kicad/pcbnew/class_board_design_settings...

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/*
* This program source code file is part of KiCad, a free EDA CAD application.
*
* Copyright (C) 1992-2012 KiCad Developers, see AUTHORS.txt for contributors.
*
* This program is free software; you can redistribute it and/or
* modify it under the terms of the GNU General Public License
* as published by the Free Software Foundation; either version 2
* of the License, or (at your option) any later version.
*
* This program is distributed in the hope that it will be useful,
* but WITHOUT ANY WARRANTY; without even the implied warranty of
* MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the
* GNU General Public License for more details.
*
* You should have received a copy of the GNU General Public License
* along with this program; if not, you may find one here:
* http://www.gnu.org/licenses/old-licenses/gpl-2.0.html
* or you may search the http://www.gnu.org website for the version 2 license,
* or you may write to the Free Software Foundation, Inc.,
* 51 Franklin Street, Fifth Floor, Boston, MA 02110-1301, USA
*/
/**
* @file class_board_design_settings.cpp
* BOARD_DESIGN_SETTINGS class functions.
*/
#include <fctsys.h>
#include <common.h>
#include <layers_id_colors_and_visibility.h>
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#include <pcbnew.h>
#include <class_board_design_settings.h>
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#include <class_track.h>
#include <convert_from_iu.h>
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// Board thickness, mainly for 3D view:
#define DEFAULT_BOARD_THICKNESS_MM 1.6
// Default values for some board items
#define DEFAULT_TEXT_PCB_SIZE Millimeter2iu( 1.5 )
#define DEFAULT_TEXT_PCB_THICKNESS Millimeter2iu( 0.3 )
#define DEFAULT_PCB_EDGE_THICKNESS Millimeter2iu( 0.15 )
#define DEFAULT_GRAPHIC_THICKNESS Millimeter2iu( 0.2 )
#define DEFAULT_TEXT_MODULE_SIZE Millimeter2iu( 1.5 )
#define DEFAULT_GR_MODULE_THICKNESS Millimeter2iu( 0.15 )
#define DEFAULT_SOLDERMASK_CLEARANCE Millimeter2iu( 0.2 )
#define DEFAULT_SOLDERMASK_MIN_WIDTH Millimeter2iu( 0.0 )
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BOARD_DESIGN_SETTINGS::BOARD_DESIGN_SETTINGS() :
m_Pad_Master( 0 )
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{
m_EnabledLayers = ALL_LAYERS; // All layers enabled at first.
// SetCopperLayerCount() will adjust this.
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SetVisibleLayers( FULL_LAYERS );
// set all but hidden text as visible.
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m_VisibleElements = ~( 1 << MOD_TEXT_INVISIBLE );
SetCopperLayerCount( 2 ); // Default design is a double sided board
// via type (VIA_BLIND_BURIED, VIA_THROUGH VIA_MICROVIA).
m_CurrentViaType = VIA_THROUGH;
// if true, when creating a new track starting on an existing track, use this track width
m_UseConnectedTrackWidth = false;
m_MicroViasAllowed = false; // true to allow micro vias
m_DrawSegmentWidth = DEFAULT_GRAPHIC_THICKNESS; // current graphic line width (not EDGE layer)
m_EdgeSegmentWidth = DEFAULT_PCB_EDGE_THICKNESS; // current graphic line width (EDGE layer only)
m_PcbTextWidth = DEFAULT_TEXT_PCB_THICKNESS; // current Pcb (not module) Text width
m_PcbTextSize = wxSize( DEFAULT_TEXT_PCB_SIZE,
DEFAULT_TEXT_PCB_SIZE ); // current Pcb (not module) Text size
m_TrackMinWidth = DMils2iu( 100 ); // track min value for width ((min copper size value
m_ViasMinSize = DMils2iu( 350 ); // vias (not micro vias) min diameter
m_ViasMinDrill = DMils2iu( 200 ); // vias (not micro vias) min drill diameter
m_MicroViasMinSize = DMils2iu( 200 ); // micro vias (not vias) min diameter
m_MicroViasMinDrill = DMils2iu( 50 ); // micro vias (not vias) min drill diameter
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// Global mask margins:
m_SolderMaskMargin = DEFAULT_SOLDERMASK_CLEARANCE; // Solder mask margin
m_SolderMaskMinWidth = DEFAULT_SOLDERMASK_MIN_WIDTH; // Solder mask min width
m_SolderPasteMargin = 0; // Solder paste margin absolute value
m_SolderPasteMarginRatio = 0.0; // Solder pask margin ratio value of pad size
// The final margin is the sum of these 2 values
// Usually < 0 because the mask is smaller than pad
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m_ModuleTextSize = wxSize( DEFAULT_TEXT_MODULE_SIZE,
DEFAULT_TEXT_MODULE_SIZE );
m_ModuleTextWidth = DEFAULT_GR_MODULE_THICKNESS;
m_ModuleSegmentWidth = DEFAULT_GR_MODULE_THICKNESS;
// Layer thickness for 3D viewer
m_boardThickness = Millimeter2iu( DEFAULT_BOARD_THICKNESS_MM );
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}
// Add parameters to save in project config.
// values are saved in mm
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void BOARD_DESIGN_SETTINGS::AppendConfigs( PARAM_CFG_ARRAY* aResult )
{
m_Pad_Master.AppendConfigs( aResult );
aResult->push_back( new PARAM_CFG_INT_WITH_SCALE( wxT( "PcbTextSizeV" ),
&m_PcbTextSize.y,
DEFAULT_TEXT_PCB_SIZE, TEXTS_MIN_SIZE, TEXTS_MAX_SIZE,
NULL, MM_PER_IU ) );
aResult->push_back( new PARAM_CFG_INT_WITH_SCALE( wxT( "PcbTextSizeH" ),
&m_PcbTextSize.x,
DEFAULT_TEXT_PCB_SIZE, TEXTS_MIN_SIZE, TEXTS_MAX_SIZE,
NULL, MM_PER_IU ) );
aResult->push_back( new PARAM_CFG_INT_WITH_SCALE( wxT( "PcbTextThickness" ),
&m_PcbTextWidth,
DEFAULT_TEXT_PCB_THICKNESS,
Millimeter2iu( 0.01 ), Millimeter2iu( 5.0 ),
NULL, MM_PER_IU ) );
aResult->push_back( new PARAM_CFG_INT_WITH_SCALE( wxT( "ModuleTextSizeV" ),
&m_ModuleTextSize.y,
DEFAULT_TEXT_MODULE_SIZE, TEXTS_MIN_SIZE, TEXTS_MAX_SIZE,
NULL, MM_PER_IU ) );
aResult->push_back( new PARAM_CFG_INT_WITH_SCALE( wxT( "ModuleTextSizeH" ),
&m_ModuleTextSize.x,
DEFAULT_TEXT_MODULE_SIZE, TEXTS_MIN_SIZE, TEXTS_MAX_SIZE,
NULL, MM_PER_IU ) );
aResult->push_back( new PARAM_CFG_INT_WITH_SCALE( wxT( "ModuleTextSizeThickness" ),
&m_ModuleTextWidth,
DEFAULT_GR_MODULE_THICKNESS, 1, TEXTS_MAX_WIDTH,
NULL, MM_PER_IU ) );
aResult->push_back( new PARAM_CFG_INT_WITH_SCALE( wxT( "SolderMaskClearance" ),
&m_SolderMaskMargin,
DEFAULT_SOLDERMASK_CLEARANCE, 0, Millimeter2iu( 1.0 ),
NULL, MM_PER_IU ) );
aResult->push_back( new PARAM_CFG_INT_WITH_SCALE( wxT( "SolderMaskMinWidth" ),
&m_SolderMaskMinWidth,
DEFAULT_SOLDERMASK_MIN_WIDTH, 0, Millimeter2iu( 0.5 ),
NULL, MM_PER_IU ) );
aResult->push_back( new PARAM_CFG_INT_WITH_SCALE( wxT( "DrawSegmentWidth" ),
&m_DrawSegmentWidth,
DEFAULT_GRAPHIC_THICKNESS,
Millimeter2iu( 0.01 ), Millimeter2iu( 5.0 ),
NULL, MM_PER_IU ) );
aResult->push_back( new PARAM_CFG_INT_WITH_SCALE( wxT( "BoardOutlineThickness" ),
&m_EdgeSegmentWidth,
DEFAULT_PCB_EDGE_THICKNESS,
Millimeter2iu( 0.01 ), Millimeter2iu( 5.0 ),
NULL, MM_PER_IU ) );
aResult->push_back( new PARAM_CFG_INT_WITH_SCALE( wxT( "ModuleOutlineThickness" ),
&m_ModuleSegmentWidth,
DEFAULT_GR_MODULE_THICKNESS,
Millimeter2iu( 0.01 ), Millimeter2iu( 5.0 ),
NULL, MM_PER_IU ) );
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}
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// see pcbstruct.h
LAYER_MSK BOARD_DESIGN_SETTINGS::GetVisibleLayers() const
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{
return m_VisibleLayers;
}
void BOARD_DESIGN_SETTINGS::SetVisibleAlls()
{
SetVisibleLayers( FULL_LAYERS );
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m_VisibleElements = -1;
}
void BOARD_DESIGN_SETTINGS::SetVisibleLayers( LAYER_MSK aMask )
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{
m_VisibleLayers = aMask & m_EnabledLayers & FULL_LAYERS;
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}
void BOARD_DESIGN_SETTINGS::SetLayerVisibility( LAYER_NUM aLayer, bool aNewState )
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{
if( aNewState && IsLayerEnabled( aLayer ) )
m_VisibleLayers |= GetLayerMask( aLayer );
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else
m_VisibleLayers &= ~GetLayerMask( aLayer );
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}
void BOARD_DESIGN_SETTINGS::SetElementVisibility( int aElementCategory, bool aNewState )
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{
if( aElementCategory < 0 || aElementCategory >= END_PCB_VISIBLE_LIST )
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return;
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if( aNewState )
m_VisibleElements |= 1 << aElementCategory;
else
m_VisibleElements &= ~( 1 << aElementCategory );
}
void BOARD_DESIGN_SETTINGS::SetCopperLayerCount( int aNewLayerCount )
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{
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// if( aNewLayerCount < 2 ) aNewLayerCount = 2;
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m_CopperLayerCount = aNewLayerCount;
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// ensure consistency with the m_EnabledLayers member
m_EnabledLayers &= ~ALL_CU_LAYERS;
m_EnabledLayers |= LAYER_BACK;
if( m_CopperLayerCount > 1 )
m_EnabledLayers |= LAYER_FRONT;
for( LAYER_NUM ii = LAYER_N_2; ii < aNewLayerCount - 1; ++ii )
m_EnabledLayers |= GetLayerMask( ii );
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}
void BOARD_DESIGN_SETTINGS::SetEnabledLayers( LAYER_MSK aMask )
{
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// Back and front layers are always enabled.
aMask |= LAYER_BACK | LAYER_FRONT;
m_EnabledLayers = aMask;
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// A disabled layer cannot be visible
m_VisibleLayers &= aMask;
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// update m_CopperLayerCount to ensure its consistency with m_EnabledLayers
m_CopperLayerCount = LayerMaskCountSet( aMask & ALL_CU_LAYERS);
}