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Rename class_board_stackup.{h|cpp} to board_stackup.{h|cpp}.

This commit is contained in:
Wayne Stambaugh 2021-04-16 17:07:06 -04:00
parent 9846076676
commit 2ae264751f
8 changed files with 114 additions and 108 deletions
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4
3d-viewer/3d_viewer/eda_3d_viewer.cpp
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@ -2,7 +2,7 @@
* This program source code file is part of KiCad, a free EDA CAD application.
*
* Copyright (C) 2015-2016 Mario Luzeiro <mrluzeiro@ua.pt>
* Copyright (C) 1992-2020 KiCad Developers, see AUTHORS.txt for contributors.
* Copyright (C) 1992-2021 KiCad Developers, see AUTHORS.txt for contributors.
*
* This program is free software; you can redistribute it and/or
* modify it under the terms of the GNU General Public License
@ -35,7 +35,7 @@
#include <3d_viewer/tools/3d_controller.h>
#include <3d_viewer/tools/3d_conditions.h>
#include <bitmaps.h>
#include <board_stackup_manager/class_board_stackup.h>
#include <board_stackup_manager/board_stackup.h>
#include <board_stackup_manager/stackup_predefined_prms.h>
#include <board.h>
#include <core/arraydim.h>

2
common/CMakeLists.txt
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@ -522,7 +522,7 @@ set( PCB_COMMON_SRCS
${CMAKE_SOURCE_DIR}/pcbnew/pad.cpp
${CMAKE_SOURCE_DIR}/pcbnew/pcb_target.cpp
${CMAKE_SOURCE_DIR}/pcbnew/pcb_text.cpp
${CMAKE_SOURCE_DIR}/pcbnew/board_stackup_manager/class_board_stackup.cpp
${CMAKE_SOURCE_DIR}/pcbnew/board_stackup_manager/board_stackup.cpp
${CMAKE_SOURCE_DIR}/pcbnew/fp_text.cpp
${CMAKE_SOURCE_DIR}/pcbnew/track.cpp
${CMAKE_SOURCE_DIR}/pcbnew/zone.cpp

4
include/board_design_settings.h
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@ -2,7 +2,7 @@
* This program source code file is part of KiCad, a free EDA CAD application.
*
* Copyright (C) 2009-2019 Jean-Pierre Charras, jp.charras at wanadoo.fr
* Copyright (C) 1992-2020 KiCad Developers, see AUTHORS.txt for contributors.
* Copyright (C) 1992-2021 KiCad Developers, see AUTHORS.txt for contributors.
*
* This program is free software; you can redistribute it and/or
* modify it under the terms of the GNU General Public License
@ -28,7 +28,7 @@
#include <pad.h>
#include <netclass.h>
#include <config_params.h>
#include <board_stackup_manager/class_board_stackup.h>
#include <board_stackup_manager/board_stackup.h>
#include <drc/drc_engine.h>
#include <settings/nested_settings.h>
#include <widgets/ui_common.h>

4
pcbnew/board_stackup_manager/class_board_stackup.cpp → pcbnew/board_stackup_manager/board_stackup.cpp
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@ -2,7 +2,7 @@
* This program source code file is part of KiCad, a free EDA CAD application.
*
* Copyright (C) 2019 Jean-Pierre Charras, jp.charras at wanadoo.fr
* Copyright (C) 2009-2020 KiCad Developers, see AUTHORS.txt for contributors.
* Copyright (C) 2009-2021 KiCad Developers, see AUTHORS.txt for contributors.
*
* This program is free software; you can redistribute it and/or
* modify it under the terms of the GNU General Public License
@ -19,7 +19,7 @@
*/
#include "class_board_stackup.h"
#include "board_stackup.h"
#include <convert_to_biu.h>
#include <base_units.h>
#include <kicad_string.h>

168
pcbnew/board_stackup_manager/class_board_stackup.h → pcbnew/board_stackup_manager/board_stackup.h
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@ -2,7 +2,7 @@
* This program source code file is part of KiCad, a free EDA CAD application.
*
* Copyright (C) 2019 Jean-Pierre Charras, jp.charras at wanadoo.fr
* Copyright (C) 2009-2020 KiCad Developers, see AUTHORS.txt for contributors.
* Copyright (C) 2009-2021 KiCad Developers, see AUTHORS.txt for contributors.
*
* This program is free software; you can redistribute it and/or
* modify it under the terms of the GNU General Public License
@ -19,11 +19,11 @@
*/
/**
* @file class_board_stackup.h
* @file board_stackup.h
*/
#ifndef CLASS_BOARD_STACKUP_H
#define CLASS_BOARD_STACKUP_H
#ifndef BOARD_STACKUP_H
#define BOARD_STACKUP_H
#include <vector>
@ -63,27 +63,28 @@ enum BS_EDGE_CONNECTOR_CONSTRAINTS
*/
class DIELECTRIC_PRMS
{
friend class BOARD_STACKUP_ITEM;
public:
DIELECTRIC_PRMS() :
m_Thickness(0), m_ThicknessLocked( false ),
m_EpsilonR( 1.0 ), m_LossTangent( 0.0 )
{}
private:
friend class BOARD_STACKUP_ITEM;
wxString m_Material; /// type of material (for dielectric and solder mask)
int m_Thickness; /// the physical layer thickness in internal units
bool m_ThicknessLocked; /// true for dielectric layers with a fixed thickness
/// (for impedance controlled purposes), unused for other layers
double m_EpsilonR; /// For dielectric (and solder mask) the dielectric constant
double m_LossTangent; /// For dielectric (and solder mask) the dielectric loss
public:
DIELECTRIC_PRMS() :
m_Thickness(0), m_ThicknessLocked( false ),
m_EpsilonR( 1.0 ), m_LossTangent( 0.0 )
{}
};
/**
* this class manage one layer needed to make a physical board
* it can be a solder mask, silk screen, copper or a dielectric
* Manage one layer needed to make a physical board.
*
* It can be a solder mask, silk screen, copper or a dielectric.
*/
class BOARD_STACKUP_ITEM
{
@ -91,30 +92,8 @@ public:
BOARD_STACKUP_ITEM( BOARD_STACKUP_ITEM_TYPE aType );
BOARD_STACKUP_ITEM( const BOARD_STACKUP_ITEM& aOther );
private:
BOARD_STACKUP_ITEM_TYPE m_Type;
wxString m_LayerName; /// name of layer as shown in layer manager. Useful to create reports
wxString m_TypeName; /// type name of layer (copper, silk screen, core, prepreg ...)
wxString m_Color; /// mainly for silkscreen and solder mask
PCB_LAYER_ID m_LayerId; /// the layer id (F.Cu to B.Cu, F.Silk, B.silk, F.Mask, B.Mask)
/// and UNDEFINED_LAYER (-1) for dielectric layers that are not
/// really layers for the board editor
int m_DielectricLayerId;/// the "layer" id for dielectric layers,
/// from 1 (top) to 31 (bottom)
/// (only 31 dielectric layers for 32 copper layers)
/// List of dielectric parameters
/// usually only one item, but in complex (microwave) boards, one can have
/// more than one dielectric layer between 2 copper layers, and therefore
/// more than one item in list
std::vector<DIELECTRIC_PRMS> m_DielectricPrmsList;
bool m_enabled; /// true if this stackup item must be taken in account,
/// false to ignore it. Mainly used in dialog stackup editor.
public:
/**
* add (insert) a DIELECTRIC_PRMS item to m_DielectricPrmsList
* Add (insert) a DIELECTRIC_PRMS item to m_DielectricPrmsList
* all values are set to default
* @param aDielectricPrmsIdx is a index in m_DielectricPrmsList
* the new item will be inserted at this position
@ -196,51 +175,40 @@ public:
void SetEpsilonR( double aEpsilon, int aDielectricSubLayer = 0 );
void SetLossTangent( double aTg, int aDielectricSubLayer = 0 );
void SetMaterial( const wxString& aName, int aDielectricSubLayer = 0 );
private:
BOARD_STACKUP_ITEM_TYPE m_Type;
wxString m_LayerName; /// name of layer as shown in layer manager. Useful to create reports
wxString m_TypeName; /// type name of layer (copper, silk screen, core, prepreg ...)
wxString m_Color; /// mainly for silkscreen and solder mask
PCB_LAYER_ID m_LayerId; /// the layer id (F.Cu to B.Cu, F.Silk, B.silk, F.Mask, B.Mask)
/// and UNDEFINED_LAYER (-1) for dielectric layers that are not
/// really layers for the board editor
int m_DielectricLayerId;/// the "layer" id for dielectric layers,
/// from 1 (top) to 31 (bottom)
/// (only 31 dielectric layers for 32 copper layers)
/// List of dielectric parameters
/// usually only one item, but in complex (microwave) boards, one can have
/// more than one dielectric layer between 2 copper layers, and therefore
/// more than one item in list
std::vector<DIELECTRIC_PRMS> m_DielectricPrmsList;
bool m_enabled; /// true if this stackup item must be taken in account,
/// false to ignore it. Mainly used in dialog stackup editor.
};
/**
* this class manage the layers needed to make a physical board
* they are solder mask, silk screen, copper and dielectric
* Some other layers, used in fabrication, are not managed here because they
* are not used to make a physical board itself
* Note also there are a few other parameters related to the physical stackup,
* like finish type, impedance control and a few others
* Manage layers needed to make a physical board.
*
* They are solder mask, silk screen, copper and dielectric. Some other layers, used in
* fabrication, are not managed here because they are not used to make a physical board itself.
*
* @note There are a few other parameters related to the physical stackup like finish type,
* impedance control and a few others.
*/
class BOARD_STACKUP
{
// The list of items describing the stackup for fabrication.
// this is not just copper layers, but also mask dielectric layers
std::vector<BOARD_STACKUP_ITEM*> m_list;
public:
/** The name of external copper finish
*/
wxString m_FinishType;
/** True if some layers have impedance controlled tracks or have specific
* constrains for micro-wave applications
* If the board has dielectric constrains, the .gbrjob will contain
* info about dielectric constrains: loss tangent and Epsilon rel.
* If not, these values will be not specified in job file.
*/
bool m_HasDielectricConstrains;
/** True if some layers (copper and/or dielectric) have specific thickness
*/
bool m_HasThicknessConstrains;
/** If the board has edge connector cards, some constrains can be specified
* in job file:
* BS_EDGE_CONNECTOR_NONE = no edge connector
* BS_EDGE_CONNECTOR_IN_USE = board has edge connectors
* BS_EDGE_CONNECTOR_BEVELLED = edge connectors are beveled
*/
BS_EDGE_CONNECTOR_CONSTRAINTS m_EdgeConnectorConstraints;
bool m_CastellatedPads; ///< True if castellated pads exist
bool m_EdgePlating; ///< True if the edge board is plated
public:
BOARD_STACKUP();
BOARD_STACKUP( const BOARD_STACKUP& aOther );
@ -253,7 +221,8 @@ public:
/// @return a reference to the layer aIndex, or nullptr if not exists
BOARD_STACKUP_ITEM* GetStackupLayer( int aIndex );
/** @return the board layers full mask allowed in the stackup list
/**
* @return the board layers full mask allowed in the stackup list
* i.e. the SilkS, Mask, Paste and all copper layers
*/
static LSET StackupAllowedBrdLayers()
@ -285,7 +254,7 @@ public:
bool SynchronizeWithBoard( BOARD_DESIGN_SETTINGS* aSettings );
/**
* Creates a default stackup, according to the current BOARD_DESIGN_SETTINGS settings.
* Create a default stackup, according to the current BOARD_DESIGN_SETTINGS settings.
* @param aSettings is the current board setting.
* if nullptr, build a full stackup (with 32 copper layers)
* @param aActiveCopperLayersCount is used only if aSettings == nullptr is the number
@ -296,7 +265,7 @@ public:
int aActiveCopperLayersCount = 0 );
/**
* Writes the stackup info on board file
* Write the stackup info on board file
* @param aFormatter is the OUTPUTFORMATTER used to create the file
* @param aBoard is the board
* @param aNestLevel is the index to nest level to indent the lines in file
@ -305,15 +274,52 @@ public:
const BOARD* aBoard, int aNestLevel ) const;
/**
* Calculates the distance (height) between the two given copper layers. This factors in the
* thickness of any dielectric and copper layers between the two given layers, but not the
* height of the given copper layers.
* Calculate the distance (height) between the two given copper layers.
*
* This factors in the thickness of any dielectric and copper layers between the two given
* layers, but not the height of the given copper layers.
* @param aFirstLayer is a copper layer
* @param aSecondLayer is a different copper layer
* @return the height (in IU) between the two layers
*/
int GetLayerDistance( PCB_LAYER_ID aFirstLayer, PCB_LAYER_ID aSecondLayer ) const;
/**
* The name of external copper finish
*/
wxString m_FinishType;
/**
* True if some layers have impedance controlled tracks or have specific
* constrains for micro-wave applications
* If the board has dielectric constrains, the .gbrjob will contain
* info about dielectric constrains: loss tangent and Epsilon rel.
* If not, these values will be not specified in job file.
*/
bool m_HasDielectricConstrains;
/**
* True if some layers (copper and/or dielectric) have specific thickness
*/
bool m_HasThicknessConstrains;
/**
* If the board has edge connector cards, some constrains can be specified
* in job file:
* BS_EDGE_CONNECTOR_NONE = no edge connector
* BS_EDGE_CONNECTOR_IN_USE = board has edge connectors
* BS_EDGE_CONNECTOR_BEVELLED = edge connectors are beveled
*/
BS_EDGE_CONNECTOR_CONSTRAINTS m_EdgeConnectorConstraints;
bool m_CastellatedPads; ///< True if castellated pads exist
bool m_EdgePlating; ///< True if the edge board is plated
private:
// The list of items describing the stackup for fabrication.
// this is not just copper layers, but also mask dielectric layers
std::vector<BOARD_STACKUP_ITEM*> m_list;
};
#endif // CLASS_BOARD_STACKUP_H
#endif // BOARD_STACKUP_H

4
pcbnew/board_stackup_manager/board_stackup_reporter.cpp
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@ -2,7 +2,7 @@
* This program source code file is part of KiCad, a free EDA CAD application.
*
* Copyright (C) 2019 Jean-Pierre Charras, jp.charras at wanadoo.fr
* Copyright (C) 2019 KiCad Developers, see AUTHORS.txt for contributors.
* Copyright (C) 2019-2021 KiCad Developers, see AUTHORS.txt for contributors.
*
* This program is free software; you can redistribute it and/or
* modify it under the terms of the GNU General Public License
@ -31,7 +31,7 @@
#include <base_units.h>
#include <locale_io.h>
#include "class_board_stackup.h"
#include "board_stackup.h"
#include "stackup_predefined_prms.h"
#include "board_stackup_reporter.h"

4
pcbnew/board_stackup_manager/panel_board_stackup.h
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@ -2,7 +2,7 @@
* This program source code file is part of KiCad, a free EDA CAD application.
*
* Copyright (C) 2019 Jean-Pierre Charras, jp.charras at wanadoo.fr
* Copyright (C) 2009-2019 KiCad Developers, see AUTHORS.txt for contributors.
* Copyright (C) 2009-2021 KiCad Developers, see AUTHORS.txt for contributors.
*
* This program is free software; you can redistribute it and/or
* modify it under the terms of the GNU General Public License
@ -31,7 +31,7 @@
#include <wx/gdicmn.h>
#include "panel_board_stackup_base.h"
#include "class_board_stackup.h"
#include "board_stackup.h"
#include "stackup_predefined_prms.h"
#include "dielectric_material.h"

32
pcbnew/board_stackup_manager/stackup_predefined_prms.cpp
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@ -2,7 +2,7 @@
* This program source code file is part of KiCad, a free EDA CAD application.
*
* Copyright (C) 2019 Jean-Pierre Charras, jp.charras at wanadoo.fr
* Copyright (C) 2009-2019 KiCad Developers, see AUTHORS.txt for contributors.
* Copyright (C) 2009-2021 KiCad Developers, see AUTHORS.txt for contributors.
*
* This program is free software; you can redistribute it and/or
* modify it under the terms of the GNU General Public License
@ -27,7 +27,7 @@
* @file stackup_predefined_prms.cpp
*/
#include "class_board_stackup.h"
#include "board_stackup.h"
#include <convert_to_biu.h>
#include <core/arraydim.h>
#include <layers_id_colors_and_visibility.h>
@ -42,20 +42,20 @@
// These names are in fact usual copper finish names.
static wxString CopperFinishType[] =
{
NotSpecifiedPrm(), // Not specified, not in .gbrjob file
_HKI("ENIG"), // used in .gbrjob file
_HKI("ENEPIG"), // used in .gbrjob file
_HKI("HAL SnPb"), // used in .gbrjob file
_HKI("HAL lead-free"), // used in .gbrjob file
_HKI("Hard gold"), // used in .gbrjob file
_HKI("Immersion tin"), // used in .gbrjob file
_HKI("Immersion nickel"), // used in .gbrjob file
_HKI("Immersion silver"), // used in .gbrjob file
_HKI("Immersion gold"), // used in .gbrjob file
_HKI("HT_OSP"), // used in .gbrjob file
_HKI("OSP"), // used in .gbrjob file
_HKI("None"), // used in .gbrjob file
_HKI("User defined") // keep this option at end
NotSpecifiedPrm(), // Not specified, not in .gbrjob file
_HKI( "ENIG" ), // used in .gbrjob file
_HKI( "ENEPIG" ), // used in .gbrjob file
_HKI( "HAL SnPb" ), // used in .gbrjob file
_HKI( "HAL lead-free" ), // used in .gbrjob file
_HKI( "Hard gold" ), // used in .gbrjob file
_HKI( "Immersion tin" ), // used in .gbrjob file
_HKI( "Immersion nickel" ), // used in .gbrjob file
_HKI( "Immersion silver" ), // used in .gbrjob file
_HKI( "Immersion gold" ), // used in .gbrjob file
_HKI( "HT_OSP" ), // used in .gbrjob file
_HKI( "OSP" ), // used in .gbrjob file
_HKI( "None" ), // used in .gbrjob file
_HKI( "User defined" ) // keep this option at end
};