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3D viewer: make solder paste layer thickness bigger than the mask layer. 

Some specific footprints need shapes on paste layer covering the mask layer,
so ensure these shapes are visible.
Fixes #8041
https://gitlab.com/kicad/code/kicad/issues/8041
This commit is contained in:
jean-pierre charras 2021-03-26 18:02:30 +01:00
parent 57518fd0f9
commit 23667fc4c4
2 changed files with 25 additions and 9 deletions
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29
3d-viewer/3d_canvas/board_adapter.cpp
View File

@ -34,7 +34,7 @@
#include <3d_math.h>
#include "3d_fastmath.h"
#include <geometry/geometry_utils.h>
#include <math/util.h> // for KiROUND
#include <convert_to_biu.h>
#include <pgm_base.h>
#include <settings/settings_manager.h>
@ -82,6 +82,7 @@ BOARD_ADAPTER::BOARD_ADAPTER() :
m_epoxyThickness3DU = 0.0f;
m_copperThickness3DU = 0.0f;
m_nonCopperLayerThickness3DU = 0.0f;
m_solderPasteLayerThickness3DU = 0.0f;
m_biuTo3Dunits = 1.0;
m_trackCount = 0;
@ -238,10 +239,13 @@ bool BOARD_ADAPTER::IsFootprintShown( FOOTPRINT_ATTR_T aFPAttributes ) const
}
// !TODO: define the actual copper thickness by user
#define COPPER_THICKNESS KiROUND( 0.035 * IU_PER_MM ) // for 35 um
#define TECH_LAYER_THICKNESS KiROUND( 0.04 * IU_PER_MM )
// !TODO: define the actual copper thickness by user from board stackup
#define COPPER_THICKNESS Millimeter2iu( 0.035 ) // for 35 um
// The solder mask layer (and silkscreen) thickness
#define TECH_LAYER_THICKNESS Millimeter2iu( 0.04 )
// The solder paste thickness is chosen bigger than the solder mask layer
// to be sure is covers the mask when overlapping.
#define SOLDERPASTE_LAYER_THICKNESS Millimeter2iu( 0.08 )
int BOARD_ADAPTER::GetHolePlatingThickness() const noexcept
{
@ -320,6 +324,7 @@ void BOARD_ADAPTER::InitSettings( REPORTER* aStatusReporter, REPORTER* aWarningR
// !TODO: use value defined by user (currently use default values by ctor
m_copperThickness3DU = COPPER_THICKNESS * m_biuTo3Dunits;
m_nonCopperLayerThickness3DU = TECH_LAYER_THICKNESS * m_biuTo3Dunits;
m_solderPasteLayerThickness3DU = SOLDERPASTE_LAYER_THICKNESS * m_biuTo3Dunits;
// Init Z position of each layer
// calculate z position for each copper layer
@ -381,15 +386,23 @@ void BOARD_ADAPTER::InitSettings( REPORTER* aStatusReporter, REPORTER* aWarningR
break;
case B_Mask:
case B_Paste:
zposBottom = zpos_copperTop_back;
zposTop = zpos_copperTop_back - m_nonCopperLayerThickness3DU;
break;
case B_Paste:
zposBottom = zpos_copperTop_back;
zposTop = zpos_copperTop_back - m_solderPasteLayerThickness3DU;
break;
case F_Mask:
case F_Paste:
zposTop = zpos_copperTop_front + m_nonCopperLayerThickness3DU;
zposBottom = zpos_copperTop_front;
zposTop = zpos_copperTop_front + m_nonCopperLayerThickness3DU;
break;
case F_Paste:
zposBottom = zpos_copperTop_front;
zposTop = zpos_copperTop_front + m_solderPasteLayerThickness3DU;
break;
case B_SilkS:

5
3d-viewer/3d_canvas/board_adapter.h
View File

@ -2,7 +2,7 @@
* This program source code file is part of KiCad, a free EDA CAD application.
*
* Copyright (C) 2015-2016 Mario Luzeiro <mrluzeiro@ua.pt>
* Copyright (C) 1992-2020 KiCad Developers, see AUTHORS.txt for contributors.
* Copyright (C) 1992-2021 KiCad Developers, see AUTHORS.txt for contributors.
*
* This program is free software; you can redistribute it and/or
* modify it under the terms of the GNU General Public License
@ -726,6 +726,9 @@ private:
///< Non copper layers thickness in 3D units.
float m_nonCopperLayerThickness3DU;
///< solder paste layers thickness in 3D units.
float m_solderPasteLayerThickness3DU;
///< Number of tracks in the board.
unsigned int m_trackCount;