Translated using Weblate (Chinese (Simplified))

Currently translated at 99.9% (7456 of 7459 strings)

Translation: KiCad EDA/master source
Translate-URL: https://hosted.weblate.org/projects/kicad/master-source/zh_Hans/
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taotieren 2022-03-16 10:32:44 +00:00 committed by Hosted Weblate
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@ -19,7 +19,7 @@ msgstr ""
"Project-Id-Version: KiCad_zh_CN_Master_v0.0.32\n"
"Report-Msgid-Bugs-To: \n"
"POT-Creation-Date: 2022-03-07 16:51-0800\n"
"PO-Revision-Date: 2022-03-16 10:29+0000\n"
"PO-Revision-Date: 2022-03-17 02:47+0000\n"
"Last-Translator: taotieren <admin@taotieren.com>\n"
"Language-Team: Chinese (Simplified) <https://hosted.weblate.org/projects/"
"kicad/master-source/zh_Hans/>\n"
@ -742,7 +742,7 @@ msgstr "显示模型边框"
#: 3d-viewer/dialogs/panel_3D_opengl_options_base.cpp:28
msgid "Show copper and tech layers thickness (very slow)"
msgstr "显示铜和技术层厚度(非常慢)"
msgstr "显示铜层和技术层厚度 (非常慢)"
#: 3d-viewer/dialogs/panel_3D_opengl_options_base.cpp:31
msgid "Highlight items on rollover"
@ -3484,7 +3484,7 @@ msgstr "微孔外径"
#: common/dialogs/panel_setup_netclasses_base.cpp:47
#: pcbnew/dialogs/dialog_global_edit_tracks_and_vias.cpp:233
msgid "uVia Hole"
msgstr "U 形辅助孔"
msgstr "形辅助孔"
#: common/dialogs/panel_setup_netclasses_base.cpp:48
msgid "DP Width"
@ -18007,7 +18007,7 @@ msgstr "RS274X: 命令 \"IR\" 旋转值不允许"
#: gerbview/rs274x.cpp:649
msgid "RS274X: Command KNOCKOUT ignored by GerbView"
msgstr "RS274X: GerbView 命令阴文(反相)被忽略"
msgstr "RS274X: GerbView 命令反相被忽略"
#: gerbview/toolbars_gerber.cpp:129
msgid "Highlight items belonging to this component"
@ -22745,11 +22745,11 @@ msgstr "约束解析报告"
#: pcbnew/dialogs/dialog_copper_zones.cpp:202
msgid "Teardrop on Vias/Pads Properties"
msgstr "过孔/焊盘上泪滴属性"
msgstr "过孔/焊盘上泪滴属性"
#: pcbnew/dialogs/dialog_copper_zones.cpp:206
msgid "Teardrop on Tracks Properties"
msgstr "导线上泪滴属性"
msgstr "布线上的泪滴属性"
#: pcbnew/dialogs/dialog_copper_zones.cpp:210
msgid "Teardrop Properties"
@ -22847,7 +22847,7 @@ msgstr "完全填充"
#: pcbnew/dialogs/dialog_non_copper_zones_properties_base.cpp:67
#: pcbnew/dialogs/dialog_rule_area_properties_base.cpp:131
msgid "Outline hatch pitch:"
msgstr ""
msgstr "轮廓 hatch 间距:"
#: pcbnew/dialogs/dialog_copper_zones_base.cpp:157
#: pcbnew/dialogs/dialog_non_copper_zones_properties_base.cpp:89
@ -23015,13 +23015,13 @@ msgstr "小于此的孤铜将被移除"
#: pcbnew/dialogs/dialog_copper_zones_base.cpp:398
msgid "Export Settings to Other Similar Zones"
msgstr "导出设置到其他类似区域"
msgstr "将设置导出到其他类似区域"
#: pcbnew/dialogs/dialog_copper_zones_base.cpp:399
msgid ""
"Export this zone setup (excluding layer and net selection) to other similar "
"copper zones (teardrops or usual copper zones)."
msgstr "导出该区域设置 (除层和网络选择) 到其他相似铜区域(泪滴或通常的铜区域)。"
msgstr "将该区域设置 (不包括层和网络选择) 输出到其他类似的铜区 (泪滴或普通铜区)。"
#: pcbnew/dialogs/dialog_copper_zones_base.h:142
msgid "Copper Zone Properties"
@ -24395,10 +24395,10 @@ msgid ""
"ratio.\n"
"A negative value means a smaller stencil aperture size than pad size."
msgstr ""
"这是焊盘和此封装的锡膏之间的局部间隙。\n"
"该值可以被一个焊盘局部值代替。\n"
"最终间隙值是此值与间隙值比率的总和。\n"
"负值表示比焊盘尺寸更小的版膜开口尺寸。"
"这是此封装的焊盘和焊膏之间的局部间隙。\n"
"此值可由焊盘局部值替代。\n"
"最终的间距值是该值与间距值比率之和。\n"
"负值表示阻焊尺寸小于焊盘尺寸。"
#: pcbnew/dialogs/dialog_footprint_properties_base.cpp:314
#: pcbnew/dialogs/dialog_footprint_properties_fp_editor_base.cpp:285
@ -24408,7 +24408,7 @@ msgid "Solder paste relative clearance:"
msgstr "焊膏相对间隙:"
#: pcbnew/dialogs/dialog_footprint_properties_base.cpp:316
#, c-format
#, c-format, fuzzy
msgid ""
"This is the local clearance ratio applied as a percentage of the pad width "
"and height for this footprint.\n"
@ -24419,11 +24419,11 @@ msgid ""
"clearance value.\n"
"A negative value means a smaller stencil aperture size than pad size."
msgstr ""
"这是作为此封装焊盘宽和高度的百分比应用的局部间隙比。\n"
"值为 10 表示水平间隙值为焊盘宽度的 10% o垂直间隙值为焊盘高度的 10% o。\n"
"这个值可被焊盘局部值所取代。\n"
"最终间隙值是该值与绝对间隙值的总和。\n"
"负值意味着比焊盘尺寸更小的版膜开口尺寸。"
"这是以此封装的焊盘宽度和高度的百分比形式应用的局部间隙比率。\n"
"值为 10 表示水平间距值是焊盘宽度的 10%,垂直间距值是焊盘高度的 10%。\n"
"该值可由焊盘局部值替代。\n"
"最终间距值是该值与绝对间距值之和。\n"
"负值表示阻焊尺寸小于焊盘尺寸。"
#: pcbnew/dialogs/dialog_footprint_properties_base.cpp:339
#: pcbnew/dialogs/dialog_footprint_properties_fp_editor_base.cpp:310
@ -24545,15 +24545,13 @@ msgid ""
"This value can be overridden on a pad-by-pad basis in the Local\n"
"Clearance and Settings tab of Pad Properties."
msgstr ""
"这是焊盘和此封装的焊膏之间\n"
"的局部间隙。\n"
"最终间隙值是该值与间隙值比之和。\n"
"负值表示比焊盘尺寸小的版膜开口尺寸。\n"
"可以在“焊盘属性”的“局部间隙和设置”选项卡中\n"
"逐个焊盘覆写此值。"
"这是此封装的焊盘和焊膏之间的局部间隙。\n"
"最终的间距值是该值与间距值比率之和。\n"
"负值表示阻焊尺寸小于焊盘尺寸。\n"
"可以在焊盘属性的局部间隙和设置选项卡中逐个焊盘覆盖此值。"
#: pcbnew/dialogs/dialog_footprint_properties_fp_editor_base.cpp:287
#, c-format
#, c-format, fuzzy
msgid ""
"This is the local clearance ratio applied as a percentage of the pad width "
"and height for this footprint.\n"
@ -24565,11 +24563,11 @@ msgid ""
"This value can be overridden on a pad-by-pad basis in the Local Clearance "
"and Settings tab of Pad Properties."
msgstr ""
"这是作为此封装焊盘宽度和高度百分比应用的局部间隙比。\n"
"值为 10 表示水平间隙值是焊盘宽度的 10% o垂直间隙值是焊盘高度的 10% o。\n"
"最终间隙值是此值和绝对间隙值之和。\n"
"负值表示比焊盘尺寸更小的版膜开口尺寸。\n"
"可以在“焊盘属性”的“局部间隙和设置”选项卡中逐个焊盘覆写此值。"
"这是以此布线的焊盘宽度和高度的百分比形式应用的局部间隙比率。\n"
"值为 10 表示水平间距值是焊盘宽度的 10%,垂直间距值是焊盘高度的 10%。\n"
"最终间距值是该值与绝对间距值之和。\n"
"负值表示模板阻焊尺寸小于焊盘尺寸。\n"
"可以在焊盘属性的局部间隙和设置选项卡中逐个焊盘覆盖此值。"
#: pcbnew/dialogs/dialog_footprint_wizard_list.cpp:144
msgid "All footprint generator scripts were loaded"
@ -25125,7 +25123,7 @@ msgstr "过孔外径"
#: pcbnew/dialogs/dialog_global_edit_tracks_and_vias.cpp:232
msgid "uVia Diameter"
msgstr "uVia 外径"
msgstr "微孔外径"
#: pcbnew/dialogs/dialog_global_edit_tracks_and_vias_base.cpp:39
msgid "Filter Items"
@ -26219,7 +26217,7 @@ msgstr "来自父级封装"
#: pcbnew/dialogs/dialog_pad_properties_base.cpp:716
msgid "Zone knockout:"
msgstr "敷铜阴文(反相)"
msgstr "区域反相"
#: pcbnew/dialogs/dialog_pad_properties_base.cpp:720
msgid "Pad shape"
@ -27391,7 +27389,7 @@ msgstr "布线与过孔属性"
#: pcbnew/dialogs/dialog_track_via_size_base.h:53
msgid "Track and Via Dimensions"
msgstr "导线和过孔尺寸"
msgstr "布线和过孔标注"
#: pcbnew/dialogs/dialog_unused_pad_layers.cpp:147
msgid "Set Unused Pad Properties"
@ -29812,11 +29810,11 @@ msgstr "电路板边缘间隙违规"
#: pcbnew/drc/drc_item.cpp:80
msgid "Copper zones intersect"
msgstr "铜区交叉"
msgstr "铜区交叉"
#: pcbnew/drc/drc_item.cpp:84
msgid "Isolated copper fill"
msgstr "孤立的铜填充"
msgstr "隔离铜填充"
#: pcbnew/drc/drc_item.cpp:88
msgid "Thermal relief connection to zone incomplete"
@ -33968,7 +33966,7 @@ msgstr "过孔网络类值"
#: pcbnew/router/router_tool.cpp:247 pcbnew/tools/drawing_tool.cpp:116
#, c-format
msgid "Via %s, hole %s"
msgstr "过孔 %s孔 %s"
msgstr "过孔 %s孔 %s"
#: pcbnew/router/router_tool.cpp:251 pcbnew/tools/drawing_tool.cpp:122
#, c-format
@ -34916,7 +34914,7 @@ msgstr "特殊工具"
#: pcbnew/tools/edit_tool.cpp:342
#, c-format
msgid "Unable to resize arc tracks of %s or greater."
msgstr "无法将圆弧导线大小调整 %s 或更多。"
msgstr "无法调整 %s 或更大的弧形布线的尺寸。"
#: pcbnew/tools/edit_tool.cpp:673
msgid "Drag Arc Track"
@ -37326,7 +37324,7 @@ msgstr "规则区域"
#: pcbnew/zone.cpp:524
msgid "Teardrop Area"
msgstr "泪滴区域"
msgstr "泪滴面积"
#: pcbnew/zone.cpp:526
msgid "Copper Zone"