3D viewer: Fix gap between plating and annulus copper

Hide transition by ending layer copper withing the annulus of the cylinder. Also always use hole wall thickness and set more realistic solder mask thickness
This commit is contained in:
david-beinder 2021-04-18 22:17:31 +02:00 committed by jean-pierre charras
parent ba3f0d5d07
commit e0f69ad28b
3 changed files with 14 additions and 11 deletions

View File

@ -242,10 +242,10 @@ bool BOARD_ADAPTER::IsFootprintShown( FOOTPRINT_ATTR_T aFPAttributes ) const
// !TODO: define the actual copper thickness by user from board stackup
#define COPPER_THICKNESS Millimeter2iu( 0.035 ) // for 35 um
// The solder mask layer (and silkscreen) thickness
#define TECH_LAYER_THICKNESS Millimeter2iu( 0.04 )
#define TECH_LAYER_THICKNESS Millimeter2iu( 0.025 )
// The solder paste thickness is chosen bigger than the solder mask layer
// to be sure is covers the mask when overlapping.
#define SOLDERPASTE_LAYER_THICKNESS Millimeter2iu( 0.08 )
#define SOLDERPASTE_LAYER_THICKNESS Millimeter2iu( 0.04 )
int BOARD_ADAPTER::GetHolePlatingThickness() const noexcept
{

View File

@ -269,7 +269,9 @@ void BOARD_ADAPTER::createLayers( REPORTER* aStatusReporter )
const VIA* via = static_cast<const VIA*>( track );
const VIATYPE viatype = via->GetViaType();
const float holediameter = via->GetDrillValue() * BiuTo3dUnits();
const float thickness = GetCopperThickness();
// holes and layer copper extend half info cylinder wall to hide transition
const float thickness = GetHolePlatingThickness() * BiuTo3dUnits() / 2.0f;
const float hole_inner_radius = ( holediameter / 2.0f );
const float ring_radius = via->GetWidth() * BiuTo3dUnits() / 2.0f;
@ -456,7 +458,7 @@ void BOARD_ADAPTER::createLayers( REPORTER* aStatusReporter )
// The hole in the body is inflated by copper thickness, if not plated, no copper
const int inflate = ( pad->GetAttribute () != PAD_ATTRIB_NPTH ) ?
GetHolePlatingThickness() : 0;
GetHolePlatingThickness() / 2 : 0;
m_holeCount++;
m_averageHoleDiameter += ( ( pad->GetDrillSize().x +

View File

@ -721,6 +721,9 @@ void RENDER_3D_LEGACY::generateCylinder( const SFVEC2F& aCenter, float aInnerRad
void RENDER_3D_LEGACY::generateViasAndPads()
{
const int platingThickness = m_boardAdapter.GetHolePlatingThickness();
const float platingThickness3d = platingThickness * m_boardAdapter.BiuTo3dUnits();
if( m_boardAdapter.GetViaCount() > 0 )
{
const unsigned int reserve_nr_triangles_estimation =
@ -741,7 +744,6 @@ void RENDER_3D_LEGACY::generateViasAndPads()
const VIA* via = static_cast<const VIA*>( track );
const float holediameter = via->GetDrillValue() * m_boardAdapter.BiuTo3dUnits();
const float thickness = m_boardAdapter.GetCopperThickness();
const int nrSegments = m_boardAdapter.GetCircleSegmentCount( via->GetDrillValue() );
const float hole_inner_radius = holediameter / 2.0f;
@ -758,7 +760,8 @@ void RENDER_3D_LEGACY::generateViasAndPads()
wxASSERT( zbot < ztop );
generateCylinder( via_center, hole_inner_radius, hole_inner_radius + thickness,
generateCylinder( via_center, hole_inner_radius,
hole_inner_radius + platingThickness3d,
ztop, zbot, nrSegments, layerTriangleVIA );
}
}
@ -790,13 +793,11 @@ void RENDER_3D_LEGACY::generateViasAndPads()
if( !hasHole )
continue;
const int copperThickness = m_boardAdapter.GetHolePlatingThickness();
pad->TransformHoleWithClearanceToPolygon( tht_outer_holes_poly,
copperThickness,
ARC_LOW_DEF, ERROR_INSIDE );
platingThickness,
ARC_HIGH_DEF, ERROR_INSIDE );
pad->TransformHoleWithClearanceToPolygon( tht_inner_holes_poly, 0,
ARC_LOW_DEF, ERROR_INSIDE );
ARC_HIGH_DEF, ERROR_INSIDE );
}
}
}