kicad/qa/data/pcbnew/issue14294.kicad_pcb

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(kicad_pcb (version 20221018) (generator pcbnew)
(general
(thickness 1.55)
)
(paper "A4")
(layers
(0 "F.Cu" signal)
(1 "In1.Cu" power)
(2 "In2.Cu" power)
(3 "In3.Cu" signal)
(4 "In4.Cu" signal)
(31 "B.Cu" signal)
(32 "B.Adhes" user "B.Adhesive")
(33 "F.Adhes" user "F.Adhesive")
(34 "B.Paste" user)
(35 "F.Paste" user)
(36 "B.SilkS" user "B.Silkscreen")
(37 "F.SilkS" user "F.Silkscreen")
(38 "B.Mask" user)
(39 "F.Mask" user)
(40 "Dwgs.User" user "User.Drawings")
(41 "Cmts.User" user "User.Comments")
(42 "Eco1.User" user "User.Eco1")
(43 "Eco2.User" user "User.Eco2")
(44 "Edge.Cuts" user)
(45 "Margin" user)
(46 "B.CrtYd" user "B.Courtyard")
(47 "F.CrtYd" user "F.Courtyard")
(48 "B.Fab" user)
(49 "F.Fab" user)
(50 "User.1" user)
(51 "User.2" user)
(52 "User.3" user)
(53 "User.4" user)
(54 "User.5" user)
(55 "User.6" user)
(56 "User.7" user)
(57 "User.8" user)
(58 "User.9" user)
)
(setup
(stackup
(layer "F.SilkS" (type "Top Silk Screen"))
(layer "F.Paste" (type "Top Solder Paste"))
(layer "F.Mask" (type "Top Solder Mask") (thickness 0.01))
(layer "F.Cu" (type "copper") (thickness 0.035))
(layer "dielectric 1" (type "prepreg") (thickness 0.264) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
(layer "In1.Cu" (type "copper") (thickness 0.035))
(layer "dielectric 2" (type "prepreg") (thickness 0.264) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
(layer "In2.Cu" (type "copper") (thickness 0.035))
(layer "dielectric 3" (type "core") (thickness 0.264) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
(layer "In3.Cu" (type "copper") (thickness 0.035))
(layer "dielectric 4" (type "prepreg") (thickness 0.264) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
(layer "In4.Cu" (type "copper") (thickness 0.035))
(layer "dielectric 5" (type "core") (thickness 0.264) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
(layer "B.Cu" (type "copper") (thickness 0.035))
(layer "B.Mask" (type "Bottom Solder Mask") (thickness 0.01))
(layer "B.Paste" (type "Bottom Solder Paste"))
(layer "B.SilkS" (type "Bottom Silk Screen"))
(copper_finish "HAL lead-free")
(dielectric_constraints no)
)
(pad_to_mask_clearance 0)
(pcbplotparams
(layerselection 0x0030000_7fffffe0)
(plot_on_all_layers_selection 0x0001000_00000000)
(disableapertmacros false)
(usegerberextensions false)
(usegerberattributes true)
(usegerberadvancedattributes true)
(creategerberjobfile true)
(dashed_line_dash_ratio 12.000000)
(dashed_line_gap_ratio 3.000000)
(svgprecision 6)
(plotframeref false)
(viasonmask false)
(mode 1)
(useauxorigin false)
(hpglpennumber 1)
(hpglpenspeed 20)
(hpglpendiameter 15.000000)
(dxfpolygonmode true)
(dxfimperialunits false)
(dxfusepcbnewfont true)
(psnegative false)
(psa4output false)
(plotreference true)
(plotvalue false)
(plotinvisibletext false)
(sketchpadsonfab false)
(subtractmaskfromsilk false)
(outputformat 3)
(mirror false)
(drillshape 0)
(scaleselection 1)
(outputdirectory "CAM/")
)
)
(net 0 "")
(net 1 "GND")
(net 2 "+3V3")
(net 3 "D1G")
(net 4 "D1R")
(net 5 "D1B")
(net 6 "D2G")
(net 7 "D2R")
(net 8 "D2B")
(net 9 "AUTO_UP")
(net 10 "AUTO_DN")
(net 11 "SCL")
(net 12 "SDA")
(net 13 "unconnected-(U2-~{INT}-Pad1)")
(net 14 "unconnected-(U2-NC-Pad3)")
(net 15 "unconnected-(U2-NC-Pad8)")
(net 16 "unconnected-(U2-NC-Pad13)")
(net 17 "unconnected-(U2-NC-Pad18)")
(footprint "Library:SSOP20" (layer "F.Cu")
(tstamp 629751aa-e679-4604-b0e4-bd6a4140ed98)
(at -9.2 -32 -90)
(property "Sheetfile" "mcu_2_6.kicad_sch")
(property "Sheetname" "")
(property "ki_description" "8 Bit Port/Expander to I2C Bus, SSOP-20")
(property "ki_keywords" "I2C Expander")
(path "/024cef38-5927-47cb-8157-ae104f3635b5")
(attr smd)
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