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Translated using Weblate (Chinese (Simplified)) 

Currently translated at 100.0% (7022 of 7022 strings)

Translation: KiCad EDA/master source
Translate-URL: https://hosted.weblate.org/projects/kicad/master-source/zh_Hans/
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taotieren 2021-08-10 03:29:19 +00:00 committed by Hosted Weblate
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translation/pofiles/zh_CN.po
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@ -13,8 +13,8 @@ msgstr ""
"Project-Id-Version: KiCad_zh_CN_Master_v0.0.32\n"
"Report-Msgid-Bugs-To: \n"
"POT-Creation-Date: 2021-07-19 08:40-0700\n"
"PO-Revision-Date: 2021-08-01 22:02+0000\n"
"Last-Translator: David Chen <d0123456789g@yahoo.com.tw>\n"
"PO-Revision-Date: 2021-08-10 15:22+0000\n"
"Last-Translator: taotieren <admin@taotieren.com>\n"
"Language-Team: Chinese (Simplified) <https://hosted.weblate.org/projects/"
"kicad/master-source/zh_Hans/>\n"
"Language: zh_CN\n"
@ -24286,7 +24286,7 @@ msgstr "警告：阻焊层的负间隙大于焊盘。不会产生阻焊层。"
msgid ""
"Warning: Negative solder paste margins larger than pad. No solder paste mask "
"will be generated."
msgstr "警告：负焊膏边缘大于焊盘。不会生成锡膏掩模。"
msgstr "警告：负焊膏边缘大于焊盘。不会生成锡膏层。"
#: pcbnew/dialogs/dialog_pad_properties.cpp:1314
msgid "Error: pad has no layer."