kicad/pcbnew/board_stackup_manager/class_board_stackup.h

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/*
* This program source code file is part of KiCad, a free EDA CAD application.
*
* Copyright (C) 2019 Jean-Pierre Charras, jp.charras at wanadoo.fr
* Copyright (C) 2009-2020 KiCad Developers, see AUTHORS.txt for contributors.
*
* This program is free software; you can redistribute it and/or
* modify it under the terms of the GNU General Public License
* as published by the Free Software Foundation; either version 3
* of the License, or (at your option) any later version.
*
* This program is distributed in the hope that it will be useful,
* but WITHOUT ANY WARRANTY; without even the implied warranty of
* MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the
* GNU General Public License for more details.
*
* You should have received a copy of the GNU General Public License along
* with this program. If not, see <http://www.gnu.org/licenses/>.
*/
/**
* @file class_board_stackup.h
*/
#ifndef CLASS_BOARD_STACKUP_H
#define CLASS_BOARD_STACKUP_H
#include <vector>
#include <wx/string.h>
#include <layers_id_colors_and_visibility.h>
class BOARD;
class BOARD_DESIGN_SETTINGS;
class OUTPUTFORMATTER;
// A enum to manage the different layers inside the stackup layers.
// Note the stackup layers include both dielectric and some layers handled by the board editor
// Therefore a stackup layer item is not exactly like a board layer
enum BOARD_STACKUP_ITEM_TYPE
{
BS_ITEM_TYPE_UNDEFINED, // For not yet initialized BOARD_STACKUP_ITEM item
BS_ITEM_TYPE_COPPER, // A initialized BOARD_STACKUP_ITEM item for copper layers
BS_ITEM_TYPE_DIELECTRIC, // A initialized BOARD_STACKUP_ITEM item for the
// dielectric between copper layers
BS_ITEM_TYPE_SOLDERPASTE, // A initialized BOARD_STACKUP_ITEM item for solder paste layers
BS_ITEM_TYPE_SOLDERMASK, // A initialized BOARD_STACKUP_ITEM item for solder mask layers
// note: this is a specialized dielectric material
BS_ITEM_TYPE_SILKSCREEN, // A initialized BOARD_STACKUP_ITEM item for silkscreen layers
};
// A enum to manage edge connector fab info
enum BS_EDGE_CONNECTOR_CONSTRAINTS
{
BS_EDGE_CONNECTOR_NONE, // No edge connector in board
BS_EDGE_CONNECTOR_IN_USE, // some edge connector in board
BS_EDGE_CONNECTOR_BEVELLED // Some connector in board, and the connector must be beveled
};
/**
* A helper class to manage a dielectric layer set of parameters
*/
class DIELECTRIC_PRMS
{
friend class BOARD_STACKUP_ITEM;
private:
wxString m_Material; /// type of material (for dielectric and solder mask)
int m_Thickness; /// the physical layer thickness in internal units
bool m_ThicknessLocked; /// true for dielectric layers with a fixed thickness
/// (for impedance controlled purposes), unused for other layers
double m_EpsilonR; /// For dielectric (and solder mask) the dielectric constant
double m_LossTangent; /// For dielectric (and solder mask) the dielectric loss
public:
DIELECTRIC_PRMS() :
m_Thickness(0), m_ThicknessLocked( false ),
m_EpsilonR( 1.0 ), m_LossTangent( 0.0 )
{}
};
/**
* this class manage one layer needed to make a physical board
* it can be a solder mask, silk screen, copper or a dielectric
*/
class BOARD_STACKUP_ITEM
{
public:
BOARD_STACKUP_ITEM( BOARD_STACKUP_ITEM_TYPE aType );
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BOARD_STACKUP_ITEM( const BOARD_STACKUP_ITEM& aOther );
private:
BOARD_STACKUP_ITEM_TYPE m_Type;
wxString m_LayerName; /// name of layer as shown in layer manager. Useful to create reports
wxString m_TypeName; /// type name of layer (copper, silk screen, core, prepreg ...)
wxString m_Color; /// mainly for silkscreen and solder mask
PCB_LAYER_ID m_LayerId; /// the layer id (F.Cu to B.Cu, F.Silk, B.silk, F.Mask, B.Mask)
/// and UNDEFINED_LAYER (-1) for dielectric layers that are not
/// really layers for the board editor
int m_DielectricLayerId;/// the "layer" id for dielectric layers,
/// from 1 (top) to 31 (bottom)
/// (only 31 dielectric layers for 32 copper layers)
/// List of dielectric parameters
/// usually only one item, but in complex (microwave) boards, one can have
/// more than one dielectric layer between 2 copper layers, and therefore
/// more than one item in list
std::vector<DIELECTRIC_PRMS> m_DielectricPrmsList;
bool m_enabled; /// true if this stackup item must be taken in account,
/// false to ignore it. Mainly used in dialog stackup editor.
public:
/**
* add (insert) a DIELECTRIC_PRMS item to m_DielectricPrmsList
* all values are set to default
* @param aDielectricPrmsIdx is a index in m_DielectricPrmsList
* the new item will be inserted at this position
*/
void AddDielectricPrms( int aDielectricPrmsIdx );
/**
* Remove a DIELECTRIC_PRMS item from m_DielectricPrmsList
* @param aDielectricPrmsIdx is the index of the parameters set
* to remove in m_DielectricPrmsList
*/
void RemoveDielectricPrms( int aDielectricPrmsIdx );
/// @return true if the layer has a meaningful Epsilon R parameter
/// namely dielectric layers: dielectric and solder mask
bool HasEpsilonRValue() const;
/// @return true if the layer has a meaningfully Dielectric Loss parameter
/// namely dielectric layers: dielectric and solder mask
bool HasLossTangentValue() const;
/// @return true if the material is specified
bool HasMaterialValue( int aDielectricSubLayer = 0 ) const;
/// @return true if the material is editable
bool IsMaterialEditable() const;
/// @return true if the color is editable
bool IsColorEditable() const;
/// @return true if Thickness is editable
bool IsThicknessEditable() const;
/// @return a reasonable default value for a copper layer thickness
static int GetCopperDefaultThickness();
/// @return a reasonable default value for a solder mask layer thickness
static int GetMaskDefaultThickness();
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/// @return a the number of sublayers in a dielectric layer.
/// the count is >= 1 (there is at least one layer)
int GetSublayersCount() const { return m_DielectricPrmsList.size(); }
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/// @return a wxString to print/display Epsilon R
wxString FormatEpsilonR( int aDielectricSubLayer = 0 ) const;
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/// @return a wxString to print/display Loss Tangent
wxString FormatLossTangent( int aDielectricSubLayer = 0 ) const;
/// @return a wxString to print/display a dielectric name
wxString FormatDielectricLayerName() const;
// Getters:
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bool IsEnabled() const { return m_enabled; }
BOARD_STACKUP_ITEM_TYPE GetType() const { return m_Type; }
PCB_LAYER_ID GetBrdLayerId() const { return m_LayerId; }
wxString GetColor() const { return m_Color; }
wxString GetLayerName() const { return m_LayerName; }
wxString GetTypeName() const { return m_TypeName; }
int GetDielectricLayerId() const { return m_DielectricLayerId; }
int GetThickness( int aDielectricSubLayer = 0 ) const;
bool IsThicknessLocked( int aDielectricSubLayer = 0 ) const;
double GetEpsilonR( int aDielectricSubLayer = 0 ) const;
double GetLossTangent( int aDielectricSubLayer = 0 ) const;
wxString GetMaterial( int aDielectricSubLayer = 0 ) const;
// Setters:
void SetEnabled( bool aEnable) { m_enabled = aEnable; }
void SetBrdLayerId( PCB_LAYER_ID aBrdLayerId ) { m_LayerId = aBrdLayerId; }
void SetColor( const wxString& aColorName ){ m_Color = aColorName; }
void SetLayerName( const wxString& aName ) { m_LayerName = aName; }
void SetTypeName( const wxString& aName ) { m_TypeName = aName; }
void SetDielectricLayerId( int aLayerId ) { m_DielectricLayerId = aLayerId; }
void SetThickness( int aThickness, int aDielectricSubLayer = 0 );
void SetThicknessLocked( bool aLocked, int aDielectricSubLayer = 0 );
void SetEpsilonR( double aEpsilon, int aDielectricSubLayer = 0 );
void SetLossTangent( double aTg, int aDielectricSubLayer = 0 );
void SetMaterial( const wxString& aName, int aDielectricSubLayer = 0 );
};
/**
* this class manage the layers needed to make a physical board
* they are solder mask, silk screen, copper and dielectric
* Some other layers, used in fabrication, are not managed here because they
* are not used to make a physical board itself
* Note also there are a few other parameters related to the physical stackup,
* like finish type, impedance control and a few others
*/
class BOARD_STACKUP
{
// The list of items describing the stackup for fabrication.
// this is not just copper layers, but also mask dielectric layers
std::vector<BOARD_STACKUP_ITEM*> m_list;
public:
/** The name of external copper finish
*/
wxString m_FinishType;
/** True if some layers have impedance controlled tracks or have specific
* constrains for micro-wave applications
* If the board has dielectric constrains, the .gbrjob will contain
* info about dielectric constrains: loss tangent and Epsilon rel.
* If not, these values will be not specified in job file.
*/
bool m_HasDielectricConstrains;
/** True if some layers (copper and/or dielectric) have specific thickness
*/
bool m_HasThicknessConstrains;
/** If the board has edge connector cards, some constrains can be specified
* in job file:
* BS_EDGE_CONNECTOR_NONE = no edge connector
* BS_EDGE_CONNECTOR_IN_USE = board has edge connectors
* BS_EDGE_CONNECTOR_BEVELLED = edge connectors are beveled
*/
BS_EDGE_CONNECTOR_CONSTRAINTS m_EdgeConnectorConstraints;
bool m_CastellatedPads; ///< True if castellated pads exist
bool m_EdgePlating; ///< True if the edge board is plated
public:
BOARD_STACKUP();
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BOARD_STACKUP( const BOARD_STACKUP& aOther );
BOARD_STACKUP& operator=( const BOARD_STACKUP& aOther );
~BOARD_STACKUP() { RemoveAll(); }
const std::vector<BOARD_STACKUP_ITEM*>& GetList() const { return m_list; }
/// @return a reference to the layer aIndex, or nullptr if not exists
BOARD_STACKUP_ITEM* GetStackupLayer( int aIndex );
/** @return the board layers full mask allowed in the stackup list
* i.e. the SilkS, Mask, Paste and all copper layers
*/
static LSET StackupAllowedBrdLayers()
{
return LSET( 6, F_SilkS, F_Mask, F_Paste, B_SilkS, B_Mask, B_Paste )
| LSET::ExternalCuMask() | LSET::InternalCuMask();
}
/// Delete all items in list and clear the list
void RemoveAll();
/// @return the number of layers in the stackup
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int GetCount() const { return (int) m_list.size(); }
/// @return the board thickness ( in UI) from the thickness of BOARD_STACKUP_ITEM list
int BuildBoardThicknessFromStackup() const;
/// Add a new item in stackup layer
void Add( BOARD_STACKUP_ITEM* aItem ) { m_list.push_back( aItem ); }
/**
* Synchronize the BOARD_STACKUP_ITEM* list with the board.
* Not enabled layers are removed
* Missing layers are added
* @param aSettings, is the current board setting.
* @return true if changes are made
*/
bool SynchronizeWithBoard( BOARD_DESIGN_SETTINGS* aSettings );
/**
* Creates a default stackup, according to the current BOARD_DESIGN_SETTINGS settings.
* @param aSettings is the current board setting.
* if nullptr, build a full stackup (with 32 copper layers)
* @param aActiveCopperLayersCount is used only if aSettings == nullptr is the number
* of copper layers to use to calculate a default dielectric thickness.
* ((<= 0 to use all copper layers)
*/
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void BuildDefaultStackupList( const BOARD_DESIGN_SETTINGS* aSettings,
int aActiveCopperLayersCount = 0 );
/**
* Writes the stackup info on board file
* @param aFormatter is the OUTPUTFORMATTER used to create the file
* @param aBoard is the board
* @param aNestLevel is the index to nest level to indent the lines in file
*/
void FormatBoardStackup( OUTPUTFORMATTER* aFormatter,
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const BOARD* aBoard, int aNestLevel ) const;
/**
* Calculates the distance (height) between the two given copper layers. This factors in the
* thickness of any dielectric and copper layers between the two given layers, but not the
* height of the given copper layers.
* @param aFirstLayer is a copper layer
* @param aSecondLayer is a different copper layer
* @return the height (in IU) between the two layers
*/
int GetLayerDistance( PCB_LAYER_ID aFirstLayer, PCB_LAYER_ID aSecondLayer ) const;
};
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#endif // CLASS_BOARD_STACKUP_H