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Properties: add some validators for PAD

This commit is contained in:
Jon Evans 2023-02-11 15:50:30 -05:00
parent 13391176ae
commit 0b3928d38f
1 changed files with 33 additions and 4 deletions
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37
pcbnew/pad.cpp
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@ -48,6 +48,7 @@
#include <convert_basic_shapes_to_polygon.h>
#include <widgets/msgpanel.h>
#include <pcb_painter.h>
#include <properties/property_validators.h>
#include <wx/log.h>
#include <memory>
@ -1753,6 +1754,18 @@ static struct PAD_DESC
return false;
};
auto padCanHaveHole =
[]( INSPECTABLE* aItem ) -> bool
{
if( PAD* pad = dynamic_cast<PAD*>( aItem ) )
{
return pad->GetAttribute() == PAD_ATTRIB::PTH
|| pad->GetAttribute() == PAD_ATTRIB::NPTH;
}
return false;
};
propMgr.OverrideAvailability( TYPE_HASH( PAD ), TYPE_HASH( BOARD_CONNECTED_ITEM ),
_HKI( "Net" ), isCopperPad );
propMgr.OverrideAvailability( TYPE_HASH( PAD ), TYPE_HASH( BOARD_CONNECTED_ITEM ),
@ -1799,10 +1812,15 @@ static struct PAD_DESC
propMgr.AddProperty( new PROPERTY<PAD, int>( _HKI( "Hole Size X" ),
&PAD::SetDrillSizeX, &PAD::GetDrillSizeX,
PROPERTY_DISPLAY::PT_SIZE ), groupPad );
PROPERTY_DISPLAY::PT_SIZE ), groupPad )
.SetWriteableFunc( padCanHaveHole )
.SetValidator( PROPERTY_VALIDATORS::PositiveIntValidator );
propMgr.AddProperty( new PROPERTY<PAD, int>( _HKI( "Hole Size Y" ),
&PAD::SetDrillSizeY, &PAD::GetDrillSizeY,
PROPERTY_DISPLAY::PT_SIZE ), groupPad );
PROPERTY_DISPLAY::PT_SIZE ), groupPad )
.SetWriteableFunc( padCanHaveHole )
.SetValidator( PROPERTY_VALIDATORS::PositiveIntValidator );
propMgr.AddProperty( new PROPERTY_ENUM<PAD, PAD_PROP>( _HKI( "Fabrication Property" ),
&PAD::SetProperty, &PAD::GetProperty ), groupPad );
@ -1818,27 +1836,38 @@ static struct PAD_DESC
propMgr.AddProperty( new PROPERTY<PAD, int>( _HKI( "Clearance Override" ),
&PAD::SetLocalClearance, &PAD::GetLocalClearance,
PROPERTY_DISPLAY::PT_SIZE ), groupOverrides );
propMgr.AddProperty( new PROPERTY<PAD, int>( _HKI( "Soldermask Margin Override" ),
&PAD::SetLocalSolderMaskMargin, &PAD::GetLocalSolderMaskMargin,
PROPERTY_DISPLAY::PT_SIZE ), groupOverrides );
propMgr.AddProperty( new PROPERTY<PAD, int>( _HKI( "Solderpaste Margin Override" ),
&PAD::SetLocalSolderPasteMargin, &PAD::GetLocalSolderPasteMargin,
PROPERTY_DISPLAY::PT_SIZE ), groupOverrides );
propMgr.AddProperty( new PROPERTY<PAD, double>( _HKI( "Solderpaste Margin Ratio Override" ),
&PAD::SetLocalSolderPasteMarginRatio, &PAD::GetLocalSolderPasteMarginRatio ),
groupOverrides );
propMgr.AddProperty( new PROPERTY_ENUM<PAD, ZONE_CONNECTION>(
_HKI( "Zone Connection Style" ),
&PAD::SetZoneConnection, &PAD::GetZoneConnection ), groupOverrides );
constexpr int minZoneWidth = pcbIUScale.mmToIU( ZONE_THICKNESS_MIN_VALUE_MM );
propMgr.AddProperty( new PROPERTY<PAD, int>( _HKI( "Thermal Relief Spoke Width" ),
&PAD::SetThermalSpokeWidth, &PAD::GetThermalSpokeWidth,
PROPERTY_DISPLAY::PT_SIZE ), groupOverrides );
PROPERTY_DISPLAY::PT_SIZE ), groupOverrides )
.SetValidator( PROPERTY_VALIDATORS::RangeIntValidator<minZoneWidth, INT_MAX> );
propMgr.AddProperty( new PROPERTY<PAD, double>( _HKI( "Thermal Relief Spoke Angle" ),
&PAD::SetThermalSpokeAngleDegrees, &PAD::GetThermalSpokeAngleDegrees,
PROPERTY_DISPLAY::PT_DEGREE ), groupOverrides );
propMgr.AddProperty( new PROPERTY<PAD, int>( _HKI( "Thermal Relief Gap" ),
&PAD::SetThermalGap, &PAD::GetThermalGap,
PROPERTY_DISPLAY::PT_SIZE ), groupOverrides );
PROPERTY_DISPLAY::PT_SIZE ), groupOverrides )
.SetValidator( PROPERTY_VALIDATORS::PositiveIntValidator );
// TODO delta, drill shape offset, layer set
}