_LAYER_ID aLayer = F_Cu );
std::vector<std::shared_ptr<PCB_SHAPE>>& Primitives( PCB_LAYER_ID aLayer = F_Cu );
const std::vector<std::shared_ptr<PCB_SHAPE>>& Primitives( PCB_LAYER_ID aLayer = F_Cu ) const;
/**
* Adds a custom shape primitive to the padstack.
* @param aShape is a shape to add as a custom primitive. Ownership is passed to this PADSTACK.
* @param aLayer is the padstack layer to add to.
*/
void AddPrimitive( PCB_SHAPE* aShape, PCB_LAYER_ID aLayer = F_Cu );
/**
* Appends a copy of each shape in the given list to this padstack's custom shape list
* @param aPrimitivesList is a list of shapes to add copies of to this PADSTACK
* @param aLayer is the padstack layer to add to.
*/
void AppendPrimitives( const std::vector<std::shared_ptr<PCB_SHAPE>>& aPrimitivesList,
PCB_LAYER_ID aLayer = F_Cu );
/**
* Clears the existing primitive list (freeing the owned shapes) and adds copies of the given
* shapes to the padstack for the given layer.
* @param aPrimitivesList is a list of shapes to add copies of to this PADSTACK
* @param aLayer is the padstack layer to add to.
*/
void ReplacePrimitives( const std::vector<std::shared_ptr<PCB_SHAPE>>& aPrimitivesList,
PCB_LAYER_ID aLayer = F_Cu );
void ClearPrimitives( PCB_LAYER_ID aLayer = F_Cu );
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private:
///! The BOARD_ITEM this PADSTACK belongs to; will be used as the parent for owned shapes
BOARD_ITEM* m_parent;
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///! The copper layer variation mode this padstack is in
MODE m_mode;
///! The board layers that this padstack is active on
LSET m_layerSet;
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///! An override for the IPC-7351 padstack name
wxString m_customName;
///! The rotation of the pad relative to an outer reference frame
EDA_ANGLE m_orientation;
///! The properties applied to copper layers if they aren't overridden
COPPER_LAYER_PROPS m_defaultCopperProps;
///! The overrides applied to front outer technical layers
MASK_LAYER_PROPS m_frontMaskProps;
///! The overrides applied to back outer technical layers
MASK_LAYER_PROPS m_backMaskProps;
UNCONNECTED_LAYER_MODE m_unconnectedLayerMode;
/**
* How to build the custom shape in zone, to create the clearance area:
* CUSTOM_SHAPE_ZONE_MODE::OUTLINE = use pad shape
* CUSTOM_SHAPE_ZONE_MODE::CONVEXHULL = use the convex hull of the pad shape
*/
CUSTOM_SHAPE_ZONE_MODE m_customShapeInZoneMode;
///! Any entries here override the copper layer settings on the given copper layer.
///! If m_mode == MODE::TOP_INNER_BOTTOM, the inner layer setting is always In1_Cu and the only
///! keys in this map that are used are F_Cu, In1_Cu, and B_Cu.
///! If m_mode == MODE::NORMAL, this map is ignored.
std::unordered_map<PCB_LAYER_ID, COPPER_LAYER_PROPS> m_copperOverrides;
///! The primary drill parameters, which also define the start and end layers for through-hole
///! vias and pads (F_Cu to B_Cu for normal holes; a subset of layers for blind/buried vias)
DRILL_PROPS m_drill;
///! Secondary drill, used to define back-drilling
DRILL_PROPS m_secondaryDrill;
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};
#ifndef SWIG
DECLARE_ENUM_TO_WXANY( PADSTACK::UNCONNECTED_LAYER_MODE );
#endif
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#endif //KICAD_PADSTACK_H