minor code cleanup
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@ -31,9 +31,7 @@ D_PAD::D_PAD( MODULE* parent ) : BOARD_CONNECTED_ITEM( parent, TYPE_PAD )
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m_PadShape = PAD_CIRCLE; // Shape: PAD_CIRCLE, PAD_RECT PAD_OVAL PAD_TRAPEZOID
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m_PadShape = PAD_CIRCLE; // Shape: PAD_CIRCLE, PAD_RECT PAD_OVAL PAD_TRAPEZOID
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m_Attribut = PAD_STANDARD; // Type: NORMAL, PAD_SMD, PAD_CONN
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m_Attribut = PAD_STANDARD; // Type: NORMAL, PAD_SMD, PAD_CONN
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m_DrillShape = PAD_CIRCLE; // Drill shape = circle
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m_DrillShape = PAD_CIRCLE; // Drill shape = circle
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// these layers are ok for a standard pad:
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m_Masque_Layer = PAD_STANDARD_DEFAULT_LAYERS; // set layers mask to default for a standard pad
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m_Masque_Layer = ALL_CU_LAYERS | SILKSCREEN_LAYER_CMP |\
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SOLDERMASK_LAYER_CU | SOLDERMASK_LAYER_CMP;
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SetSubRatsnest( 0 ); // used in ratsnest calculations
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SetSubRatsnest( 0 ); // used in ratsnest calculations
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ComputeRayon();
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ComputeRayon();
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@ -6,6 +6,21 @@ class Pcb3D_GLCanvas;
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#include "pad_shapes.h"
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#include "pad_shapes.h"
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/* Default layers used for pads, accordint to the pad type.
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* this is default values only, they can be changed for a given pad
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*/
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// PAD_STANDARD:
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#define PAD_STANDARD_DEFAULT_LAYERS ALL_CU_LAYERS | SILKSCREEN_LAYER_CMP | SOLDERMASK_LAYER_CU | SOLDERMASK_LAYER_CMP
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// PAD_CONN:
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#define PAD_CONN_DEFAULT_LAYERS CMP_LAYER | SOLDERPASTE_LAYER_CMP | SOLDERMASK_LAYER_CMP
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// PAD_SMD:
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#define PAD_SMD_DEFAULT_LAYERS CMP_LAYER | SOLDERMASK_LAYER_CMP
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//PAD_HOLE_NOT_PLATED:
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#define PAD_HOLE_NOT_PLATED_DEFAULT_LAYERS CUIVRE_LAYER | SILKSCREEN_LAYER_CMP | SOLDERMASK_LAYER_CU | SOLDERMASK_LAYER_CMP
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/* Definition type Structure d'un pad */
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/* Definition type Structure d'un pad */
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class D_PAD : public BOARD_CONNECTED_ITEM
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class D_PAD : public BOARD_CONNECTED_ITEM
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@ -31,16 +31,16 @@ int CodeType[NBTYPES] =
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static long Std_Pad_Layers[NBTYPES] =
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static long Std_Pad_Layers[NBTYPES] =
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{
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{
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// PAD_STANDARD:
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// PAD_STANDARD:
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ALL_CU_LAYERS | SILKSCREEN_LAYER_CMP | SOLDERMASK_LAYER_CU | SOLDERMASK_LAYER_CMP,
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PAD_STANDARD_DEFAULT_LAYERS,
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// PAD_CONN:
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// PAD_CONN:
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CMP_LAYER | SOLDERPASTE_LAYER_CMP | SOLDERMASK_LAYER_CMP,
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PAD_CONN_DEFAULT_LAYERS,
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// PAD_SMD:
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// PAD_SMD:
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CMP_LAYER | SOLDERMASK_LAYER_CMP,
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PAD_SMD_DEFAULT_LAYERS,
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//PAD_HOLE_NOT_PLATED:
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//PAD_HOLE_NOT_PLATED:
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CUIVRE_LAYER | SILKSCREEN_LAYER_CMP | SOLDERMASK_LAYER_CU | SOLDERMASK_LAYER_CMP
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PAD_HOLE_NOT_PLATED_DEFAULT_LAYERS
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};
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};
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