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Pcbnew: plot solder mask layer with min width value specified: algorithm modified to reduce artifacts.

This commit is contained in:
jean-pierre charras 2012-12-03 15:27:34 +01:00
parent affbb8a8e0
commit ac41e7009e
1 changed files with 71 additions and 13 deletions
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84
pcbnew/plot_board_layers.cpp
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@ -449,6 +449,20 @@ void PlotStandardLayer( BOARD *aBoard, PLOTTER* aPlotter,
/* Plot a solder mask layer.
* Solder mask layers have a minimum thickness value and cannot be drawn like standard layers,
* unless the minimum thickness is 0.
* Currently the algo is:
* 1 - build all pad shapes as polygons with a size inflated by
* mask clearance + (min width solder mask /2)
* 2 - Merge shapes
* 3 - deflate result by (min width solder mask /2)
* 4 - oring result by all pad shapes as polygons with a size inflated by
* mask clearance only (because deflate sometimes creates shape artifacts)
* 5 - draw result as plolygons.
*
* TODO:
* make this calculation only for shapes with clearance near than (min width solder mask)
* (using DRC algo)
* plot all other shapes by flashing the basing shape
* (shapes will be better, and calculations faster)
*/
void PlotSolderMaskLayer( BOARD *aBoard, PLOTTER* aPlotter,
long aLayerMask, const PCB_PLOT_PARAMS& aPlotOpt,
@ -461,9 +475,6 @@ void PlotSolderMaskLayer( BOARD *aBoard, PLOTTER* aPlotter,
BRDITEMS_PLOTTER itemplotter( aPlotter, aBoard, aPlotOpt );
itemplotter.SetLayerMask( aLayerMask );
// EDA_DRAW_MODE_T plotMode = aPlotOpt.GetMode();
// EDA_COLOR_T color = BLACK;
// Plot edge layer and graphic items
itemplotter.PlotBoardGraphicItems();
@ -494,7 +505,8 @@ void PlotSolderMaskLayer( BOARD *aBoard, PLOTTER* aPlotter,
// This extra margin is used to merge too close shapes
// (distance < aMinThickness), and will be removed when creating
// the actual shapes
std::vector <CPolyPt> bufferPolys; // Contains shapes to plot
std::vector <CPolyPt> bufferPolys; // Contains shapes to plot
std::vector <CPolyPt> initialPolys; // Contains exact shapes to plot
/* calculates the coeff to compensate radius reduction of holes clearance
* due to the segment approx ( 1 /cos( PI/circleToSegmentsCount )
@ -510,16 +522,55 @@ void PlotSolderMaskLayer( BOARD *aBoard, PLOTTER* aPlotter,
if( (pad->GetLayerMask() & aLayerMask) == 0 )
continue;
int margin = pad->GetSolderMaskMargin() + inflate;
pad->TransformShapeWithClearanceToPolygon( bufferPolys, margin,
circleToSegmentsCount,
correction );
int clearance = pad->GetSolderMaskMargin();
int margin = clearance + inflate;
// For rect and trap. pads, use a polygon with the same shape
// (i.e. with no rounded corners)
if( (pad->GetShape() == PAD_RECT) || (pad->GetShape() == PAD_TRAPEZOID) )
{
wxPoint coord[4];
CPolyPt corner;
pad->BuildPadPolygon( coord, wxSize( margin, margin ),
pad->GetOrientation() );
for( int ii = 0; ii < 4; ii++ )
{
coord[ii] += pad->ReturnShapePos();
corner.x = coord[ii].x;
corner.y = coord[ii].y;
corner.end_contour = (ii == 3);
bufferPolys.push_back( corner );
}
pad->BuildPadPolygon( coord, wxSize( clearance, clearance ),
pad->GetOrientation() );
for( int ii = 0; ii < 4; ii++ )
{
coord[ii] += pad->ReturnShapePos();
corner.x = coord[ii].x;
corner.y = coord[ii].y;
corner.end_contour = (ii == 3);
initialPolys.push_back( corner );
}
}
else
{
pad->TransformShapeWithClearanceToPolygon( bufferPolys, clearance + inflate,
circleToSegmentsCount,
correction );
pad->TransformShapeWithClearanceToPolygon( initialPolys, clearance,
circleToSegmentsCount,
correction );
}
}
}
// Plot vias on solder masks, if aPlotOpt.GetPlotViaOnMaskLayer() is true,
if( aPlotOpt.GetPlotViaOnMaskLayer() )
{
// The current layer is a solder mask,
// use the global mask clearance for vias
int via_clearance = aBoard->GetDesignSettings().m_SolderMaskMargin;
int via_margin = via_clearance + inflate;
for( TRACK* track = aBoard->m_Track; track; track = track->Next() )
{
if( track->Type() != PCB_VIA_T )
@ -540,13 +591,12 @@ void PlotSolderMaskLayer( BOARD *aBoard, PLOTTER* aPlotter,
if( ( via_mask_layer & aLayerMask ) == 0 )
continue;
// The current layer is a solder mask,
// use the global mask clearance for vias
int via_margin = aBoard->GetDesignSettings().m_SolderMaskMargin + inflate;
via->TransformShapeWithClearanceToPolygon( bufferPolys, via_margin,
circleToSegmentsCount,
correction );
via->TransformShapeWithClearanceToPolygon( initialPolys, via_clearance,
circleToSegmentsCount,
correction );
}
}
@ -569,6 +619,8 @@ void PlotSolderMaskLayer( BOARD *aBoard, PLOTTER* aPlotter,
// 2 - deflate resulting areas by aMinThickness/2
KI_POLYGON_SET areasToMerge;
AddPolygonCornersToKiPolygonList( bufferPolys, areasToMerge );
KI_POLYGON_SET initialAreas;
AddPolygonCornersToKiPolygonList( initialPolys, initialAreas );
// Merge polygons: because each shape was created with an extra margin
// = aMinThickness/2, shapes too close ( dist < aMinThickness )
@ -577,7 +629,13 @@ void PlotSolderMaskLayer( BOARD *aBoard, PLOTTER* aPlotter,
areas |= areasToMerge;
// Deflate: remove the extra margin, to create the actual shapes
areas -= inflate;
// Here I am using ploygon:resize, because this function creates better shapes
// than deflate algo.
// Use here deflate with arc creation and 16 segments per circle to create arcs
areas = resize( areas, -inflate , true, 16 );
// Resize slighly changes shapes. So *ensure* initial shapes are kept
areas |= initialAreas;
// To avoid a lot of code, use a ZONE_CONTAINER
// to plot polygons, because they are exactly like