Step exporter: code cleaning and merge connected tracks in polygons

pcbnew/exporters/step/exporter_step.cpp

@@ -121,6 +121,7 @@ EXPORTER_STEP::EXPORTER_STEP( BOARD* aBoard, const EXPORTER_STEP_PARAMS& aParams
     m_boardThickness( DEFAULT_BOARD_THICKNESS_MM )
 {
     m_solderMaskColor = COLOR4D( 0.08, 0.20, 0.14, 0.83 );
+    m_copperColor = COLOR4D( 0.7, 0.61, 0.0, 1.0 );
 
     m_resolver = std::make_unique<FILENAME_RESOLVER>();
     m_resolver->Set3DConfigDir( wxT( "" ) );
@@ -135,7 +136,7 @@ EXPORTER_STEP::~EXPORTER_STEP()
 }
 
 
-bool EXPORTER_STEP::composePCB( FOOTPRINT* aFootprint, VECTOR2D aOrigin )
+bool EXPORTER_STEP::buildFootprint3DShapes( FOOTPRINT* aFootprint, VECTOR2D aOrigin )
 {
     bool hasdata = false;
 
@@ -152,6 +153,20 @@ bool EXPORTER_STEP::composePCB( FOOTPRINT* aFootprint, VECTOR2D aOrigin )
         }
     }
 
+    // Build 3D shapes of the footprint graphic items on external layers:
+    if( ExportTracksAndVias() )
+    {
+        int maxError = m_board->GetDesignSettings().m_MaxError;
+        aFootprint->TransformFPShapesToPolySet( m_top_copper_shapes, F_Cu, 0, maxError, ERROR_INSIDE,
+                                               false, /* include text */
+                                               true, /* include shapes */
+                                               false /* include private items */ );
+        aFootprint->TransformFPShapesToPolySet( m_bottom_copper_shapes, B_Cu, 0, maxError, ERROR_INSIDE,
+                                               false, /* include text */
+                                               true, /* include shapes */
+                                               false /* include private items */ );
+    }
+
     if( ( aFootprint->GetAttributes() & FP_EXCLUDE_FROM_BOM ) && !m_params.m_includeExcludedBom )
     {
         return hasdata;
@@ -241,7 +256,7 @@ bool EXPORTER_STEP::composePCB( FOOTPRINT* aFootprint, VECTOR2D aOrigin )
 }
 
 
-bool EXPORTER_STEP::composePCB( PCB_TRACK* aTrack, VECTOR2D aOrigin )
+bool EXPORTER_STEP::buildTrack3DShape( PCB_TRACK* aTrack, VECTOR2D aOrigin )
 {
     if( aTrack->Type() == PCB_VIA_T )
     {
@@ -268,15 +283,18 @@ bool EXPORTER_STEP::composePCB( PCB_TRACK* aTrack, VECTOR2D aOrigin )
     SHAPE_POLY_SET copper_shapes;
     int maxError = m_board->GetDesignSettings().m_MaxError;
 
-    aTrack->TransformShapeToPolygon( copper_shapes, pcblayer, 0, maxError, ERROR_INSIDE );
+    if( pcblayer == F_Cu )
+        aTrack->TransformShapeToPolygon( m_top_copper_shapes, pcblayer, 0, maxError, ERROR_INSIDE );
+    else
+        aTrack->TransformShapeToPolygon( m_bottom_copper_shapes, pcblayer, 0, maxError, ERROR_INSIDE );
 
-    m_pcbModel->AddCopperPolygonShapes( &copper_shapes, pcblayer == F_Cu, aOrigin );
+    //m_pcbModel->AddCopperPolygonShapes( &copper_shapes, pcblayer == F_Cu, aOrigin );
 
     return true;
 }
 
 
-bool EXPORTER_STEP::composePCB()
+bool EXPORTER_STEP::buildBoard3DShapes()
 {
     if( m_pcbModel )
         return true;
@@ -303,6 +321,7 @@ bool EXPORTER_STEP::composePCB()
 
     // TODO: Handle when top & bottom soldermask colours are different...
     m_pcbModel->SetBoardColor( m_solderMaskColor.r, m_solderMaskColor.g, m_solderMaskColor.b );
+    m_pcbModel->SetCopperColor( m_copperColor.r, m_copperColor.g, m_copperColor.b );
 
     m_pcbModel->SetPCBThickness( m_boardThickness );
 
@@ -320,14 +339,20 @@ bool EXPORTER_STEP::composePCB()
     // For copper layers, only pads and tracks are added, because adding everything on copper
     // generate unreasonable file sizes and take a unreasonable calculation time.
     for( FOOTPRINT* fp : m_board->Footprints() )
-        composePCB( fp, origin );
+        buildFootprint3DShapes( fp, origin );
 
     if( ExportTracksAndVias() )
     {
         for( PCB_TRACK* track : m_board->Tracks() )
-            composePCB( track, origin );
+            buildTrack3DShape( track, origin );
     }
 
+    m_top_copper_shapes.Fracture( SHAPE_POLY_SET::PM_FAST );
+    m_bottom_copper_shapes.Fracture( SHAPE_POLY_SET::PM_FAST );
+
+    m_pcbModel->AddCopperPolygonShapes( &m_top_copper_shapes, true, origin );
+    m_pcbModel->AddCopperPolygonShapes( &m_bottom_copper_shapes, false, origin );
+
     ReportMessage( wxT( "Create PCB solid model\n" ) );
 
     wxString msg;
@@ -344,7 +369,7 @@ bool EXPORTER_STEP::composePCB()
 }
 
 
-void EXPORTER_STEP::determinePcbThickness()
+void EXPORTER_STEP::calculatePcbThickness()
 {
     m_boardThickness = DEFAULT_BOARD_THICKNESS_MM;
 
@@ -389,7 +414,7 @@ bool EXPORTER_STEP::Export()
     Message::DefaultMessenger()->AddPrinter( new KiCadPrinter( this ) );
 
     ReportMessage( _( "Determining PCB data\n" ) );
-    determinePcbThickness();
+    calculatePcbThickness();
     wxString msg;
     msg.Printf( _( "Board Thickness from stackup: %.3f mm\n" ), m_boardThickness );
     ReportMessage( msg );
@@ -398,7 +423,7 @@ bool EXPORTER_STEP::Export()
     {
         ReportMessage( _( "Build STEP data\n" ) );
 
-        if( !composePCB() )
+        if( !buildBoard3DShapes() )
         {
             ReportMessage( _( "\n** Error building STEP board model. Export aborted. **\n" ) );
             return false;

pcbnew/exporters/step/exporter_step.h

@@ -87,10 +87,10 @@ public:
     bool ExportTracksAndVias() { return m_params.m_exportTracks; }
 
 private:
-    bool composePCB();
+    bool buildBoard3DShapes();
-    bool composePCB( FOOTPRINT* aFootprint, VECTOR2D aOrigin );
+    bool buildFootprint3DShapes( FOOTPRINT* aFootprint, VECTOR2D aOrigin );
-    bool composePCB( PCB_TRACK* aTrack, VECTOR2D aOrigin );
+    bool buildTrack3DShape( PCB_TRACK* aTrack, VECTOR2D aOrigin );
-    void determinePcbThickness();
+    void calculatePcbThickness();
 
     EXPORTER_STEP_PARAMS m_params;
     std::unique_ptr<FILENAME_RESOLVER> m_resolver;
@@ -107,7 +107,11 @@ private:
 
     double m_boardThickness;
 
+    SHAPE_POLY_SET m_top_copper_shapes;
+    SHAPE_POLY_SET m_bottom_copper_shapes;
+
     KIGFX::COLOR4D m_solderMaskColor;
+    KIGFX::COLOR4D m_copperColor;
 };
 
 #endif

pcbnew/exporters/step/step_pcb_model.cpp

@@ -178,7 +178,7 @@ STEP_PCB_MODEL::STEP_PCB_MODEL( const wxString& aPcbName )
 {
     m_app = XCAFApp_Application::GetApplication();
     m_app->NewDocument( "MDTV-XCAF", m_doc );
-    m_assy = XCAFDoc_DocumentTool::ShapeTool ( m_doc->Main() );
+    m_assy = XCAFDoc_DocumentTool::ShapeTool( m_doc->Main() );
     m_assy_label = m_assy->NewShape();
     m_hasPCB = false;
     m_components = 0;
@@ -277,16 +277,19 @@ bool STEP_PCB_MODEL::AddPadHole( const PAD* aPad, const VECTOR2D& aOrigin )
         return false;
 
     VECTOR2I pos = aPad->GetPosition();
-    double holeZsize = m_boardThickness + ( m_copperThickness * 2 );
+    const double margin = 0.01;     // a small margin on the Z axix to be sure the hole
+                                    // is bigget than the board with copper
+                                    // must be > OCC_MAX_DISTANCE_TO_MERGE_POINTS
+    double holeZsize = m_boardThickness + ( m_copperThickness * 2 ) + ( margin * 2 );
 
     if( aPad->GetDrillShape() == PAD_DRILL_SHAPE_CIRCLE )
     {
         TopoDS_Shape s =
-                BRepPrimAPI_MakeCylinder( pcbIUScale.IUTomm( aPad->GetDrillSize().x ) * 0.5, holeZsize * 2.0 ).Shape();
+                BRepPrimAPI_MakeCylinder( pcbIUScale.IUTomm( aPad->GetDrillSize().x ) * 0.5, holeZsize ).Shape();
         gp_Trsf shift;
         shift.SetTranslation( gp_Vec( pcbIUScale.IUTomm( pos.x - aOrigin.x ),
                                       -pcbIUScale.IUTomm( pos.y - aOrigin.y ),
-                                      -holeZsize * 0.5 ) );
+                                      -m_copperThickness - margin ) );
         BRepBuilderAPI_Transform hole( s, shift );
         m_cutouts.push_back( hole.Shape() );
         return true;
@@ -304,7 +307,7 @@ bool STEP_PCB_MODEL::AddPadHole( const PAD* aPad, const VECTOR2D& aOrigin )
 
     if( holeOutlines.OutlineCount() > 0 )
     {
-        if( MakeShape( hole, holeOutlines.COutline( 0 ), holeZsize*2, -holeZsize * 0.5, aOrigin ) )
+        if( MakeShape( hole, holeOutlines.COutline( 0 ), holeZsize, -m_copperThickness - margin, aOrigin ) )
         {
             m_cutouts.push_back( hole );
         }
@@ -392,6 +395,14 @@ void STEP_PCB_MODEL::SetBoardColor( double r, double g, double b )
 }
 
 
+void STEP_PCB_MODEL::SetCopperColor( double r, double g, double b )
+{
+    m_copperColor[0] = r;
+    m_copperColor[1] = g;
+    m_copperColor[2] = b;
+}
+
+
 void STEP_PCB_MODEL::OCCSetMergeMaxDistance( double aDistance )
 {
     // Ensure a minimal value (in mm)
@@ -562,7 +573,7 @@ bool STEP_PCB_MODEL::CreatePCB( SHAPE_POLY_SET& aOutline, VECTOR2D aOrigin )
         for( TopoDS_Shape& hole : m_cutouts )
             holelist.Append( hole );
 
-        // Remove holes for each board (usually there is only one board
+        // Remove holes for each board (usually there is only one board)
         int cnt = 0;
         for( TopoDS_Shape& board: m_board_outlines )
         {
@@ -605,18 +616,18 @@ bool STEP_PCB_MODEL::CreatePCB( SHAPE_POLY_SET& aOutline, VECTOR2D aOrigin )
     // identically named assemblies.  So we want to avoid having the PCB be generally defaulted
     // to "Component" or "Assembly".
 
-    // color the PCB
+    // Init colors  for the board body and the copper items (if any)
     Handle( XCAFDoc_ColorTool ) colorTool = XCAFDoc_DocumentTool::ColorTool( m_doc->Main() );
-    Quantity_Color board_color( m_boardColor[0], m_boardColor[1], m_boardColor[2], Quantity_TOC_RGB );
+    Quantity_Color board_color( m_boardColor[0], m_boardColor[1], m_boardColor[2],
-    Quantity_Color copper_color( 0.7, 0.61, 0.0, Quantity_TOC_RGB );
+                                Quantity_TOC_RGB );
+    Quantity_Color copper_color( m_copperColor[0], m_copperColor[1], m_copperColor[2],
+                                 Quantity_TOC_RGB );
 
     int pcbIdx = 1;
     int copper_objects_cnt = 0;
 
     for( TDF_Label& pcb_label : m_pcb_labels )
     {
-        colorTool->SetColor( pcb_label, board_color, XCAFDoc_ColorSurf );
-
         Handle( TDataStd_TreeNode ) node;
 
         if( pcb_label.FindAttribute( XCAFDoc::ShapeRefGUID(), node ) )
@@ -628,10 +639,17 @@ bool STEP_PCB_MODEL::CreatePCB( SHAPE_POLY_SET& aOutline, VECTOR2D aOrigin )
             {
                 wxString pcbName;
 
-                if( m_pcb_labels.size() == 1 )
+                if( copper_objects_cnt < copper_item_count )
-                    pcbName = wxT( "PCB" );
+                {
+                    pcbName = wxString::Format( wxT( "Copper_Item%d" ), copper_objects_cnt+1 );
+                }
                 else
-                    pcbName = wxString::Format( wxT( "PCB%d" ), pcbIdx++ );
+                {
+                    if( m_pcb_labels.size() == 1 )
+                        pcbName = wxT( "PCB" );
+                    else
+                        pcbName = wxString::Format( wxT( "PCB%d" ), pcbIdx++ );
+                }
 
                 std::string                pcbNameStdString( pcbName.ToUTF8() );
                 TCollection_ExtendedString partname( pcbNameStdString.c_str() );
@@ -641,10 +659,11 @@ bool STEP_PCB_MODEL::CreatePCB( SHAPE_POLY_SET& aOutline, VECTOR2D aOrigin )
 
         // color the PCB
         TopExp_Explorer topex;
-        topex.Init( m_assy->GetShape( pcb_label ), TopAbs_SOLID );
+        topex.Init( m_assy->GetShape( pcb_label ), TopAbs_COMPOUND /*TopAbs_SOLID*/ );
 
         while( topex.More() )
         {
+            // First objects are copper objects, last(s) is the board body
             if( copper_objects_cnt < copper_item_count )
                 colorTool->SetColor( topex.Current(), copper_color, XCAFDoc_ColorSurf );
             else

pcbnew/exporters/step/step_pcb_model.h

@@ -44,9 +44,9 @@
 
 /**
  * Default distance between points to treat them as separate ones (mm)
- * 0.001 mm is a reasonable value. A too large value creates issues by
+ * 0.001 mm or less is a reasonable value. A too large value creates issues by
  * merging points that should be different.
- * Remember we are a 3D space, so a thin line can be broken if 2 points
+ * Remember we are a 3D space, so a thin shape can be broken if 2 points
  * are merged (in X, Y, Z coords) when they should not.
  * round shapes converted to polygon can also be not good with a to large value
  */
@@ -56,9 +56,11 @@ static constexpr double OCC_MAX_DISTANCE_TO_MERGE_POINTS = 0.001;
 static constexpr double BOARD_THICKNESS_DEFAULT_MM = 1.6;
 
 // minimum PCB thickness in mm (10 microns assumes a very thin polyimide film)
+// must be > OCC_MAX_DISTANCE_TO_MERGE_POINTS
 static constexpr double BOARD_THICKNESS_MIN_MM = 0.01;
 
 // default copper thickness in mm
+// must be > OCC_MAX_DISTANCE_TO_MERGE_POINTS
 static constexpr double COPPER_THICKNESS_DEFAULT_MM = 0.035;
 
 // Max error to approximate an arc by segments (in mm)
@@ -92,6 +94,7 @@ public:
                        VECTOR3D aOrientation, VECTOR3D aScale, bool aSubstituteModels = true );
 
     void SetBoardColor( double r, double g, double b );
+    void SetCopperColor( double r, double g, double b );
 
     // set the thickness of the PCB (mm); the top of the PCB shall be at Z = aThickness
     // aThickness < 0.0 == use default thickness
@@ -166,7 +169,8 @@ private:
     int                             m_components;       // number of successfully loaded components;
     double                          m_precision;        // model (length unit) numeric precision
     double                          m_angleprec;        // angle numeric precision
-    double                          m_boardColor[3];    // RGB values
+    double                          m_boardColor[3];    // board body, RGB values
+    double                          m_copperColor[3];   // copper, RGB values
     double                          m_boardThickness;   // PCB thickness, mm
     double                          m_copperThickness;  // copper thickness, mm