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thru hole padstack with different copper layer masks fix

This commit is contained in:
dickelbeck 2008-03-12 16:24:38 +00:00
parent 33e06f28a1
commit 8ab53fc6aa
1 changed files with 47 additions and 35 deletions
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82
pcbnew/specctra_export.cpp
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@ -292,13 +292,22 @@ static bool isRectangle( POINT_PAIRS& aList )
/**
* Function isKeepout
* Function isRoundKeepout
* decides if the pad is a copper-less through hole which needs to be made into
* a round keepout.
*/
static bool isKeepout( D_PAD* aPad )
static bool isRoundKeepout( D_PAD* aPad )
{
return aPad->m_PadShape==PAD_CIRCLE && aPad->m_Drill.x >= aPad->m_Size.x;
if( aPad->m_PadShape==PAD_CIRCLE )
{
if( aPad->m_Drill.x >= aPad->m_Size.x )
return true;
if( (aPad->m_Masque_Layer & ALL_CU_LAYERS) == 0 )
return true;
}
return false;
}
@ -344,33 +353,26 @@ PADSTACK* SPECCTRA_DB::makePADSTACK( BOARD* aBoard, D_PAD* aPad )
char name[80]; // padstack name builder
std::string uniqifier;
bool doLayer[2] = { // top and bottom layers only
aPad->IsOnLayer( LAYER_CMP_N ),
aPad->IsOnLayer( COPPER_LAYER_N )
};
// caller must do these checks before calling here.
wxASSERT( !isKeepout( aPad ) );
wxASSERT( doLayer[0] || doLayer[1] );
wxASSERT( !isRoundKeepout( aPad ) );
PADSTACK* padstack = new PADSTACK();
int reportedLayers = 0; // how many in reported padstack
const char* layerName[NB_COPPER_LAYERS];
if( aPad->m_Attribut==PAD_SMD || aPad->m_Attribut==PAD_CONN )
{
// PAD_SMD and PAD_CONN are reported on each layer for which
// they are present.
uniqifier = '[';
if( doLayer[0] )
if( aPad->IsOnLayer( LAYER_CMP_N ) )
{
layerName[reportedLayers++] = layerIds[0].c_str();
uniqifier += 'T'; // T for top, could have used a layer index here alternatively
}
if( doLayer[1] )
if( aPad->IsOnLayer( COPPER_LAYER_N ) )
{
int pcbLayerNdx = kicadLayer2pcb[COPPER_LAYER_N];
layerName[reportedLayers++] = layerIds[ pcbLayerNdx ].c_str();
@ -382,30 +384,37 @@ PADSTACK* SPECCTRA_DB::makePADSTACK( BOARD* aBoard, D_PAD* aPad )
else // through hole pad
{
#if 0
/* Through hole pads are reported on the <reserved_layer_name>
"signal". Reporting through hole pads on the special
"signal" layer may have problems when power layers are in the layer
stack. See bottom of page 74 of the SECCTRA Design Language
Reference, May 2000. We could do better if there was actually a
"layer type" field within Kicad which would hold one of: T_signal,
T_power, T_mixed, T_jumper.
*/
uniqifier = '[';
reportedLayers = 1;
layerName[0] = "signal";
uniqifier = "[A]"; // A for all
#else
// Through hole pads are reported on *all* copper layers.
int copperLayers = aBoard->GetCopperLayerCount();
for( int layer=0; layer<copperLayers; ++layer )
bool onAllCopperLayers = false;
if( (aPad->m_Masque_Layer & ALL_CU_LAYERS) == ALL_CU_LAYERS )
{
layerName[reportedLayers++] = layerIds[layer].c_str();
onAllCopperLayers = true;
uniqifier += 'A'; // A for all layers
}
uniqifier = "[A]"; // A for all
#endif
const int copperCount = aBoard->GetCopperLayerCount();
for( int layer=0; layer<copperCount; ++layer )
{
int kilayer = pcbLayer2kicad[layer];
if( onAllCopperLayers || aPad->IsOnLayer( kilayer ) )
{
layerName[reportedLayers++] = layerIds[layer].c_str();
if( !onAllCopperLayers )
{
if( layer == 0 )
uniqifier += 'T';
else if( layer == copperCount-1 )
uniqifier += 'B';
else
uniqifier += char('0' + layer); // layer index char
}
}
}
uniqifier += ']';
}
POINT dsnOffset;
@ -566,7 +575,7 @@ IMAGE* SPECCTRA_DB::makeIMAGE( BOARD* aBoard, MODULE* aModule )
D_PAD* pad = (D_PAD*) moduleItems[p];
// see if this pad is a through hole with no copper on its perimeter
if( isKeepout( pad ) )
if( isRoundKeepout( pad ) )
{
double diameter = scale( pad->m_Drill.x );
POINT vertex = mapPt( pad->m_Pos0 );
@ -585,6 +594,9 @@ IMAGE* SPECCTRA_DB::makeIMAGE( BOARD* aBoard, MODULE* aModule )
circle->SetLayerId( layerIds[layer].c_str() );
}
}
// else if() could there be a square keepout here?
else
{
PADSTACK* padstack = makePADSTACK( aBoard, pad );