kicad/3d-viewer/info3d_visu.cpp

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/*
* This program source code file is part of KiCad, a free EDA CAD application.
*
* Copyright (C) 2012 Jean-Pierre Charras, jp.charras at wanadoo.fr
* Copyright (C) 1992-2011 KiCad Developers, see AUTHORS.txt for contributors.
*
* This program is free software; you can redistribute it and/or
* modify it under the terms of the GNU General Public License
* as published by the Free Software Foundation; either version 2
* of the License, or (at your option) any later version.
*
* This program is distributed in the hope that it will be useful,
* but WITHOUT ANY WARRANTY; without even the implied warranty of
* MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the
* GNU General Public License for more details.
*
* You should have received a copy of the GNU General Public License
* along with this program; if not, you may find one here:
* http://www.gnu.org/licenses/old-licenses/gpl-2.0.html
* or you may search the http://www.gnu.org website for the version 2 license,
* or you may write to the Free Software Foundation, Inc.,
* 51 Franklin Street, Fifth Floor, Boston, MA 02110-1301, USA
*/
/**
* @file info3d_visu.cpp
*/
#include <fctsys.h>
#include <common.h>
#include <class_board_design_settings.h>
#include <class_board.h>
#include <3d_viewer.h>
#include <info3d_visu.h>
#include <trackball.h>
// Thickness of copper
// TODO: define the actual copper thickness by user
#define COPPER_THICKNESS KiROUND( 0.035 * IU_PER_MM ) // for 35 um
2013-05-04 11:57:09 +00:00
#define TECH_LAYER_THICKNESS KiROUND( 0.04 * IU_PER_MM )
#define EPOXY_THICKNESS KiROUND( 1.6 * IU_PER_MM ) // for 1.6 mm
/* INFO3D_VISU in an helper class to store parameters like scaling factors,
* board size, Z coordinates of layers ...
* to create the 3D GLList
*/
INFO3D_VISU::INFO3D_VISU()
{
int ii;
m_Beginx = m_Beginy = 0.0; // position of mouse
m_Zoom = 1.0;
m_3D_Grid = 10.0; // Grid value in mm
trackball( m_Quat, 0.0, 0.0, 0.0, 0.0 );
for( ii = 0; ii < 4; ii++ )
m_Rot[ii] = 0.0;
m_CopperLayersCount = 2;
m_BoardSettings = NULL;
m_CopperThickness = 0;
m_EpoxyThickness = 0;
m_NonCopperLayerThickness = 0;
// default all special item layers Visible
for( ii = 0; ii < FL_LAST; ii++ )
m_drawFlags[ii] = true;
SetFlag( FL_GRID, false );
SetFlag( FL_USE_COPPER_THICKNESS, false );
}
INFO3D_VISU::~INFO3D_VISU()
{
}
/* Initialize info 3D Parameters from aBoard
*/
void INFO3D_VISU::InitSettings( BOARD* aBoard )
{
EDA_RECT bbbox = aBoard->ComputeBoundingBox( false );
if( bbbox.GetWidth() == 0 && bbbox.GetHeight() == 0 )
{
bbbox.SetWidth( Millimeter2iu( 100 ) );
bbbox.SetHeight( Millimeter2iu( 100 ) );
}
m_BoardSettings = &aBoard->GetDesignSettings();
m_BoardSize = bbbox.GetSize();
m_BoardPos = bbbox.Centre();
m_BoardPos.y = -m_BoardPos.y;
m_CopperLayersCount = aBoard->GetCopperLayerCount();
// Ensure the board has 2 sides for 3D views, because it is hard to find
// a *really* single side board in the true life...
if( m_CopperLayersCount < 2 )
m_CopperLayersCount = 2;
m_BiuTo3Dunits = 2.0 / std::max( m_BoardSize.x, m_BoardSize.y );
m_EpoxyThickness = aBoard->GetDesignSettings().GetBoardThickness() * m_BiuTo3Dunits;
// TODO use value defined by user (currently use default values by ctor
m_CopperThickness = COPPER_THICKNESS * m_BiuTo3Dunits;
m_NonCopperLayerThickness = TECH_LAYER_THICKNESS * m_BiuTo3Dunits;
// Init Z position of each layer
// calculate z position for each copper layer
int layer;
int copper_layers_cnt = m_CopperLayersCount;
for( layer = 0; layer < copper_layers_cnt; layer++ )
{
m_LayerZcoord[layer] =
m_EpoxyThickness * layer / (copper_layers_cnt - 1);
}
#define layerThicknessMargin 1.1
double zpos_offset = m_NonCopperLayerThickness * layerThicknessMargin;
double zpos_copper_back = m_LayerZcoord[0] - layerThicknessMargin*m_CopperThickness/2;
double zpos_copper_front = m_EpoxyThickness + layerThicknessMargin*m_CopperThickness/2;
// Fill remaining unused copper layers and front layer zpos
// with m_EpoxyThickness
// Solder mask and Solder paste have the same Z position
for( ; layer <= LAST_COPPER_LAYER; layer++ )
{
m_LayerZcoord[layer] = m_EpoxyThickness;
}
// calculate z position for each non copper layer
for( int layer_id = FIRST_NON_COPPER_LAYER; layer_id < NB_PCB_LAYERS; layer_id++ )
{
double zpos;
switch( layer_id )
{
case ADHESIVE_N_BACK:
zpos = zpos_copper_back - 3 * zpos_offset;
break;
case ADHESIVE_N_FRONT:
zpos = zpos_copper_front + 3 * zpos_offset;
break;
case SOLDERPASTE_N_BACK:
zpos = zpos_copper_back - 1 * zpos_offset;
break;
case SOLDERPASTE_N_FRONT:
zpos = zpos_copper_front + 1 * zpos_offset;
break;
case SOLDERMASK_N_BACK:
zpos = zpos_copper_back - 1 * zpos_offset;
break;
case SOLDERMASK_N_FRONT:
zpos = zpos_copper_front + 1 * zpos_offset;
break;
case SILKSCREEN_N_BACK:
zpos = zpos_copper_back - 2 * zpos_offset;
break;
case SILKSCREEN_N_FRONT:
zpos = zpos_copper_front + 2 * zpos_offset;
break;
default:
zpos = zpos_copper_front +
(layer_id - FIRST_NON_COPPER_LAYER + 4) * zpos_offset;
break;
}
m_LayerZcoord[layer_id] = zpos;
}
}
/* return the Z position of 3D shapes, in 3D Units
* aIsFlipped: true for modules on Front (top) layer, false
* if on back (bottom) layer
* Note: in draw functions, the copper has a thickness = m_CopperThickness
* Vias and tracks are draw with the top side position = m_CopperThickness/2
* and the bottom side position = -m_CopperThickness/2 from the Z layer position
*/
double INFO3D_VISU::GetModulesZcoord3DIU( bool aIsFlipped )
{
if( aIsFlipped )
return m_LayerZcoord[LAYER_N_BACK] - ( m_CopperThickness / 2 );
else
return m_LayerZcoord[LAYER_N_FRONT] + ( m_CopperThickness / 2 );
}