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Blind/buried vias are drilled, and drilled holes need to avoid prior-burned holes. 

Fixes https://gitlab.com/kicad/code/kicad/issues/13627
This commit is contained in:
Jeff Young 2023-01-23 14:24:12 +00:00
parent c430c88f9d
commit ece775c53c
1 changed files with 8 additions and 6 deletions
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14
pcbnew/drc/drc_test_provider_hole_to_hole.cpp
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@ -145,7 +145,7 @@ bool DRC_TEST_PROVIDER_HOLE_TO_HOLE::Run()
{
PAD* pad = static_cast<PAD*>( item );
// We only care about drilled (ie: round) holes
// Slots are generally milled _after_ drilling, so we ignore them.
if( pad->GetDrillSize().x && pad->GetDrillSize().x == pad->GetDrillSize().y )
m_holeTree.Insert( item, Edge_Cuts, m_largestHoleToHoleClearance );
}
@ -153,9 +153,9 @@ bool DRC_TEST_PROVIDER_HOLE_TO_HOLE::Run()
{
PCB_VIA* via = static_cast<PCB_VIA*>( item );
// We only care about mechanically drilled (ie: non-laser) holes
if( via->GetViaType() == VIATYPE::THROUGH )
m_holeTree.Insert( item, Edge_Cuts, m_largestHoleToHoleClearance );
// Blind/buried/microvias will be drilled/burned _prior_ to lamination, so
// subsequently drilled holes need to avoid them.
m_holeTree.Insert( item, Edge_Cuts, m_largestHoleToHoleClearance );
}
return true;
@ -173,8 +173,10 @@ bool DRC_TEST_PROVIDER_HOLE_TO_HOLE::Run()
if( !reportProgress( ii++, count, progressDelta ) )
return false; // DRC cancelled
// We only care about mechanically drilled (ie: non-laser) holes
if( via->GetViaType() == VIATYPE::THROUGH )
// We only care about mechanically drilled (ie: non-laser) holes. These include both
// blind/buried via holes (drilled prior to lamination) and through-via and drilled pad
// holes (which are generally drilled post laminataion).
if( via->GetViaType() != VIATYPE::MICROVIA )
{
std::shared_ptr<SHAPE_CIRCLE> holeShape = getDrilledHoleShape( via );