Pad with hole same size or larger than pad isn't flashed.
... even if it's marked as being on copper layers. Also changes the default hole clearance to 0.25mm. Fixes https://gitlab.com/kicad/code/kicad/issues/9901
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@ -85,7 +85,7 @@
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#define DEFAULT_MICROVIASMINSIZE 0.2 // micro vias (not vias) min diameter
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#define DEFAULT_MICROVIASMINDRILL 0.1 // micro vias (not vias) min drill diameter
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#define DEFAULT_HOLETOHOLEMIN 0.25 // minimum web thickness between two drilled holes
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#define DEFAULT_HOLECLEARANCE 0.0 // copper-to-hole clearance
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#define DEFAULT_HOLECLEARANCE 0.25 // copper-to-hole clearance (from IPC level A)
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#define DEFAULT_COPPEREDGECLEARANCE 0.01 // clearance between copper items and edge cuts
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#define LEGACY_COPPEREDGECLEARANCE -0.01 // A flag to indicate the legacy method (based
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@ -50,6 +50,7 @@
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#include <wx/log.h>
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#include <memory>
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#include <macros.h>
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using KIGFX::PCB_PAINTER;
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using KIGFX::PCB_RENDER_SETTINGS;
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@ -214,32 +215,55 @@ bool PAD::FlashLayer( int aLayer ) const
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std::vector<KICAD_T> types
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{ PCB_TRACE_T, PCB_ARC_T, PCB_VIA_T, PCB_PAD_T, PCB_ZONE_T, PCB_FP_ZONE_T };
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// Return the "normal" shape if the caller doesn't specify a particular layer
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if( aLayer == UNDEFINED_LAYER )
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return true;
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const BOARD* board = GetBoard();
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if( !board )
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return false;
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switch( GetAttribute() )
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{
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case PAD_ATTRIB::PTH:
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if( aLayer == UNDEFINED_LAYER )
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return true;
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/// Heat sink pads always get copper
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if( GetProperty() == PAD_PROP::HEATSINK )
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return IsOnLayer( static_cast<PCB_LAYER_ID>( aLayer ) );
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if( !m_removeUnconnectedLayer )
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return IsOnLayer( static_cast<PCB_LAYER_ID>( aLayer ) );
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// Plated through hole pads need copper on the top/bottom layers for proper soldering
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// Unless the user has removed them in the pad dialog
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if( m_keepTopBottomLayer && ( aLayer == F_Cu || aLayer == B_Cu ) )
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return IsOnLayer( static_cast<PCB_LAYER_ID>( aLayer ) );
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return board && board->GetConnectivity()->IsConnectedOnLayer( this,
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static_cast<int>( aLayer ),
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types );
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case PAD_ATTRIB::NPTH:
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if( GetShape() == PAD_SHAPE::CIRCLE && GetDrillShape() == PAD_DRILL_SHAPE_CIRCLE )
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{
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if( GetOffset() == wxPoint( 0, 0 ) && GetDrillSize().x >= GetSize().x )
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return false;
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}
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else if( GetShape() == PAD_SHAPE::OVAL && GetDrillShape() == PAD_DRILL_SHAPE_OBLONG )
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{
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if( GetOffset() == wxPoint( 0, 0 )
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&& GetDrillSize().x >= GetSize().x && GetDrillSize().y >= GetSize().y )
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{
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return false;
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}
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}
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KI_FALLTHROUGH;
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case PAD_ATTRIB::SMD:
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case PAD_ATTRIB::CONN:
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default:
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if( aLayer == UNDEFINED_LAYER )
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return true;
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/// We don't remove the copper from non-PTH pads
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if( GetAttribute() != PAD_ATTRIB::PTH )
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return IsOnLayer( static_cast<PCB_LAYER_ID>( aLayer ) );
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/// Heat sink pads always get copper
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if( GetProperty() == PAD_PROP::HEATSINK )
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return IsOnLayer( static_cast<PCB_LAYER_ID>( aLayer ) );
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if( !m_removeUnconnectedLayer )
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return IsOnLayer( static_cast<PCB_LAYER_ID>( aLayer ) );
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// Plated through hole pads need copper on the top/bottom layers for proper soldering
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// Unless the user has removed them in the pad dialog
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if( m_keepTopBottomLayer && ( aLayer == F_Cu || aLayer == B_Cu ) )
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return IsOnLayer( static_cast<PCB_LAYER_ID>( aLayer ) );
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return board->GetConnectivity()->IsConnectedOnLayer( this, static_cast<int>( aLayer ), types );
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}
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}
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@ -1150,6 +1174,12 @@ wxString PAD::GetSelectMenuText( EDA_UNITS aUnits ) const
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GetParent()->GetReference(),
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layerMaskDescribe() );
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}
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else if( GetAttribute() == PAD_ATTRIB::NPTH && !FlashLayer( UNDEFINED_LAYER ) )
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{
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return wxString::Format( _( "Through hole pad %s of %s" ),
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wxT( "(" ) + _( "NPTH, Mechanical" ) + wxT( ")" ),
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GetParent()->GetReference() );
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}
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else
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{
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return wxString::Format( _( "Through hole pad %s of %s" ),
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@ -1167,6 +1197,12 @@ wxString PAD::GetSelectMenuText( EDA_UNITS aUnits ) const
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GetParent()->GetReference(),
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layerMaskDescribe() );
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}
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else if( GetAttribute() == PAD_ATTRIB::NPTH && !FlashLayer( UNDEFINED_LAYER ) )
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{
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return wxString::Format( _( "Through hole pad %s of %s" ),
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wxT( "(" ) + _( "NPTH, Mechanical" ) + wxT( ")" ),
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GetParent()->GetReference() );
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}
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else
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{
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return wxString::Format( _( "Through hole pad %s %s of %s" ),
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