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pcbnew: Don't knock out thermals for non-conn zone 

Non-connected zones are, by definition, not connected, therefore, we
should not knock out thermal reliefs under any case

Fixes: lp:1810989
* https://bugs.launchpad.net/kicad/+bug/1810989
This commit is contained in:
Seth Hillbrand 2019-01-08 18:23:14 -08:00
parent b0da1e19ee
commit 12e0e72107
1 changed files with 3 additions and 0 deletions
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3
pcbnew/zone_filler.cpp
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@ -648,6 +648,9 @@ void ZONE_FILLER::buildZoneFeatureHoleList( const ZONE_CONTAINER* aZone,
if( pad->GetNetCode() != aZone->GetNetCode() ) if( pad->GetNetCode() != aZone->GetNetCode() )
continue; continue;
if( pad->GetNetCode() <= 0 )
continue;
item_boundingbox = pad->GetBoundingBox(); item_boundingbox = pad->GetBoundingBox();
int thermalGap = aZone->GetThermalReliefGap( pad ); int thermalGap = aZone->GetThermalReliefGap( pad );
item_boundingbox.Inflate( thermalGap, thermalGap ); item_boundingbox.Inflate( thermalGap, thermalGap );