Don't do any hole clearance testing within a single footprint.

Fixes https://gitlab.com/kicad/code/kicad/issues/8141
This commit is contained in:
Jeff Young 2021-04-11 16:01:34 +01:00
parent 7ba110bd77
commit 2cde76a191
3 changed files with 2 additions and 10 deletions

View File

@ -509,8 +509,7 @@ bool DRC_TEST_PROVIDER_COPPER_CLEARANCE::testPadAgainstItem( PAD* pad, SHAPE* pa
if( fp->IsNetTie() && ( other->Type() == PCB_FP_SHAPE_T || other->Type() == PCB_PAD_T ) )
testClearance = false;
// CADSTAR implements thermal vias using pads insteads of vias
if( fp->AllowThermalPads() && other->Type() == PCB_PAD_T )
// No hole testing within a footprint
testHoles = false;
}

View File

@ -241,12 +241,6 @@ public:
return GetKeywords().StartsWith( wxT( "net tie" ) );
}
// Might as well keep all the hacks in the same place....
bool AllowThermalPads() const
{
return GetKeywords().StartsWith( wxT( "allow thermal pads" ) );
}
void Move( const wxPoint& aMoveVector ) override;
void Rotate( const wxPoint& aRotCentre, double aAngle ) override;

View File

@ -655,7 +655,6 @@ void CADSTAR_PCB_ARCHIVE_LOADER::loadComponentLibrary()
wxT( "" ) );
FOOTPRINT* footprint = new FOOTPRINT( m_board );
footprint->SetPosition( getKiCadPoint( component.Origin ) );
footprint->SetKeywords( wxT( "allow thermal pads" ) );
LIB_ID libID;
libID.Parse( fpName, true );