Update Eagle gold files for spoke angle fixes.
This commit is contained in:
Jeff Young
parent
75f9a5bda8
commit
f2a8c25084
|
|
@ -32,7 +32,7 @@
|
|||
(fp_line (start 3.5 1) (end -3.5 1)
|
||||
(stroke (width 0.127) (type solid)) (layer "F.Fab") (tstamp 8dd4122f-c7d7-46a4-84a6-c5023a910266))
|
||||
(pad "1" smd rect (at -3.4 0 90) (size 2 0.75) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 5955246c-e2e8-46cb-9aa8-e7efc1ead76c))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 5955246c-e2e8-46cb-9aa8-e7efc1ead76c))
|
||||
(pad "NC" smd rect (at 3.4 0 90) (size 2 0.75) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp e2950cc4-dc23-4edc-a731-76492b4aa3b2))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp e2950cc4-dc23-4edc-a731-76492b4aa3b2))
|
||||
)
|
||||
|
|
|
|||
|
|
@ -30,7 +30,7 @@
|
|||
(fp_line (start 4 1) (end 4 -1)
|
||||
(stroke (width 0.127) (type solid)) (layer "F.Fab") (tstamp ec2be382-5939-4577-80e8-9092c7b936f1))
|
||||
(pad "NC" smd rect (at 4 0) (size 1 2) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp ea5dbccf-6df7-4b0e-83d5-7e15099be7f2))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp ea5dbccf-6df7-4b0e-83d5-7e15099be7f2))
|
||||
(pad "SIG" smd rect (at -4 0) (size 1 2) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 31f2345d-2877-458a-834d-1f1aabd38010))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 31f2345d-2877-458a-834d-1f1aabd38010))
|
||||
)
|
||||
|
|
|
|||
|
|
@ -398,59 +398,59 @@
|
|||
(fp_line (start 9.5 -9.5) (end 9.5 9.5)
|
||||
(stroke (width 0.127) (type solid)) (layer "F.Fab") (tstamp df67e954-7294-478a-b2d5-da72e8daf17b))
|
||||
(pad "1" smd rect (at -8.2 9.1642 180) (size 0.762 1.651) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp d463b282-e276-4c8e-b2c3-fa3386f8c836))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp d463b282-e276-4c8e-b2c3-fa3386f8c836))
|
||||
(pad "2" smd rect (at -6.93 9.1642 180) (size 0.762 1.651) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 07f7cfa2-5632-4174-a14c-ca5a3acbb440))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 07f7cfa2-5632-4174-a14c-ca5a3acbb440))
|
||||
(pad "3" smd rect (at -5.66 9.1642 180) (size 0.762 1.651) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 741519c0-61cc-421b-874c-a03afe140c60))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 741519c0-61cc-421b-874c-a03afe140c60))
|
||||
(pad "4" smd rect (at -4.39 9.1642 180) (size 0.762 1.651) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 2f2ca327-39e2-4493-8310-d1eca57e6790))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 2f2ca327-39e2-4493-8310-d1eca57e6790))
|
||||
(pad "5" smd rect (at -3.12 9.1642 180) (size 0.762 1.651) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 36228d78-6d27-4a25-add2-ae022052d59c))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 36228d78-6d27-4a25-add2-ae022052d59c))
|
||||
(pad "6" smd rect (at -1.85 9.1642 180) (size 0.762 1.651) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 69c650f2-27de-4e01-8fb3-f6c2279cb65d))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 69c650f2-27de-4e01-8fb3-f6c2279cb65d))
|
||||
(pad "7" smd rect (at -0.58 9.1642 180) (size 0.762 1.651) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 22eac0e8-0ebd-4bb3-9fd8-fdc035b5b3fb))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 22eac0e8-0ebd-4bb3-9fd8-fdc035b5b3fb))
|
||||
(pad "8" smd rect (at 0.69 9.1642 180) (size 0.762 1.651) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp cf120c83-e44b-4426-a7a9-11d3c78bdef5))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp cf120c83-e44b-4426-a7a9-11d3c78bdef5))
|
||||
(pad "9" smd rect (at 1.96 9.1642 180) (size 0.762 1.651) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp d74a4470-80a2-4ef2-8b36-038ced1bc84a))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp d74a4470-80a2-4ef2-8b36-038ced1bc84a))
|
||||
(pad "10" smd rect (at 3.23 9.1642 180) (size 0.762 1.651) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp dc4ef120-3a57-433d-a476-c54193fc2ee1))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp dc4ef120-3a57-433d-a476-c54193fc2ee1))
|
||||
(pad "11" smd rect (at 4.5 9.1642 180) (size 0.762 1.651) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 32e0813b-7156-4231-bbd5-96ad2681a3d6))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 32e0813b-7156-4231-bbd5-96ad2681a3d6))
|
||||
(pad "12" smd rect (at 5.77 9.1642 180) (size 0.762 1.651) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 049ee871-927c-49fb-8008-6cd2ec1f2ae1))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 049ee871-927c-49fb-8008-6cd2ec1f2ae1))
|
||||
(pad "13" smd rect (at 7.04 9.1642 180) (size 0.762 1.651) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 1c53ff52-b9ab-4c49-b4d2-f32475c49188))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 1c53ff52-b9ab-4c49-b4d2-f32475c49188))
|
||||
(pad "14" smd rect (at 8.31 9.1642 180) (size 0.762 1.651) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp d9bbb9e9-b955-4be6-8e1d-8ad7b9a9c717))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp d9bbb9e9-b955-4be6-8e1d-8ad7b9a9c717))
|
||||
(pad "15" smd rect (at 8.31 -9.2 180) (size 0.762 1.651) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp aed3cb78-4c6f-416d-97bd-436890eed70c))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp aed3cb78-4c6f-416d-97bd-436890eed70c))
|
||||
(pad "16" smd rect (at 7.04 -9.2 180) (size 0.762 1.651) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 2e6e25a2-36f0-41e9-a867-41e1efca22a4))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 2e6e25a2-36f0-41e9-a867-41e1efca22a4))
|
||||
(pad "17" smd rect (at 5.77 -9.2 180) (size 0.762 1.651) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 5a029f62-dd45-4666-897e-7823fc50724d))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 5a029f62-dd45-4666-897e-7823fc50724d))
|
||||
(pad "18" smd rect (at 4.5 -9.2 180) (size 0.762 1.651) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 5faf9e31-6472-4053-9b4f-bef85177a96e))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 5faf9e31-6472-4053-9b4f-bef85177a96e))
|
||||
(pad "19" smd rect (at 3.23 -9.2 180) (size 0.762 1.651) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 25c52b64-eda5-40ba-ab1f-1e51e26e3682))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 25c52b64-eda5-40ba-ab1f-1e51e26e3682))
|
||||
(pad "20" smd rect (at 1.96 -9.2 180) (size 0.762 1.651) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 22ef66ea-5b89-4f60-ace6-cf2020bd9332))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 22ef66ea-5b89-4f60-ace6-cf2020bd9332))
|
||||
(pad "21" smd rect (at 0.69 -9.2 180) (size 0.762 1.651) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp e54da482-bc0a-41ea-8308-792d67d0bbc4))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp e54da482-bc0a-41ea-8308-792d67d0bbc4))
|
||||
(pad "22" smd rect (at -0.58 -9.2 180) (size 0.762 1.651) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 28dc9680-6177-45ff-be08-6cd0c0db4827))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 28dc9680-6177-45ff-be08-6cd0c0db4827))
|
||||
(pad "23" smd rect (at -1.85 -9.2 180) (size 0.762 1.651) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 2c500340-a130-487e-9f13-05ad473e8f96))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 2c500340-a130-487e-9f13-05ad473e8f96))
|
||||
(pad "24" smd rect (at -3.12 -9.2 180) (size 0.762 1.651) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 9b398e68-756b-4916-b0a6-501964bf98ec))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 9b398e68-756b-4916-b0a6-501964bf98ec))
|
||||
(pad "25" smd rect (at -4.39 -9.2 180) (size 0.762 1.651) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 32b2ab83-a8bb-4310-a440-a976d847ffbb))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 32b2ab83-a8bb-4310-a440-a976d847ffbb))
|
||||
(pad "26" smd rect (at -5.66 -9.2 180) (size 0.762 1.651) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 849920c4-f9ea-409d-b526-583ea919c4d3))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 849920c4-f9ea-409d-b526-583ea919c4d3))
|
||||
(pad "27" smd rect (at -6.93 -9.2 180) (size 0.762 1.651) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 0378e2ea-7e00-4991-b3dc-efc3def57a01))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 0378e2ea-7e00-4991-b3dc-efc3def57a01))
|
||||
(pad "28" smd rect (at -8.2 -9.2 180) (size 0.762 1.651) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 5bc09db8-44a7-4a2c-871f-d3649e415c17))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 5bc09db8-44a7-4a2c-871f-d3649e415c17))
|
||||
)
|
||||
|
|
|
|||
|
|
@ -513,43 +513,43 @@
|
|||
(stroke (width 0) (type default)) (fill solid) (layer "F.Fab") (tstamp 25a2d9ee-e150-4eae-9b9e-11061d3e2b2c))
|
||||
(pad "" np_thru_hole circle (at -0.7 0) (size 4 4) (drill 4) (layers "*.Cu" "*.Mask") (tstamp 35b57434-1abe-4185-a2c0-59ab8f2df9b3))
|
||||
(pad "1" smd rect (at 8 6.75 180) (size 2 1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 912225b0-7f2f-4894-aaea-6dc6e862f92d))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 912225b0-7f2f-4894-aaea-6dc6e862f92d))
|
||||
(pad "2" smd rect (at 8 5.25 180) (size 2 1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 6133b989-eca5-46f7-879d-6c20362ab076))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 6133b989-eca5-46f7-879d-6c20362ab076))
|
||||
(pad "3" smd rect (at 8 3.75 180) (size 2 1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp edaa26df-3581-40bd-8ab8-79a651f91ed2))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp edaa26df-3581-40bd-8ab8-79a651f91ed2))
|
||||
(pad "4" smd rect (at 8 2.25 180) (size 2 1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp db38f5f8-5b6a-4a21-b38c-bf02e961659a))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp db38f5f8-5b6a-4a21-b38c-bf02e961659a))
|
||||
(pad "5" smd rect (at 8 0.75 180) (size 2 1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 6f9a5934-7f7a-46c5-99a6-5f93367ca907))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 6f9a5934-7f7a-46c5-99a6-5f93367ca907))
|
||||
(pad "6" smd rect (at 8 -0.75 180) (size 2 1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 5a39b216-cecb-4e73-905d-90213efd8cd0))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 5a39b216-cecb-4e73-905d-90213efd8cd0))
|
||||
(pad "7" smd rect (at 8 -2.25 180) (size 2 1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 8eab10ce-7d39-42df-b373-4d4fa1ddac68))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 8eab10ce-7d39-42df-b373-4d4fa1ddac68))
|
||||
(pad "8" smd rect (at 8 -3.75 180) (size 2 1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 17e8b48f-6f32-4a1d-81bd-329e2308eb8d))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 17e8b48f-6f32-4a1d-81bd-329e2308eb8d))
|
||||
(pad "9" smd rect (at 8 -5.25 180) (size 2 1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 8fe6d198-f344-413c-b531-dbd6585eba9f))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 8fe6d198-f344-413c-b531-dbd6585eba9f))
|
||||
(pad "10" smd rect (at 8 -6.75 180) (size 2 1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 335f72e3-3d0b-4055-b935-a44e90e0d053))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 335f72e3-3d0b-4055-b935-a44e90e0d053))
|
||||
(pad "11" smd rect (at -8 -6.75) (size 2 1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 2ba3a1fe-82d7-4081-8011-044371eb71db))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 2ba3a1fe-82d7-4081-8011-044371eb71db))
|
||||
(pad "12" smd rect (at -8 -5.25) (size 2 1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp d9199e7c-8113-49b9-a3c3-4116096fdf48))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp d9199e7c-8113-49b9-a3c3-4116096fdf48))
|
||||
(pad "13" smd rect (at -8 -3.75) (size 2 1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 7a782f71-8fd3-46d9-aad0-0ff51f340734))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 7a782f71-8fd3-46d9-aad0-0ff51f340734))
|
||||
(pad "14" smd rect (at -8 -2.25) (size 2 1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 7df341d4-7cab-4f77-bf40-3215f3fb0a9b))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 7df341d4-7cab-4f77-bf40-3215f3fb0a9b))
|
||||
(pad "15" smd rect (at -8 -0.75) (size 2 1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 7476f36e-9bf4-4133-8af5-1f43e0f5e286))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 7476f36e-9bf4-4133-8af5-1f43e0f5e286))
|
||||
(pad "16" smd rect (at -8 0.75) (size 2 1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 984a1a02-2415-41ba-b4b4-a3e6522c38e0))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 984a1a02-2415-41ba-b4b4-a3e6522c38e0))
|
||||
(pad "17" smd rect (at -8 2.25) (size 2 1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 0051c0ef-5ba7-4732-bb43-72e455020205))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 0051c0ef-5ba7-4732-bb43-72e455020205))
|
||||
(pad "18" smd rect (at -8 3.75) (size 2 1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 3fd286e3-7fa4-4fe9-8c76-56e15918ff17))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 3fd286e3-7fa4-4fe9-8c76-56e15918ff17))
|
||||
(pad "19" smd rect (at -8 5.25) (size 2 1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 71244fa1-513c-4da9-a734-a6bc5089de05))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 71244fa1-513c-4da9-a734-a6bc5089de05))
|
||||
(pad "20" smd rect (at -8 6.75) (size 2 1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 0ce64846-330c-47a3-95d8-fec7e2f1b224))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 0ce64846-330c-47a3-95d8-fec7e2f1b224))
|
||||
)
|
||||
|
|
|
|||
|
|
@ -30,19 +30,19 @@
|
|||
(fp_line (start 4 1.471) (end 4 -1.471)
|
||||
(stroke (width 0.127) (type solid)) (layer "F.Fab") (tstamp f7c2d562-e661-446a-9040-49999a5513b8))
|
||||
(pad "1" smd rect (at -2.5 -1.45) (size 0.6 1.55) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp f5e17cb8-cf5d-44d7-9f81-06fe4812aecb))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp f5e17cb8-cf5d-44d7-9f81-06fe4812aecb))
|
||||
(pad "2" smd rect (at -1.5 -1.45) (size 0.6 1.55) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 7de47e12-ef43-425e-8b16-a017dc3618ec))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 7de47e12-ef43-425e-8b16-a017dc3618ec))
|
||||
(pad "3" smd rect (at -0.5 -1.45) (size 0.6 1.55) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 566d2844-9d32-4c74-b329-e39c382cf46d))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 566d2844-9d32-4c74-b329-e39c382cf46d))
|
||||
(pad "4" smd rect (at 0.5 -1.45) (size 0.6 1.55) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 566239c4-f2f1-4010-9979-15f35bc8d5fe))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 566239c4-f2f1-4010-9979-15f35bc8d5fe))
|
||||
(pad "5" smd rect (at 1.5 -1.45) (size 0.6 1.55) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp acc98d75-2ab3-4f42-9efa-1f1613289c73))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp acc98d75-2ab3-4f42-9efa-1f1613289c73))
|
||||
(pad "6" smd rect (at 2.5 -1.45) (size 0.6 1.55) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp c2d6e699-9aaf-4428-93de-6023e3b32227))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp c2d6e699-9aaf-4428-93de-6023e3b32227))
|
||||
(pad "P$1" smd rect (at -3.8 0.775) (size 1.2 1.8) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp a4e6ed86-9233-41d7-8fae-51575ce07db5))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp a4e6ed86-9233-41d7-8fae-51575ce07db5))
|
||||
(pad "P$2" smd rect (at 3.8 0.775) (size 1.2 1.8) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp f5394dbe-a8a6-4a3d-be52-c4ec1e90024b))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp f5394dbe-a8a6-4a3d-be52-c4ec1e90024b))
|
||||
)
|
||||
|
|
|
|||
|
|
@ -53,13 +53,13 @@
|
|||
(fp_line (start 2.6 3.7) (end -2.6 3.7)
|
||||
(stroke (width 0.05) (type solid)) (layer "F.Fab") (tstamp 96268946-77b4-4d25-ad25-3031f6be7e61))
|
||||
(pad "1" smd rect (at -0.97 1.95) (size 1.54 1.54) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 89b84ce2-c13f-423e-9174-e43d49b60108))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 89b84ce2-c13f-423e-9174-e43d49b60108))
|
||||
(pad "2" smd rect (at -0.97 -1.95) (size 1.54 1.54) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 3cfecd34-2e19-4d74-955e-5555c1c3989c))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 3cfecd34-2e19-4d74-955e-5555c1c3989c))
|
||||
(pad "3" smd rect (at 0.97 -1.95) (size 1.54 1.54) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp c230476f-0a2f-46e6-b3f4-fb9db7e9c35c))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp c230476f-0a2f-46e6-b3f4-fb9db7e9c35c))
|
||||
(pad "FEED" smd rect (at 0.97 1.95) (size 1.54 1.54) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp df678a79-0577-4e5d-811e-7537bf99a5ba))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp df678a79-0577-4e5d-811e-7537bf99a5ba))
|
||||
(zone (net 0) (net_name "") (layer "F.Cu") (tstamp 850ff00e-5d53-44b8-b71e-a335072cdc1e) (hatch edge 0.5)
|
||||
(connect_pads (clearance 0))
|
||||
(min_thickness 0.25) (filled_areas_thickness no)
|
||||
|
|
|
|||
|
|
@ -37,13 +37,13 @@
|
|||
(fp_line (start 2 1) (end -2 1)
|
||||
(stroke (width 0.05) (type solid)) (layer "F.Fab") (tstamp 7b6107b8-1bff-44d7-9f7f-312a7e9f86b2))
|
||||
(pad "1" smd rect (at 1.45 0.55) (size 1.1 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 07eb66e9-2d73-4ee5-ac4e-5230f17783fe))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 07eb66e9-2d73-4ee5-ac4e-5230f17783fe))
|
||||
(pad "2" smd rect (at -1.45 0.55) (size 1.1 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 032d3c36-b5d6-4b34-892f-094f9338196f))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 032d3c36-b5d6-4b34-892f-094f9338196f))
|
||||
(pad "3" smd rect (at -1.45 -0.55) (size 1.1 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 49b7690c-5e71-401a-b6a7-04515de9809f))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 49b7690c-5e71-401a-b6a7-04515de9809f))
|
||||
(pad "FEED" smd rect (at 1.45 -0.55) (size 1.1 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp b56650d1-6576-46c5-a27d-4e7032bbcead))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp b56650d1-6576-46c5-a27d-4e7032bbcead))
|
||||
(zone (net 0) (net_name "") (layer "F.Cu") (tstamp b4bb157a-ceeb-494e-bb4f-000cf30ac189) (hatch edge 0.5)
|
||||
(connect_pads (clearance 0))
|
||||
(min_thickness 0.25) (filled_areas_thickness no)
|
||||
|
|
|
|||
|
|
@ -74,15 +74,15 @@
|
|||
|
||||
(stroke (width 0) (type default)) (fill solid) (layer "F.Fab") (tstamp 46581cc5-f5ca-4efc-af99-b01716f115a5))
|
||||
(pad "FEED" smd rect (at 5.33 3.4 270) (size 1.3 1.61) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 8f3e9b92-6020-4dad-ab7f-f291599e6fda))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 8f3e9b92-6020-4dad-ab7f-f291599e6fda))
|
||||
(pad "GND" smd rect (at 3.545 5.2 180) (size 1.3 1.32) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp cb0e3751-7690-4552-ab68-38c2ad410ac6))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp cb0e3751-7690-4552-ab68-38c2ad410ac6))
|
||||
(pad "NC1" smd rect (at -3.905 5.06 90) (size 1.6 3.2) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp eed3a374-83b7-4490-8b98-01ec11669e0b))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp eed3a374-83b7-4490-8b98-01ec11669e0b))
|
||||
(pad "NC2" smd rect (at -3.905 -5.06 90) (size 1.6 3.2) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 5a9d22d3-2476-4cef-a3ec-b649c8ba9a05))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 5a9d22d3-2476-4cef-a3ec-b649c8ba9a05))
|
||||
(pad "NC3" smd rect (at 3.905 -5.06 90) (size 1.6 3.2) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 1598b68e-1cd6-42b8-85b9-19e005c06267))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 1598b68e-1cd6-42b8-85b9-19e005c06267))
|
||||
(zone (net 0) (net_name "") (layer "F.Cu") (tstamp 532c31d0-9ff5-4f64-a276-ffdffb90978c) (hatch edge 0.5)
|
||||
(connect_pads (clearance 0))
|
||||
(min_thickness 0.25) (filled_areas_thickness no)
|
||||
|
|
|
|||
|
|
@ -683,51 +683,51 @@
|
|||
|
||||
(stroke (width 0) (type default)) (fill solid) (layer "F.Fab") (tstamp 9af75fcc-eafd-49b5-87fa-60794e154c8a))
|
||||
(pad "1" smd rect (at 6 7) (size 1.8 0.8) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 9965872c-94df-48c9-9ba0-67d3064f00cf))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 9965872c-94df-48c9-9ba0-67d3064f00cf))
|
||||
(pad "2" smd rect (at 6 5.9) (size 1.8 0.8) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 4b0e0e92-bc04-4ff1-9051-e0304da47e46))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 4b0e0e92-bc04-4ff1-9051-e0304da47e46))
|
||||
(pad "3" smd rect (at 6 4.8) (size 1.8 0.8) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 3d4c2608-e3dc-4982-a810-f7b58af4c650))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 3d4c2608-e3dc-4982-a810-f7b58af4c650))
|
||||
(pad "4" smd rect (at 6 3.7) (size 1.8 0.8) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp eb0e8aea-f3a2-4f04-8e42-d3f7e6a59c36))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp eb0e8aea-f3a2-4f04-8e42-d3f7e6a59c36))
|
||||
(pad "5" smd rect (at 6 2.6) (size 1.8 0.8) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp cd990c7d-e985-4daf-9f36-765689bb8652))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp cd990c7d-e985-4daf-9f36-765689bb8652))
|
||||
(pad "6" smd rect (at 6 1.5) (size 1.8 0.8) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp a6b00f57-7e79-455f-93b0-8544108912c4))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp a6b00f57-7e79-455f-93b0-8544108912c4))
|
||||
(pad "7" smd rect (at 6 0.4) (size 1.8 0.8) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp ee6fcf33-6610-4948-804c-ba2778ad906b))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp ee6fcf33-6610-4948-804c-ba2778ad906b))
|
||||
(pad "8" smd rect (at 6 -2.6) (size 1.8 0.8) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 104a1763-51fa-4774-a365-68602144f4ec))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 104a1763-51fa-4774-a365-68602144f4ec))
|
||||
(pad "9" smd rect (at 6 -3.7) (size 1.8 0.8) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 399bc5a0-6bbd-4901-aa30-2fb732091be1))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 399bc5a0-6bbd-4901-aa30-2fb732091be1))
|
||||
(pad "10" smd rect (at 6 -4.8) (size 1.8 0.8) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 1373f44f-26d0-4448-837b-9c248e92e33e))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 1373f44f-26d0-4448-837b-9c248e92e33e))
|
||||
(pad "11" smd rect (at 6 -5.9) (size 1.8 0.8) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 61dfde0d-c898-4acf-9447-de8949628ce1))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 61dfde0d-c898-4acf-9447-de8949628ce1))
|
||||
(pad "12" smd rect (at 6 -7) (size 1.8 0.8) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 57897d1b-ae51-4e3c-8805-1e12e888ad8c))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 57897d1b-ae51-4e3c-8805-1e12e888ad8c))
|
||||
(pad "13" smd rect (at -6 -7 180) (size 1.8 0.8) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 83191990-4a18-4c72-af74-c4d543c84884))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 83191990-4a18-4c72-af74-c4d543c84884))
|
||||
(pad "14" smd rect (at -6 -5.9 180) (size 1.8 0.8) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp a371078c-e697-4b1e-ae4c-90d727eb021f))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp a371078c-e697-4b1e-ae4c-90d727eb021f))
|
||||
(pad "15" smd rect (at -6 -4.8 180) (size 1.8 0.8) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 123461a6-8795-4f90-8034-986007d4d953))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 123461a6-8795-4f90-8034-986007d4d953))
|
||||
(pad "16" smd rect (at -6 -3.7 180) (size 1.8 0.8) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp d083c88c-249c-41b9-8c2c-882309307be5))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp d083c88c-249c-41b9-8c2c-882309307be5))
|
||||
(pad "17" smd rect (at -6 -2.6 180) (size 1.8 0.8) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 6f1ab496-156b-4043-8ace-ba1b9621b8ed))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 6f1ab496-156b-4043-8ace-ba1b9621b8ed))
|
||||
(pad "18" smd rect (at -6 0.4 180) (size 1.8 0.8) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 42652d6a-6378-435f-be61-3ae232f6b1be))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 42652d6a-6378-435f-be61-3ae232f6b1be))
|
||||
(pad "19" smd rect (at -6 1.5 180) (size 1.8 0.8) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 7e2d9905-7ef0-4474-b468-ff44fdf57c7d))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 7e2d9905-7ef0-4474-b468-ff44fdf57c7d))
|
||||
(pad "20" smd rect (at -6 2.6 180) (size 1.8 0.8) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp eacc041c-9291-47d3-9286-70703dad5791))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp eacc041c-9291-47d3-9286-70703dad5791))
|
||||
(pad "21" smd rect (at -6 3.7 180) (size 1.8 0.8) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 16f4ad69-3c54-4508-9356-23e357849721))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 16f4ad69-3c54-4508-9356-23e357849721))
|
||||
(pad "22" smd rect (at -6 4.8 180) (size 1.8 0.8) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 452559fc-59c4-4517-98ef-aa4469da5321))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 452559fc-59c4-4517-98ef-aa4469da5321))
|
||||
(pad "23" smd rect (at -6 5.9 180) (size 1.8 0.8) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 285e094d-1577-4270-a5ae-a8c681ea769a))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 285e094d-1577-4270-a5ae-a8c681ea769a))
|
||||
(pad "24" smd rect (at -6 7 180) (size 1.8 0.8) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 852e5bf5-26b4-41b5-b91e-ee26c69e6459))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 852e5bf5-26b4-41b5-b91e-ee26c69e6459))
|
||||
)
|
||||
|
|
|
|||
|
|
@ -684,51 +684,51 @@
|
|||
|
||||
(stroke (width 0) (type default)) (fill solid) (layer "F.Fab") (tstamp 139d04e6-42b4-4c9c-917c-a6f10a9af756))
|
||||
(pad "1" smd rect (at 6 7) (size 1.8 0.8) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 006f055d-7492-4f5c-b680-fd01a4e5590e))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 006f055d-7492-4f5c-b680-fd01a4e5590e))
|
||||
(pad "2" smd rect (at 6 5.9) (size 1.8 0.8) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp bb38bb32-5b62-4dc6-9df0-4d861e5ae0ef))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp bb38bb32-5b62-4dc6-9df0-4d861e5ae0ef))
|
||||
(pad "3" smd rect (at 6 4.8) (size 1.8 0.8) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 4dafdda8-5527-4e3d-838d-30c2dc9575a9))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 4dafdda8-5527-4e3d-838d-30c2dc9575a9))
|
||||
(pad "4" smd rect (at 6 3.7) (size 1.8 0.8) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 5e9c69f0-e2b1-4528-8d24-6ca1858a858e))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 5e9c69f0-e2b1-4528-8d24-6ca1858a858e))
|
||||
(pad "5" smd rect (at 6 2.6) (size 1.8 0.8) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 2aef717a-f488-44be-8a6a-a8e2c7ddaacc))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 2aef717a-f488-44be-8a6a-a8e2c7ddaacc))
|
||||
(pad "6" smd rect (at 6 1.5) (size 1.8 0.8) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp b22aa5ad-abe3-4bd9-9fa3-055d528c6d24))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp b22aa5ad-abe3-4bd9-9fa3-055d528c6d24))
|
||||
(pad "7" smd rect (at 6 0.4) (size 1.8 0.8) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 87718ea2-d79e-4ba4-9d3c-7993c325d1b2))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 87718ea2-d79e-4ba4-9d3c-7993c325d1b2))
|
||||
(pad "8" smd rect (at 6 -2.6) (size 1.8 0.8) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 7da71d0e-551e-4444-b16e-89fa1849e709))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 7da71d0e-551e-4444-b16e-89fa1849e709))
|
||||
(pad "9" smd rect (at 6 -3.7) (size 1.8 0.8) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 25edd692-e8a1-4e7a-836c-a09e7f108a52))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 25edd692-e8a1-4e7a-836c-a09e7f108a52))
|
||||
(pad "10" smd rect (at 6 -4.8) (size 1.8 0.8) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 56c234cb-beac-43e1-bc48-be7970190c1b))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 56c234cb-beac-43e1-bc48-be7970190c1b))
|
||||
(pad "11" smd rect (at 6 -5.9) (size 1.8 0.8) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 1f1b8880-7e7a-4dec-ad95-822a4c347131))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 1f1b8880-7e7a-4dec-ad95-822a4c347131))
|
||||
(pad "12" smd rect (at 6 -7) (size 1.8 0.8) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 2210c570-2b38-4112-95b5-0983ab2c7294))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 2210c570-2b38-4112-95b5-0983ab2c7294))
|
||||
(pad "13" smd rect (at -6 -7 180) (size 1.8 0.8) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp a9f32a1e-d4dd-48ba-992b-8c4fb17e175a))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp a9f32a1e-d4dd-48ba-992b-8c4fb17e175a))
|
||||
(pad "14" smd rect (at -6 -5.9 180) (size 1.8 0.8) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 15cf1ff8-1611-4c96-9bed-504c9205eebe))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 15cf1ff8-1611-4c96-9bed-504c9205eebe))
|
||||
(pad "15" smd rect (at -6 -4.8 180) (size 1.8 0.8) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 2b3b9dee-bc23-4151-96dc-096bbcd1323f))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 2b3b9dee-bc23-4151-96dc-096bbcd1323f))
|
||||
(pad "16" smd rect (at -6 -3.7 180) (size 1.8 0.8) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 7d09060b-29e4-46ef-877e-27bae63e45e5))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 7d09060b-29e4-46ef-877e-27bae63e45e5))
|
||||
(pad "17" smd rect (at -6 -2.6 180) (size 1.8 0.8) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp ddba6a0d-6bad-4e49-a948-032270d3a338))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp ddba6a0d-6bad-4e49-a948-032270d3a338))
|
||||
(pad "18" smd rect (at -6 0.4 180) (size 1.8 0.8) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp f977baaf-518a-4e0b-ad68-a3959326b921))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp f977baaf-518a-4e0b-ad68-a3959326b921))
|
||||
(pad "19" smd rect (at -6 1.5 180) (size 1.8 0.8) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp a79f4164-3197-493c-8889-c82d5e4ab0a5))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp a79f4164-3197-493c-8889-c82d5e4ab0a5))
|
||||
(pad "20" smd rect (at -6 2.6 180) (size 1.8 0.8) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 7672a1d6-7da8-4223-a708-af5814a6813b))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 7672a1d6-7da8-4223-a708-af5814a6813b))
|
||||
(pad "21" smd rect (at -6 3.7 180) (size 1.8 0.8) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 8b29d9c1-d2ca-45ff-b418-fdd879edc00f))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 8b29d9c1-d2ca-45ff-b418-fdd879edc00f))
|
||||
(pad "22" smd rect (at -6 4.8 180) (size 1.8 0.8) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 07c523c4-663e-49e3-a62a-44336dc6a71a))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 07c523c4-663e-49e3-a62a-44336dc6a71a))
|
||||
(pad "23" smd rect (at -6 5.9 180) (size 1.8 0.8) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp c40b965d-0948-4fe0-83d9-01ec40e2ee31))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp c40b965d-0948-4fe0-83d9-01ec40e2ee31))
|
||||
(pad "24" smd rect (at -6 7 180) (size 1.8 0.8) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 2cf97bfa-acee-493b-81d5-96894b236532))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 2cf97bfa-acee-493b-81d5-96894b236532))
|
||||
)
|
||||
|
|
|
|||
|
|
@ -234,43 +234,43 @@
|
|||
|
||||
(stroke (width 0) (type default)) (fill solid) (layer "F.Fab") (tstamp 147b0b9b-9f2a-46ec-956a-e59c9cf2f9b6))
|
||||
(pad "1" smd rect (at -7.125 -3.8 180) (size 2.75 1.6) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp f09dcf85-ccfe-4628-a30c-d0d775858f26))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp f09dcf85-ccfe-4628-a30c-d0d775858f26))
|
||||
(pad "2" smd rect (at -7.125 -1.9 180) (size 2.75 1.6) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp cdc5049b-3434-45c5-8c14-6942a04d1490))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp cdc5049b-3434-45c5-8c14-6942a04d1490))
|
||||
(pad "3" smd rect (at -7.125 0 180) (size 2.75 1.6) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 071f895b-8d1c-4730-b81f-42c62a49e628))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 071f895b-8d1c-4730-b81f-42c62a49e628))
|
||||
(pad "4" smd rect (at -7.125 1.9 180) (size 2.75 1.6) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 0dc26672-ce2b-49c4-892f-f9bf5563311d))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 0dc26672-ce2b-49c4-892f-f9bf5563311d))
|
||||
(pad "5" smd rect (at -7.125 3.8 180) (size 2.75 1.6) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp f9953c73-871f-48a0-a49a-cbd51014d0ba))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp f9953c73-871f-48a0-a49a-cbd51014d0ba))
|
||||
(pad "6" smd rect (at -3.8 7.125 90) (size 2.75 1.6) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 751e4709-b815-45d3-8ce6-d158db70a24e))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 751e4709-b815-45d3-8ce6-d158db70a24e))
|
||||
(pad "7" smd rect (at -1.9 7.125 90) (size 2.75 1.6) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp fcf3ccf5-0086-404b-93cb-950c27d51fe9))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp fcf3ccf5-0086-404b-93cb-950c27d51fe9))
|
||||
(pad "8" smd rect (at 0 7.125 90) (size 2.75 1.6) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 25c6c1b2-fe26-427d-82fd-49b2bfbf1573))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 25c6c1b2-fe26-427d-82fd-49b2bfbf1573))
|
||||
(pad "9" smd rect (at 1.9 7.125 90) (size 2.75 1.6) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp dd1d2d49-58ae-4a1f-a67e-f0e916014ce6))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp dd1d2d49-58ae-4a1f-a67e-f0e916014ce6))
|
||||
(pad "10" smd rect (at 3.8 7.125 90) (size 2.75 1.6) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 0f434b80-6bef-4f90-ac80-0c1818463f7e))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 0f434b80-6bef-4f90-ac80-0c1818463f7e))
|
||||
(pad "11" smd rect (at 7.125 3.8) (size 2.75 1.6) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 9d4368b6-1314-486e-9a31-36cc78bdc1ce))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 9d4368b6-1314-486e-9a31-36cc78bdc1ce))
|
||||
(pad "12" smd rect (at 7.125 1.9) (size 2.75 1.6) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 57f08a33-bc14-4d6c-ab21-121a71ab4234))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 57f08a33-bc14-4d6c-ab21-121a71ab4234))
|
||||
(pad "13" smd rect (at 7.125 0) (size 2.75 1.6) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 75753825-fdf7-4c47-bd4a-f6a9be76d527))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 75753825-fdf7-4c47-bd4a-f6a9be76d527))
|
||||
(pad "14" smd rect (at 7.125 -1.9) (size 2.75 1.6) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 6fd3b487-2198-4a35-bcf3-b5445c90ddc0))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 6fd3b487-2198-4a35-bcf3-b5445c90ddc0))
|
||||
(pad "15" smd rect (at 7.125 -3.8) (size 2.75 1.6) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 2b4143d6-77f3-4240-90a6-fd5f0a2a42ed))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 2b4143d6-77f3-4240-90a6-fd5f0a2a42ed))
|
||||
(pad "16" smd rect (at 3.8 -7.125 270) (size 2.75 1.6) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 0a579776-b057-4ca0-b5fc-dc73c95108b6))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 0a579776-b057-4ca0-b5fc-dc73c95108b6))
|
||||
(pad "17" smd rect (at 1.9 -7.125 270) (size 2.75 1.6) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp f5a2200c-12fe-45fd-a1b4-e93c986a7eb6))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp f5a2200c-12fe-45fd-a1b4-e93c986a7eb6))
|
||||
(pad "18" smd rect (at 0 -7.125 270) (size 2.75 1.6) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 1db6bba9-9108-418a-9c77-418acd6f34b3))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 1db6bba9-9108-418a-9c77-418acd6f34b3))
|
||||
(pad "19" smd rect (at -1.9 -7.125 270) (size 2.75 1.6) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 1f959926-5ad1-4953-a296-734669609259))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 1f959926-5ad1-4953-a296-734669609259))
|
||||
(pad "20" smd rect (at -3.8 -7.125 270) (size 2.75 1.6) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 1f4cbe41-b197-48bb-b440-f020cb7ef6f6))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 1f4cbe41-b197-48bb-b440-f020cb7ef6f6))
|
||||
)
|
||||
|
|
|
|||
|
|
@ -19,11 +19,11 @@
|
|||
(fp_circle (center 0 0) (end 8 0)
|
||||
(stroke (width 0.05) (type solid)) (fill none) (layer "F.Fab") (tstamp d2d1af31-4b5d-4f2b-b448-9f3b12ff324b))
|
||||
(pad "1" smd rect (at -1.2 7.03) (size 2.4 2.4) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 35d7eb46-8440-47d4-8291-ee4b5f89c9ce))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 35d7eb46-8440-47d4-8291-ee4b5f89c9ce))
|
||||
(pad "2" smd rect (at -6.4432 -3.72 60) (size 2.5 2.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp fd619c1d-5870-4176-93a2-0b866755742f))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp fd619c1d-5870-4176-93a2-0b866755742f))
|
||||
(pad "3" smd rect (at 6.4432 -3.72 300) (size 2.5 2.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 33aeb0b5-7d53-487b-881a-1228b3b08c20))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 33aeb0b5-7d53-487b-881a-1228b3b08c20))
|
||||
(pad "S" smd rect (at 1.75 7.28) (size 1.4 1.74) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 48d1fda6-b500-4478-adea-64835749923a))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 48d1fda6-b500-4478-adea-64835749923a))
|
||||
)
|
||||
|
|
|
|||
|
|
@ -57,51 +57,51 @@
|
|||
(fp_circle (center -4.8 -4.7) (end -4.4 -4.7)
|
||||
(stroke (width 0.0762) (type solid)) (fill none) (layer "F.Fab") (tstamp 84a1a425-3f77-465b-8f73-8c5e6993add2))
|
||||
(pad "1" smd rect (at -6.25 -3) (size 2 0.6) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 7d932e5d-f1dd-445a-9272-bdff9abb762a))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 7d932e5d-f1dd-445a-9272-bdff9abb762a))
|
||||
(pad "2" smd rect (at -6.25 -1.8) (size 2 0.6) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 3dd57f47-9dd3-47a8-ac5a-cc9605d5c901))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 3dd57f47-9dd3-47a8-ac5a-cc9605d5c901))
|
||||
(pad "3" smd rect (at -6.25 -0.6) (size 2 0.6) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp db6998e7-dd4d-4106-af04-7408af29577b))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp db6998e7-dd4d-4106-af04-7408af29577b))
|
||||
(pad "4" smd rect (at -6.25 0.6) (size 2 0.6) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 86cbdd71-e5c5-4a41-9c61-1d0a922b183e))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 86cbdd71-e5c5-4a41-9c61-1d0a922b183e))
|
||||
(pad "5" smd rect (at -6.25 1.8) (size 2 0.6) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 8a42dcec-c956-41fb-ad75-553523743bab))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 8a42dcec-c956-41fb-ad75-553523743bab))
|
||||
(pad "6" smd rect (at -6.25 3) (size 2 0.6) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 5e4cc9bd-fd7e-4f75-b064-a558ab701159))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 5e4cc9bd-fd7e-4f75-b064-a558ab701159))
|
||||
(pad "7" smd rect (at -3.6 6.25 90) (size 2 0.6) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 36f13165-5631-4961-80cb-c718d19d04b6))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 36f13165-5631-4961-80cb-c718d19d04b6))
|
||||
(pad "8" smd rect (at -2.4 6.25 90) (size 2 0.6) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 7de8957e-ae7f-4e34-8144-d34c5dfbd369))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 7de8957e-ae7f-4e34-8144-d34c5dfbd369))
|
||||
(pad "9" smd rect (at -1.2 6.25 90) (size 2 0.6) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 3b4c0c3a-77f3-4494-96ca-7f863c74d0f3))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 3b4c0c3a-77f3-4494-96ca-7f863c74d0f3))
|
||||
(pad "10" smd rect (at 1.2 6.25 90) (size 2 0.6) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 7198f3f1-1479-4338-b889-b5fa381168c8))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 7198f3f1-1479-4338-b889-b5fa381168c8))
|
||||
(pad "11" smd rect (at 2.4 6.25 90) (size 2 0.6) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp bcc2a6f9-3a08-46f1-8ea1-955bf89d3933))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp bcc2a6f9-3a08-46f1-8ea1-955bf89d3933))
|
||||
(pad "12" smd rect (at 3.6 6.25 90) (size 2 0.6) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp aa3903aa-71e1-42e5-988a-488b5ed0e598))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp aa3903aa-71e1-42e5-988a-488b5ed0e598))
|
||||
(pad "13" smd rect (at 6.25 3) (size 2 0.6) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp b2a90757-fc32-43b9-975b-ced6bf964609))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp b2a90757-fc32-43b9-975b-ced6bf964609))
|
||||
(pad "14" smd rect (at 6.25 1.8) (size 2 0.6) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 7d675e8e-4ed5-4309-b837-cd4e132f823e))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 7d675e8e-4ed5-4309-b837-cd4e132f823e))
|
||||
(pad "15" smd rect (at 6.25 0.6) (size 2 0.6) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 47db4e3c-e55a-4ff1-80dd-7d47cac5b995))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 47db4e3c-e55a-4ff1-80dd-7d47cac5b995))
|
||||
(pad "16" smd rect (at 6.25 -0.6) (size 2 0.6) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 0837f1d7-c3d3-4987-8696-cd8b3b1cadbc))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 0837f1d7-c3d3-4987-8696-cd8b3b1cadbc))
|
||||
(pad "17" smd rect (at 6.25 -1.8) (size 2 0.6) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 65ef1694-a8a2-4d21-8960-2c672c804942))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 65ef1694-a8a2-4d21-8960-2c672c804942))
|
||||
(pad "18" smd rect (at 6.25 -3) (size 2 0.6) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp edd9e39a-e645-4aa6-9efe-3109c3d522aa))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp edd9e39a-e645-4aa6-9efe-3109c3d522aa))
|
||||
(pad "19" smd rect (at 3.6 -6.25 270) (size 2 0.6) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 1d344901-5af6-419d-8ea6-640879a4da2f))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 1d344901-5af6-419d-8ea6-640879a4da2f))
|
||||
(pad "20" smd rect (at 2.4 -6.25 270) (size 2 0.6) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 191b6130-2dca-4523-8ed8-897b1d16d6e3))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 191b6130-2dca-4523-8ed8-897b1d16d6e3))
|
||||
(pad "21" smd rect (at 1.2 -6.25 270) (size 2 0.6) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 39ccb99d-5d20-47e4-9007-a72bb7db926d))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 39ccb99d-5d20-47e4-9007-a72bb7db926d))
|
||||
(pad "22" smd rect (at -1.2 -6.25 270) (size 2 0.6) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 4f17a26a-8e08-4e1a-b261-337e0a618fbf))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 4f17a26a-8e08-4e1a-b261-337e0a618fbf))
|
||||
(pad "23" smd rect (at -2.4 -6.25 270) (size 2 0.6) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp c3bd2d79-37da-4b24-bd34-b5cec48d5469))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp c3bd2d79-37da-4b24-bd34-b5cec48d5469))
|
||||
(pad "24" smd rect (at -3.6 -6.25 270) (size 2 0.6) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp fd06ddc5-5da8-4e8f-9a83-d21809508c2b))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp fd06ddc5-5da8-4e8f-9a83-d21809508c2b))
|
||||
)
|
||||
|
|
|
|||
|
|
@ -45,207 +45,207 @@
|
|||
|
||||
(stroke (width 0) (type default)) (fill solid) (layer "F.Fab") (tstamp c9c6db2a-04b5-4296-b6d0-0feb3c472575))
|
||||
(pad "G1" smd rect (at -7.312 5.37) (size 1.1 1.1) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 67f785bb-8463-4890-8227-11cd08b62d50))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 67f785bb-8463-4890-8227-11cd08b62d50))
|
||||
(pad "G2" smd rect (at -5.212 5.37) (size 1.1 1.1) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp a3d64781-6cc1-4c51-b3ee-55eb5417bcd3))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp a3d64781-6cc1-4c51-b3ee-55eb5417bcd3))
|
||||
(pad "G3" smd rect (at -3.112 5.37) (size 1.1 1.1) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp a2d37c99-0959-48fb-a80b-75284a2ccc88))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp a2d37c99-0959-48fb-a80b-75284a2ccc88))
|
||||
(pad "G4" smd rect (at -1.012 5.37) (size 1.1 1.1) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 5f5e808a-d1b5-48bd-a06a-92787693e279))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 5f5e808a-d1b5-48bd-a06a-92787693e279))
|
||||
(pad "G5" smd rect (at 1.088 5.37) (size 1.1 1.1) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp caf966f7-bf34-4f1d-bd5a-a2013b314499))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp caf966f7-bf34-4f1d-bd5a-a2013b314499))
|
||||
(pad "G6" smd rect (at 3.188 5.37) (size 1.1 1.1) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 541460ac-480d-47c8-b472-3920ddf3957f))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 541460ac-480d-47c8-b472-3920ddf3957f))
|
||||
(pad "G7" smd rect (at 5.288 5.37) (size 1.1 1.1) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 6b24e4bb-693a-436c-b1bd-a24ab448e12f))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 6b24e4bb-693a-436c-b1bd-a24ab448e12f))
|
||||
(pad "G8" smd rect (at 7.388 5.37) (size 1.1 1.1) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 478e6be6-cc91-49c1-b129-32c4746251ab))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 478e6be6-cc91-49c1-b129-32c4746251ab))
|
||||
(pad "G9" smd rect (at 7.388 3.27) (size 1.1 1.1) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 7643953d-b403-4ade-9bba-c04fc0de59fd))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 7643953d-b403-4ade-9bba-c04fc0de59fd))
|
||||
(pad "G10" smd rect (at 5.288 3.27) (size 1.1 1.1) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 2603d189-9954-4656-8531-46c1703ebb44))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 2603d189-9954-4656-8531-46c1703ebb44))
|
||||
(pad "G11" smd rect (at 3.188 3.27) (size 1.1 1.1) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 37f27c93-d80f-46eb-a0e1-193146144dff))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 37f27c93-d80f-46eb-a0e1-193146144dff))
|
||||
(pad "G12" smd rect (at 1.088 3.27) (size 1.1 1.1) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 4e43402c-416d-4d97-bc37-63166c41f2b3))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 4e43402c-416d-4d97-bc37-63166c41f2b3))
|
||||
(pad "G13" smd rect (at -1.012 3.27) (size 1.1 1.1) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp fae0108e-a604-48b2-890c-66292b1cc94c))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp fae0108e-a604-48b2-890c-66292b1cc94c))
|
||||
(pad "G14" smd rect (at -3.112 3.27) (size 1.1 1.1) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp f1a8d01e-76f9-4234-ba73-cfef0ad2534e))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp f1a8d01e-76f9-4234-ba73-cfef0ad2534e))
|
||||
(pad "G15" smd rect (at -5.212 3.27) (size 1.1 1.1) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 3695dd52-2f32-43a6-b2f9-184e00634696))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 3695dd52-2f32-43a6-b2f9-184e00634696))
|
||||
(pad "G16" smd rect (at -7.312 3.27) (size 1.1 1.1) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 7031af0a-4109-4b78-ad4c-e98fad7e1754))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 7031af0a-4109-4b78-ad4c-e98fad7e1754))
|
||||
(pad "G17" smd rect (at -7.312 1.17) (size 1.1 1.1) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 0d2e0c11-b3ae-43e3-81b9-a6842d1dcc66))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 0d2e0c11-b3ae-43e3-81b9-a6842d1dcc66))
|
||||
(pad "G18" smd rect (at -5.212 1.17) (size 1.1 1.1) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 698158e1-bfcf-4bdc-a7fd-ab837252b625))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 698158e1-bfcf-4bdc-a7fd-ab837252b625))
|
||||
(pad "G19" smd rect (at -3.112 1.17) (size 1.1 1.1) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp e472ef62-71c5-477c-b6b5-6a079f9d7a40))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp e472ef62-71c5-477c-b6b5-6a079f9d7a40))
|
||||
(pad "G20" smd rect (at -1.012 1.17) (size 1.1 1.1) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp c98cbf5a-6471-4436-9998-7e6d791bf475))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp c98cbf5a-6471-4436-9998-7e6d791bf475))
|
||||
(pad "G21" smd rect (at 1.088 1.17) (size 1.1 1.1) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 5df18602-fda2-439a-8d60-f0c0d828974c))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 5df18602-fda2-439a-8d60-f0c0d828974c))
|
||||
(pad "G22" smd rect (at 3.188 1.17) (size 1.1 1.1) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 63f45373-9be6-46e0-a1fd-8eb35157b0b3))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 63f45373-9be6-46e0-a1fd-8eb35157b0b3))
|
||||
(pad "G23" smd rect (at 5.288 1.17) (size 1.1 1.1) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp c96cb4e7-01ba-460c-b2a7-2e638a858a4f))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp c96cb4e7-01ba-460c-b2a7-2e638a858a4f))
|
||||
(pad "G24" smd rect (at 7.388 1.17) (size 1.1 1.1) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 9f0d1527-34b7-4997-9616-0aec08e5cc1b))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 9f0d1527-34b7-4997-9616-0aec08e5cc1b))
|
||||
(pad "G25" smd rect (at 7.388 -0.93) (size 1.1 1.1) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 58cbc600-5265-4d8c-827c-4b405be12ac7))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 58cbc600-5265-4d8c-827c-4b405be12ac7))
|
||||
(pad "G26" smd rect (at 5.288 -0.93) (size 1.1 1.1) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 703b883f-72f5-40b1-adbc-cdcfb53bfea5))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 703b883f-72f5-40b1-adbc-cdcfb53bfea5))
|
||||
(pad "G27" smd rect (at 3.188 -0.93) (size 1.1 1.1) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 16436628-6ca8-4d6b-9cb8-ca6af2d3714a))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 16436628-6ca8-4d6b-9cb8-ca6af2d3714a))
|
||||
(pad "G28" smd rect (at 1.088 -0.93) (size 1.1 1.1) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 6f2e4722-09ee-44ee-a679-fd2bcb6a86d1))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 6f2e4722-09ee-44ee-a679-fd2bcb6a86d1))
|
||||
(pad "G29" smd rect (at -1.012 -0.93) (size 1.1 1.1) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp a70bd170-8cc4-46da-91bf-1a2569d868e6))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp a70bd170-8cc4-46da-91bf-1a2569d868e6))
|
||||
(pad "G30" smd rect (at -3.112 -0.93) (size 1.1 1.1) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 201d48b0-473b-4d24-b049-ef8a444e1f4d))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 201d48b0-473b-4d24-b049-ef8a444e1f4d))
|
||||
(pad "G31" smd rect (at -5.212 -0.93) (size 1.1 1.1) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 3002baae-1617-4f42-bae7-2e5ff0f1568b))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 3002baae-1617-4f42-bae7-2e5ff0f1568b))
|
||||
(pad "G32" smd rect (at -7.312 -0.93) (size 1.1 1.1) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp b0777acc-9d40-43a8-b71c-f019d5bb1124))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp b0777acc-9d40-43a8-b71c-f019d5bb1124))
|
||||
(pad "G33" smd rect (at -7.312 -3.03) (size 1.1 1.1) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp c5e7e549-de36-4424-b2dc-3da775ddf3dc))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp c5e7e549-de36-4424-b2dc-3da775ddf3dc))
|
||||
(pad "G34" smd rect (at -5.212 -3.03) (size 1.1 1.1) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp db618386-dc3c-42dc-8a70-00985868271c))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp db618386-dc3c-42dc-8a70-00985868271c))
|
||||
(pad "G35" smd rect (at -3.112 -3.03) (size 1.1 1.1) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 2690092a-21e1-4350-a582-a02169441841))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 2690092a-21e1-4350-a582-a02169441841))
|
||||
(pad "G36" smd rect (at -1.012 -3.03) (size 1.1 1.1) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 026792d4-0326-4941-9a8d-6196701dc3a0))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 026792d4-0326-4941-9a8d-6196701dc3a0))
|
||||
(pad "G37" smd rect (at 1.088 -3.03) (size 1.1 1.1) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 0a0e3ea8-a83e-42ea-b376-8e99b7fc0ca6))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 0a0e3ea8-a83e-42ea-b376-8e99b7fc0ca6))
|
||||
(pad "G38" smd rect (at 3.188 -3.03) (size 1.1 1.1) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp d3efd584-d4b2-43ba-96ed-81100388c317))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp d3efd584-d4b2-43ba-96ed-81100388c317))
|
||||
(pad "G39" smd rect (at 5.288 -3.03) (size 1.1 1.1) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 704936a5-94a8-4c04-9038-b08ba0bd4ff7))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 704936a5-94a8-4c04-9038-b08ba0bd4ff7))
|
||||
(pad "G40" smd rect (at 7.388 -3.03) (size 1.1 1.1) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 2e47991e-db13-4c31-81ea-fa17d0c73f80))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 2e47991e-db13-4c31-81ea-fa17d0c73f80))
|
||||
(pad "G41" smd rect (at 7.388 -5.13) (size 1.1 1.1) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp d459a67a-3b07-4e3d-b66b-e374c6e29659))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp d459a67a-3b07-4e3d-b66b-e374c6e29659))
|
||||
(pad "G42" smd rect (at 5.288 -5.13) (size 1.1 1.1) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 77c20c53-b612-40e6-8c5f-3e77354bfd91))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 77c20c53-b612-40e6-8c5f-3e77354bfd91))
|
||||
(pad "G43" smd rect (at 3.188 -5.13) (size 1.1 1.1) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp c9abc871-a085-4bdf-a41a-8fffc5864aff))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp c9abc871-a085-4bdf-a41a-8fffc5864aff))
|
||||
(pad "G44" smd rect (at 1.088 -5.13) (size 1.1 1.1) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp ccc4b80a-1d64-408e-b7f0-d55d76aa5895))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp ccc4b80a-1d64-408e-b7f0-d55d76aa5895))
|
||||
(pad "G45" smd rect (at -1.012 -5.13) (size 1.1 1.1) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp ba2aed34-27d0-4b82-af7b-0bbc6549d553))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp ba2aed34-27d0-4b82-af7b-0bbc6549d553))
|
||||
(pad "G46" smd rect (at -3.112 -5.13) (size 1.1 1.1) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 32844663-5686-4e8f-a780-c5c5837520ae))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 32844663-5686-4e8f-a780-c5c5837520ae))
|
||||
(pad "G47" smd rect (at -5.212 -5.13) (size 1.1 1.1) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 6bf40750-9a66-41b4-9b83-092751c75d61))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 6bf40750-9a66-41b4-9b83-092751c75d61))
|
||||
(pad "G48" smd rect (at -7.312 -5.13) (size 1.1 1.1) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 8faf1167-5caa-416c-ac49-15baf634c133))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 8faf1167-5caa-416c-ac49-15baf634c133))
|
||||
(pad "P1" smd rect (at -7.112 7.62) (size 0.8 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 5a83a738-6279-4e3c-bec0-c66d2be5c64f))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 5a83a738-6279-4e3c-bec0-c66d2be5c64f))
|
||||
(pad "P2" smd rect (at -6.012 7.62) (size 0.8 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 488fe14c-9866-4b7a-9c52-c9f9e6d9d718))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 488fe14c-9866-4b7a-9c52-c9f9e6d9d718))
|
||||
(pad "P3" smd rect (at -4.912 7.62) (size 0.8 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp dadac398-becf-446d-8234-ba97db11d4e8))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp dadac398-becf-446d-8234-ba97db11d4e8))
|
||||
(pad "P4" smd rect (at -3.812 7.62) (size 0.8 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 810ef164-f8f4-4b9b-94fc-c10a760fe7cb))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 810ef164-f8f4-4b9b-94fc-c10a760fe7cb))
|
||||
(pad "P5" smd rect (at -2.712 7.62) (size 0.8 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 18ca0b82-6c05-4337-90bd-8d164dd17431))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 18ca0b82-6c05-4337-90bd-8d164dd17431))
|
||||
(pad "P6" smd rect (at -1.612 7.62) (size 0.8 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 83533ea4-5616-45c9-9db7-738c4d72ce6c))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 83533ea4-5616-45c9-9db7-738c4d72ce6c))
|
||||
(pad "P7" smd rect (at -0.512 7.62) (size 0.8 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp a5ceca79-ec50-4dab-b21a-50d87e5f5c69))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp a5ceca79-ec50-4dab-b21a-50d87e5f5c69))
|
||||
(pad "P8" smd rect (at 0.588 7.62) (size 0.8 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 4d0dd1b5-b20e-43dd-b0d4-eae83e474736))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 4d0dd1b5-b20e-43dd-b0d4-eae83e474736))
|
||||
(pad "P9" smd rect (at 1.688 7.62) (size 0.8 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 87dc746e-2943-4d79-b15d-5105ae9d954d))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 87dc746e-2943-4d79-b15d-5105ae9d954d))
|
||||
(pad "P10" smd rect (at 2.788 7.62) (size 0.8 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp fa9bc232-a543-48f4-a2da-e18a2ac2d5b7))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp fa9bc232-a543-48f4-a2da-e18a2ac2d5b7))
|
||||
(pad "P11" smd rect (at 3.888 7.62) (size 0.8 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp a3127a45-7a2d-42a2-9658-eb49f6e7d536))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp a3127a45-7a2d-42a2-9658-eb49f6e7d536))
|
||||
(pad "P12" smd rect (at 4.988 7.62) (size 0.8 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 9cb0f258-2d2d-42ee-85c1-4cc32be4d665))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 9cb0f258-2d2d-42ee-85c1-4cc32be4d665))
|
||||
(pad "P13" smd rect (at 6.088 7.62) (size 0.8 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp ecc1844f-3e68-4819-b93a-6558e8e38d7d))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp ecc1844f-3e68-4819-b93a-6558e8e38d7d))
|
||||
(pad "P14" smd rect (at 7.188 7.62) (size 0.8 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 4706ca72-cc45-4f8d-82fa-abcc4df17fde))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 4706ca72-cc45-4f8d-82fa-abcc4df17fde))
|
||||
(pad "P15" smd rect (at 9.988 6.77 90) (size 0.8 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 1d359da5-ef08-4909-ba04-10ff9cdae552))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 1d359da5-ef08-4909-ba04-10ff9cdae552))
|
||||
(pad "P16" smd rect (at 9.988 5.67 90) (size 0.8 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp cefa4607-6fc0-420d-b74f-5070d510a1df))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp cefa4607-6fc0-420d-b74f-5070d510a1df))
|
||||
(pad "P17" smd rect (at 9.988 4.57 90) (size 0.8 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 732520a5-03d6-4535-9509-49557e4fff03))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 732520a5-03d6-4535-9509-49557e4fff03))
|
||||
(pad "P18" smd rect (at 9.988 3.47 90) (size 0.8 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 67b80122-4bb5-4ee1-9785-357b593ced7e))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 67b80122-4bb5-4ee1-9785-357b593ced7e))
|
||||
(pad "P19" smd rect (at 9.988 2.37 90) (size 0.8 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 384c44a5-ec21-422f-96e3-1834a440aa61))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 384c44a5-ec21-422f-96e3-1834a440aa61))
|
||||
(pad "P20" smd rect (at 9.988 1.27 90) (size 0.8 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 9b0b15fc-c03b-4b3a-bbfa-0b2e3cc98e83))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 9b0b15fc-c03b-4b3a-bbfa-0b2e3cc98e83))
|
||||
(pad "P21" smd rect (at 9.988 0.17 90) (size 0.8 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp a7a1901a-1406-41db-830d-3ef4970ed3b7))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp a7a1901a-1406-41db-830d-3ef4970ed3b7))
|
||||
(pad "P22" smd rect (at 9.988 -0.93 90) (size 0.8 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 984d38b0-d559-4c74-bdf9-7bd901989831))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 984d38b0-d559-4c74-bdf9-7bd901989831))
|
||||
(pad "P23" smd rect (at 9.988 -2.03 90) (size 0.8 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 79e64bb9-bc7f-4fea-9368-2166f55a6cda))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 79e64bb9-bc7f-4fea-9368-2166f55a6cda))
|
||||
(pad "P24" smd rect (at 9.988 -3.13 90) (size 0.8 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 4a47bde0-1c96-471f-9cb8-73060d47ba17))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 4a47bde0-1c96-471f-9cb8-73060d47ba17))
|
||||
(pad "P25" smd rect (at 9.988 -4.23 90) (size 0.8 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 97b2f253-5110-47e2-b7fa-5dea04fd1f7d))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 97b2f253-5110-47e2-b7fa-5dea04fd1f7d))
|
||||
(pad "P26" smd rect (at 9.988 -5.33 90) (size 0.8 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 4d23dbf8-6d4e-4a40-91d9-09a618ccf875))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 4d23dbf8-6d4e-4a40-91d9-09a618ccf875))
|
||||
(pad "P27" smd rect (at 9.988 -6.43 90) (size 0.8 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 076b6183-afad-4656-a4c5-84af038ca7c1))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 076b6183-afad-4656-a4c5-84af038ca7c1))
|
||||
(pad "P28" smd rect (at 7.188 -7.33) (size 0.8 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 8e3af63c-d560-4720-93b4-8842e9bf7fef))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 8e3af63c-d560-4720-93b4-8842e9bf7fef))
|
||||
(pad "P29" smd rect (at 6.088 -7.33) (size 0.8 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp f94126af-e49c-458e-be12-94377023621b))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp f94126af-e49c-458e-be12-94377023621b))
|
||||
(pad "P30" smd rect (at 4.988 -7.33) (size 0.8 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 7d26b775-c818-4bc7-a591-a2868916f784))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 7d26b775-c818-4bc7-a591-a2868916f784))
|
||||
(pad "P31" smd rect (at 3.888 -7.33) (size 0.8 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 2f156eb1-2396-49f0-a159-7743b53eac7f))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 2f156eb1-2396-49f0-a159-7743b53eac7f))
|
||||
(pad "P32" smd rect (at 2.788 -7.33) (size 0.8 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 784939c0-c410-43e5-970c-1ebc7e53759f))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 784939c0-c410-43e5-970c-1ebc7e53759f))
|
||||
(pad "P33" smd rect (at 1.688 -7.33) (size 0.8 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 00a56590-d05b-4d0d-b7b1-e5ce0d15738d))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 00a56590-d05b-4d0d-b7b1-e5ce0d15738d))
|
||||
(pad "P34" smd rect (at 0.588 -7.33) (size 0.8 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp f6431ee6-d142-438d-860b-bb7c35c68834))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp f6431ee6-d142-438d-860b-bb7c35c68834))
|
||||
(pad "P35" smd rect (at -0.512 -7.33) (size 0.8 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp c33995b1-93c6-4e3c-bcd9-e3f497fe8ef6))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp c33995b1-93c6-4e3c-bcd9-e3f497fe8ef6))
|
||||
(pad "P36" smd rect (at -1.612 -7.33) (size 0.8 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp a085f7a6-5bc0-4c65-b712-d84ca72c5c71))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp a085f7a6-5bc0-4c65-b712-d84ca72c5c71))
|
||||
(pad "P37" smd rect (at -2.712 -7.33) (size 0.8 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp be2dd808-04df-4dc1-a91a-a17f42cab272))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp be2dd808-04df-4dc1-a91a-a17f42cab272))
|
||||
(pad "P38" smd rect (at -3.812 -7.33) (size 0.8 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp d5ef1446-279e-4a93-a041-e4896151e127))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp d5ef1446-279e-4a93-a041-e4896151e127))
|
||||
(pad "P39" smd rect (at -4.912 -7.33) (size 0.8 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp b98725e3-f0ca-4f7b-9e78-9c682a00a327))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp b98725e3-f0ca-4f7b-9e78-9c682a00a327))
|
||||
(pad "P40" smd rect (at -6.012 -7.33) (size 0.8 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 54f29ba5-24cf-414f-8b53-db9aa77967ed))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 54f29ba5-24cf-414f-8b53-db9aa77967ed))
|
||||
(pad "P41" smd rect (at -7.112 -7.33) (size 0.8 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 30f7330b-b820-4ba8-ae2d-719bdef7a767))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 30f7330b-b820-4ba8-ae2d-719bdef7a767))
|
||||
(pad "P42" smd rect (at -9.912 -6.43 270) (size 0.8 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 783c653e-5a05-405d-90cc-c5426300790f))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 783c653e-5a05-405d-90cc-c5426300790f))
|
||||
(pad "P43" smd rect (at -9.912 -5.33 270) (size 0.8 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 749317a7-05b7-4697-b64b-494351ff4605))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 749317a7-05b7-4697-b64b-494351ff4605))
|
||||
(pad "P44" smd rect (at -9.912 -4.23 270) (size 0.8 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp d28e358b-9223-46ab-9c0a-bb214cfeee2e))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp d28e358b-9223-46ab-9c0a-bb214cfeee2e))
|
||||
(pad "P45" smd rect (at -9.912 -3.13 270) (size 0.8 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 987fd53e-7a5a-452a-b329-69f8e90dd6e4))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 987fd53e-7a5a-452a-b329-69f8e90dd6e4))
|
||||
(pad "P46" smd rect (at -9.912 -2.03 270) (size 0.8 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 168e2d39-5a1c-4159-80f1-6b7e0be68909))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 168e2d39-5a1c-4159-80f1-6b7e0be68909))
|
||||
(pad "P47" smd rect (at -9.912 -0.93 270) (size 0.8 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 3a2c96c3-1db8-4637-b14d-77a2238b3887))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 3a2c96c3-1db8-4637-b14d-77a2238b3887))
|
||||
(pad "P48" smd rect (at -9.912 0.17 270) (size 0.8 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 52162f4f-4efe-4b79-b0be-de0f58a98a3c))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 52162f4f-4efe-4b79-b0be-de0f58a98a3c))
|
||||
(pad "P49" smd rect (at -9.912 1.27 270) (size 0.8 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 548119b5-f92c-41ec-8f6a-3f7ad98c5722))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 548119b5-f92c-41ec-8f6a-3f7ad98c5722))
|
||||
(pad "P50" smd rect (at -9.912 2.37 270) (size 0.8 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 3aad7c48-afc3-49ea-85bb-cb02519ac56e))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 3aad7c48-afc3-49ea-85bb-cb02519ac56e))
|
||||
(pad "P51" smd rect (at -9.912 3.47 270) (size 0.8 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp e169d986-9a0c-4bcd-85ed-43317cd7988c))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp e169d986-9a0c-4bcd-85ed-43317cd7988c))
|
||||
(pad "P52" smd rect (at -9.912 4.57 270) (size 0.8 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 0805baf4-eae8-4d4c-9ac0-6ff4d64a7a14))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 0805baf4-eae8-4d4c-9ac0-6ff4d64a7a14))
|
||||
(pad "P53" smd rect (at -9.912 5.67 270) (size 0.8 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 31ac3a88-157a-46ac-82b2-94f2de7e441c))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 31ac3a88-157a-46ac-82b2-94f2de7e441c))
|
||||
(pad "P54" smd rect (at -9.912 6.77 270) (size 0.8 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 0030c45c-cbb1-42f2-bf36-75df0d947575))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 0030c45c-cbb1-42f2-bf36-75df0d947575))
|
||||
)
|
||||
|
|
|
|||
|
|
@ -138,105 +138,105 @@
|
|||
(fp_line (start 2.254 2.246) (end 2.254 -2.254)
|
||||
(stroke (width 0.05) (type solid)) (layer "F.Fab") (tstamp a1a6db09-21c7-41f1-b623-5dbbd4972275))
|
||||
(pad "1" smd roundrect (at -1.996 -2.004) (size 0.25 0.25) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp fe937577-3df8-4e8e-afb2-b0645ea2cf9f))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp fe937577-3df8-4e8e-afb2-b0645ea2cf9f))
|
||||
(pad "2" smd roundrect (at -1.496 -2.004) (size 0.25 0.25) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp f8a16b08-ec37-4d57-9f64-2ba134c70d02))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp f8a16b08-ec37-4d57-9f64-2ba134c70d02))
|
||||
(pad "3" smd roundrect (at -0.996 -2.004) (size 0.25 0.25) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 5b55b300-94f4-4721-87d1-500c661e86a6))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 5b55b300-94f4-4721-87d1-500c661e86a6))
|
||||
(pad "4" smd roundrect (at -0.496 -2.004) (size 0.25 0.25) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 6981f95a-0baf-499f-8058-78b7b966d8d7))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 6981f95a-0baf-499f-8058-78b7b966d8d7))
|
||||
(pad "5" smd roundrect (at 0.004 -2.004) (size 0.25 0.25) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 915fe81e-c9c1-4f97-8610-5c8add9011f9))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 915fe81e-c9c1-4f97-8610-5c8add9011f9))
|
||||
(pad "6" smd roundrect (at 0.504 -2.004) (size 0.25 0.25) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 9f7947ff-bd2d-4428-8f70-67b1eee76b69))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 9f7947ff-bd2d-4428-8f70-67b1eee76b69))
|
||||
(pad "7" smd roundrect (at 1.004 -2.004) (size 0.25 0.25) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp ab27c2b4-b807-40f2-bc91-2e935e6a5fe9))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp ab27c2b4-b807-40f2-bc91-2e935e6a5fe9))
|
||||
(pad "8" smd roundrect (at 1.504 -2.004) (size 0.25 0.25) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 400275f6-b83f-45a6-9513-d690547f0e7f))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 400275f6-b83f-45a6-9513-d690547f0e7f))
|
||||
(pad "9" smd roundrect (at 2.004 -2.004) (size 0.25 0.25) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 57de447d-bb13-401f-9939-870b5872e84a))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 57de447d-bb13-401f-9939-870b5872e84a))
|
||||
(pad "10" smd roundrect (at 2.004 -1.504) (size 0.25 0.25) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp a195b63e-8089-43c9-a1f9-329843746c37))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp a195b63e-8089-43c9-a1f9-329843746c37))
|
||||
(pad "11" smd roundrect (at 2.004 -1.004) (size 0.25 0.25) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 5a6591d6-4f32-40f7-a76d-dc3cac8d9f7d))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 5a6591d6-4f32-40f7-a76d-dc3cac8d9f7d))
|
||||
(pad "12" smd roundrect (at 2.004 -0.504) (size 0.25 0.25) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 4ae2599c-d679-487b-a0f0-172089741ab9))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 4ae2599c-d679-487b-a0f0-172089741ab9))
|
||||
(pad "13" smd roundrect (at 2.004 -0.004) (size 0.25 0.25) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 1f01ca4d-4ca6-4bee-ba79-b62cb76bddf4))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 1f01ca4d-4ca6-4bee-ba79-b62cb76bddf4))
|
||||
(pad "14" smd roundrect (at 2.004 0.496) (size 0.25 0.25) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 9115c308-e168-438e-93e8-36a4b0208233))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 9115c308-e168-438e-93e8-36a4b0208233))
|
||||
(pad "15" smd roundrect (at 2.004 0.996) (size 0.25 0.25) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp d24ff8ff-d1ba-428a-bce5-5299b8079c01))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp d24ff8ff-d1ba-428a-bce5-5299b8079c01))
|
||||
(pad "16" smd roundrect (at 2.004 1.496) (size 0.25 0.25) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp eb88f9b2-06a2-4eb9-9e4f-3cc5417a36d2))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp eb88f9b2-06a2-4eb9-9e4f-3cc5417a36d2))
|
||||
(pad "17" smd roundrect (at 2.004 1.996) (size 0.25 0.25) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 5ce82f3f-7e1e-4998-99be-a8b5bbe9fbac))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 5ce82f3f-7e1e-4998-99be-a8b5bbe9fbac))
|
||||
(pad "18" smd roundrect (at 1.504 1.996) (size 0.25 0.25) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp e822b743-0c9c-4263-8b18-bba789ffd58f))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp e822b743-0c9c-4263-8b18-bba789ffd58f))
|
||||
(pad "19" smd roundrect (at 1.004 1.996) (size 0.25 0.25) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 95e06c80-7d81-4808-a440-533b8d549313))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 95e06c80-7d81-4808-a440-533b8d549313))
|
||||
(pad "20" smd roundrect (at 0.504 1.996) (size 0.25 0.25) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 09355a59-11dd-4fd8-9d4a-13d6d524e6f2))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 09355a59-11dd-4fd8-9d4a-13d6d524e6f2))
|
||||
(pad "21" smd roundrect (at 0.004 1.996) (size 0.25 0.25) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 2ef91d36-d762-4886-a732-b037160d6efb))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 2ef91d36-d762-4886-a732-b037160d6efb))
|
||||
(pad "22" smd roundrect (at -0.496 1.996) (size 0.25 0.25) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 7b3295b0-eb87-49d4-a942-572a0f24847f))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 7b3295b0-eb87-49d4-a942-572a0f24847f))
|
||||
(pad "23" smd roundrect (at -0.996 1.996) (size 0.25 0.25) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 16e67ed7-9013-45ee-9b76-f4de48e2201f))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 16e67ed7-9013-45ee-9b76-f4de48e2201f))
|
||||
(pad "24" smd roundrect (at -1.496 1.996) (size 0.25 0.25) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 040b6eea-9724-42cc-8dea-c9f7321e07ec))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 040b6eea-9724-42cc-8dea-c9f7321e07ec))
|
||||
(pad "25" smd roundrect (at -1.996 1.996) (size 0.25 0.25) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 081338b5-e821-4b49-97ed-38a6d4991bdd))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 081338b5-e821-4b49-97ed-38a6d4991bdd))
|
||||
(pad "26" smd roundrect (at -1.996 1.496) (size 0.25 0.25) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 309af8d2-be2b-4ed1-828f-6c21ebff8f0b))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 309af8d2-be2b-4ed1-828f-6c21ebff8f0b))
|
||||
(pad "27" smd roundrect (at -1.996 0.996) (size 0.25 0.25) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp f913d592-4a7f-4ae8-9153-ad908601ec44))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp f913d592-4a7f-4ae8-9153-ad908601ec44))
|
||||
(pad "28" smd roundrect (at -1.996 0.496) (size 0.25 0.25) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 9cb98d40-47ca-48f1-81b8-26194303712d))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 9cb98d40-47ca-48f1-81b8-26194303712d))
|
||||
(pad "29" smd roundrect (at -1.996 -0.004) (size 0.25 0.25) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp a2537fe2-8aa7-49a2-bd46-cd29984210ec))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp a2537fe2-8aa7-49a2-bd46-cd29984210ec))
|
||||
(pad "30" smd roundrect (at -1.996 -0.504) (size 0.25 0.25) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 6df928d7-f39c-4f23-a13d-3e798e865e53))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 6df928d7-f39c-4f23-a13d-3e798e865e53))
|
||||
(pad "31" smd roundrect (at -1.996 -1.004) (size 0.25 0.25) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 5c6b4765-b11b-4956-a81d-254c40900fa6))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 5c6b4765-b11b-4956-a81d-254c40900fa6))
|
||||
(pad "32" smd roundrect (at -1.996 -1.504) (size 0.25 0.25) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 0a5f6260-4e38-49e1-b816-2a86a967ea36))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 0a5f6260-4e38-49e1-b816-2a86a967ea36))
|
||||
(pad "33" smd roundrect (at -0.996 -1.004) (size 0.25 0.25) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 90e43781-cce3-470c-b31a-bfb389e6bbd3))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 90e43781-cce3-470c-b31a-bfb389e6bbd3))
|
||||
(pad "34" smd roundrect (at -0.496 -1.004) (size 0.25 0.25) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp b0594ffc-4eb7-4d35-941d-bfe131c4ad28))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp b0594ffc-4eb7-4d35-941d-bfe131c4ad28))
|
||||
(pad "35" smd roundrect (at 0.004 -1.004) (size 0.25 0.25) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 8040129c-51e4-44ec-9842-c8de4d5e6f7e))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 8040129c-51e4-44ec-9842-c8de4d5e6f7e))
|
||||
(pad "36" smd roundrect (at 0.504 -1.004) (size 0.25 0.25) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp a0f6a0cf-7c35-40e6-b707-0a9530b7be69))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp a0f6a0cf-7c35-40e6-b707-0a9530b7be69))
|
||||
(pad "37" smd roundrect (at 1.004 -1.004) (size 0.25 0.25) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 0f518e68-caa5-4004-a38c-ad6cc7f449c7))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 0f518e68-caa5-4004-a38c-ad6cc7f449c7))
|
||||
(pad "38" smd roundrect (at 1.004 -0.004) (size 0.25 0.25) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 3f1d0f88-5376-4c36-9921-2217c283d968))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 3f1d0f88-5376-4c36-9921-2217c283d968))
|
||||
(pad "39" smd roundrect (at 1.004 0.496) (size 0.25 0.25) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 1afafeee-4e1e-43b8-a162-68bbbba964ec))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 1afafeee-4e1e-43b8-a162-68bbbba964ec))
|
||||
(pad "40" smd roundrect (at 1.004 0.996) (size 0.25 0.25) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 18386641-07dd-4363-9979-a7027c42b4b4))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 18386641-07dd-4363-9979-a7027c42b4b4))
|
||||
(pad "41" smd roundrect (at 0.504 0.996) (size 0.25 0.25) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp ddb6b8b1-d761-4472-8e57-5763db4e4ece))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp ddb6b8b1-d761-4472-8e57-5763db4e4ece))
|
||||
(pad "42" smd roundrect (at 0.004 0.996) (size 0.25 0.25) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 5da269a7-866d-407b-acde-84e5a123849f))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 5da269a7-866d-407b-acde-84e5a123849f))
|
||||
(pad "43" smd roundrect (at -0.496 0.996) (size 0.25 0.25) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 55c38ae4-5e5f-4f5b-a09d-2e8b7335bfc3))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 55c38ae4-5e5f-4f5b-a09d-2e8b7335bfc3))
|
||||
(pad "44" smd roundrect (at -0.996 0.996) (size 0.25 0.25) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 9c9a51d4-006f-4c33-b9e8-7b19445d0899))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 9c9a51d4-006f-4c33-b9e8-7b19445d0899))
|
||||
(pad "45" smd roundrect (at -0.996 0.496) (size 0.25 0.25) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 3a0c149f-868a-49d7-a17a-feb76356431d))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 3a0c149f-868a-49d7-a17a-feb76356431d))
|
||||
(pad "46" smd roundrect (at -0.996 -0.004) (size 0.25 0.25) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 9fc4512b-d63f-4bc3-b75b-f4d677507166))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 9fc4512b-d63f-4bc3-b75b-f4d677507166))
|
||||
(pad "47" smd roundrect (at -0.996 -0.504) (size 0.25 0.25) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp a7af7a9b-737d-4709-80c8-87a9948ba10b))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp a7af7a9b-737d-4709-80c8-87a9948ba10b))
|
||||
(pad "48" smd roundrect (at -0.496 -0.504) (size 0.25 0.25) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp f5180453-4388-43fa-b86a-09578f1da07e))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp f5180453-4388-43fa-b86a-09578f1da07e))
|
||||
(pad "49" smd roundrect (at 0.504 -0.504) (size 0.25 0.25) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp a0213fe0-6788-4c72-ae02-c24f6a2cf0f1))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp a0213fe0-6788-4c72-ae02-c24f6a2cf0f1))
|
||||
(pad "50" smd roundrect (at 0.504 0.496) (size 0.25 0.25) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 786bc1ef-ad4d-4c51-b7d2-1e7c25cea783))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 786bc1ef-ad4d-4c51-b7d2-1e7c25cea783))
|
||||
(pad "51" smd roundrect (at -0.496 0.496) (size 0.25 0.25) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 938edcd3-c77d-40e7-a04a-d828419203af))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 938edcd3-c77d-40e7-a04a-d828419203af))
|
||||
)
|
||||
|
|
|
|||
|
|
@ -36,141 +36,141 @@
|
|||
(fp_line (start 5 5) (end 5 -5)
|
||||
(stroke (width 0.127) (type solid)) (layer "F.Fab") (tstamp c05a3e49-b194-4b9d-9e43-1867c560235f))
|
||||
(pad "1" smd rect (at -4.9 -4 180) (size 1 0.36) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp f5200bfa-1566-4463-a5a8-2ce2d317c720))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp f5200bfa-1566-4463-a5a8-2ce2d317c720))
|
||||
(pad "2" smd rect (at -4.9 -3.2 180) (size 1 0.36) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 54d327d6-c3f4-4100-a649-db18581b78cf))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 54d327d6-c3f4-4100-a649-db18581b78cf))
|
||||
(pad "3" smd rect (at -4.9 -2.4 180) (size 1 0.36) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 88beecb4-4d5b-47de-82f2-2277143417e0))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 88beecb4-4d5b-47de-82f2-2277143417e0))
|
||||
(pad "4" smd rect (at -4.9 -1.6 180) (size 1 0.36) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 63379693-798b-41f1-9c8b-db2991091a4f))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 63379693-798b-41f1-9c8b-db2991091a4f))
|
||||
(pad "5" smd rect (at -4.9 -0.8 180) (size 1 0.36) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 08ee5c25-2ef4-43b6-9e90-23427bb65181))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 08ee5c25-2ef4-43b6-9e90-23427bb65181))
|
||||
(pad "6" smd rect (at -4.9 0 180) (size 1 0.36) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp fd9eaee3-c2aa-4047-a466-675f8a09c4b4))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp fd9eaee3-c2aa-4047-a466-675f8a09c4b4))
|
||||
(pad "7" smd rect (at -4.9 0.8 180) (size 1 0.36) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp e4402c75-0dcc-4eab-9657-d8487ea2e098))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp e4402c75-0dcc-4eab-9657-d8487ea2e098))
|
||||
(pad "8" smd rect (at -4.9 1.6 180) (size 1 0.36) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 127c6061-9fb3-4dea-a529-359adc264904))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 127c6061-9fb3-4dea-a529-359adc264904))
|
||||
(pad "9" smd rect (at -4.9 2.4 180) (size 1 0.36) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp e3f5c097-1789-4130-9362-f241934c21d5))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp e3f5c097-1789-4130-9362-f241934c21d5))
|
||||
(pad "10" smd rect (at -4.9 3.2 180) (size 1 0.36) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 146516df-bead-4fcc-bff1-eb38ec080c85))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 146516df-bead-4fcc-bff1-eb38ec080c85))
|
||||
(pad "11" smd rect (at -4.9 4 180) (size 1 0.36) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp a9e04fe3-9dd3-4a5b-99e8-671f0f94d9fd))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp a9e04fe3-9dd3-4a5b-99e8-671f0f94d9fd))
|
||||
(pad "12" smd rect (at -4 4.9 270) (size 1 0.36) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp ca536052-69d3-4b4f-a224-74dc664345df))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp ca536052-69d3-4b4f-a224-74dc664345df))
|
||||
(pad "13" smd rect (at -3.2 4.9 270) (size 1 0.36) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 92a1bece-b026-4562-83c4-845a93d98e28))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 92a1bece-b026-4562-83c4-845a93d98e28))
|
||||
(pad "14" smd rect (at -2.4 4.9 270) (size 1 0.36) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 4876489b-d3bf-4887-8b17-9455f06dc374))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 4876489b-d3bf-4887-8b17-9455f06dc374))
|
||||
(pad "15" smd rect (at -1.6 4.9 270) (size 1 0.36) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp e968097e-4fa3-4a83-a6c5-cf7cee3d3ea6))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp e968097e-4fa3-4a83-a6c5-cf7cee3d3ea6))
|
||||
(pad "16" smd rect (at -0.8 4.9 270) (size 1 0.36) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp a1f8fb10-0415-4ff5-ad84-3b6249716d5c))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp a1f8fb10-0415-4ff5-ad84-3b6249716d5c))
|
||||
(pad "17" smd rect (at 0 4.9 270) (size 1 0.36) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 5dea3116-bf02-4ccc-a5f7-5434bb5a8587))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 5dea3116-bf02-4ccc-a5f7-5434bb5a8587))
|
||||
(pad "18" smd rect (at 0.8 4.9 270) (size 1 0.36) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 66508b0c-1793-4ad5-8552-16f2d7dd2a76))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 66508b0c-1793-4ad5-8552-16f2d7dd2a76))
|
||||
(pad "19" smd rect (at 1.6 4.9 270) (size 1 0.36) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 859d7c14-3e71-4e5c-8bab-440b61fa1e36))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 859d7c14-3e71-4e5c-8bab-440b61fa1e36))
|
||||
(pad "20" smd rect (at 2.4 4.9 270) (size 1 0.36) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp b9b9d22c-51c4-428f-9374-6488a5613252))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp b9b9d22c-51c4-428f-9374-6488a5613252))
|
||||
(pad "21" smd rect (at 3.2 4.9 270) (size 1 0.36) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 274c290f-5fd0-496e-a0ec-7ed89bbb2f52))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 274c290f-5fd0-496e-a0ec-7ed89bbb2f52))
|
||||
(pad "22" smd rect (at 4 4.9 270) (size 1 0.36) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp d7a0c3ef-e6b6-4d69-9994-c2f05f6e3412))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp d7a0c3ef-e6b6-4d69-9994-c2f05f6e3412))
|
||||
(pad "23" smd rect (at 4.9 4) (size 1 0.36) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 5fb3cb4c-f117-49d3-8a7f-ccbf0fffeb7b))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 5fb3cb4c-f117-49d3-8a7f-ccbf0fffeb7b))
|
||||
(pad "24" smd rect (at 4.9 3.2) (size 1 0.36) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp b3c486e1-e3b4-40e9-9799-91d57a2c6786))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp b3c486e1-e3b4-40e9-9799-91d57a2c6786))
|
||||
(pad "25" smd rect (at 4.9 2.4) (size 1 0.36) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 229964b3-ec57-4693-8764-6af12395dd74))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 229964b3-ec57-4693-8764-6af12395dd74))
|
||||
(pad "26" smd rect (at 4.9 1.6) (size 1 0.36) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp e5140adf-ffab-4255-a1a5-ea6764665943))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp e5140adf-ffab-4255-a1a5-ea6764665943))
|
||||
(pad "27" smd rect (at 4.9 0.8) (size 1 0.36) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 6f9c299c-b2c6-43d1-a50d-596f6f8832ab))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 6f9c299c-b2c6-43d1-a50d-596f6f8832ab))
|
||||
(pad "28" smd rect (at 4.9 0) (size 1 0.36) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp c5f33fb3-b882-415c-ad2d-4977619fbc4a))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp c5f33fb3-b882-415c-ad2d-4977619fbc4a))
|
||||
(pad "29" smd rect (at 4.9 -0.8) (size 1 0.36) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp cfd44279-cf81-4f78-a6d5-0b485f042421))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp cfd44279-cf81-4f78-a6d5-0b485f042421))
|
||||
(pad "30" smd rect (at 4.9 -1.6) (size 1 0.36) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 0cbe2035-b9c2-44d7-92d2-3c575cf3b54b))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 0cbe2035-b9c2-44d7-92d2-3c575cf3b54b))
|
||||
(pad "31" smd rect (at 4.9 -2.4) (size 1 0.36) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 0ce41833-a78b-4bf8-a26c-4e827bea2b0f))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 0ce41833-a78b-4bf8-a26c-4e827bea2b0f))
|
||||
(pad "32" smd rect (at 4.9 -3.2) (size 1 0.36) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp a6f1360a-7a5e-445c-bce0-a53af95cd00e))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp a6f1360a-7a5e-445c-bce0-a53af95cd00e))
|
||||
(pad "33" smd rect (at 4.9 -4) (size 1 0.36) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 9ce6ef1b-0798-4e24-9401-b03efd9059fc))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 9ce6ef1b-0798-4e24-9401-b03efd9059fc))
|
||||
(pad "34" smd rect (at 4 -4.9 90) (size 1 0.36) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 4675f15d-93e6-4c4a-8514-87969e3fa77a))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 4675f15d-93e6-4c4a-8514-87969e3fa77a))
|
||||
(pad "35" smd rect (at 3.2 -4.9 90) (size 1 0.36) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 69df3a6f-54c6-4242-83fb-9ac283d0221c))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 69df3a6f-54c6-4242-83fb-9ac283d0221c))
|
||||
(pad "36" smd rect (at 2.4 -4.9 90) (size 1 0.36) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 29fcca6c-083d-436b-87ac-b4b6205506ae))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 29fcca6c-083d-436b-87ac-b4b6205506ae))
|
||||
(pad "37" smd rect (at 1.6 -4.9 90) (size 1 0.36) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 82089ba2-133c-47b7-8901-f5b8920bfc73))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 82089ba2-133c-47b7-8901-f5b8920bfc73))
|
||||
(pad "38" smd rect (at 0.8 -4.9 90) (size 1 0.36) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp dfae1486-2200-4bfd-8d4a-2df34e52441e))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp dfae1486-2200-4bfd-8d4a-2df34e52441e))
|
||||
(pad "39" smd rect (at 0 -4.9 90) (size 1 0.36) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 07a6b2fd-044a-4cc9-86cf-81fb8266ddb9))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 07a6b2fd-044a-4cc9-86cf-81fb8266ddb9))
|
||||
(pad "40" smd rect (at -0.8 -4.9 90) (size 1 0.36) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp ebd5cd3b-7208-43fb-8f4b-599186441999))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp ebd5cd3b-7208-43fb-8f4b-599186441999))
|
||||
(pad "41" smd rect (at -1.6 -4.9 90) (size 1 0.36) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp bf030675-5de2-48d0-9044-ebd6f33b52e0))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp bf030675-5de2-48d0-9044-ebd6f33b52e0))
|
||||
(pad "42" smd rect (at -2.4 -4.9 90) (size 1 0.36) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 3b6dcda9-818b-4729-935f-6fb18e4b1235))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 3b6dcda9-818b-4729-935f-6fb18e4b1235))
|
||||
(pad "43" smd rect (at -3.2 -4.9 90) (size 1 0.36) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 8e7ee21b-c6de-445f-8517-824d2c0a774f))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 8e7ee21b-c6de-445f-8517-824d2c0a774f))
|
||||
(pad "44" smd rect (at -4 -4.9 90) (size 1 0.36) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 0085adeb-3a20-47f7-a4e6-5df0c3b59f6c))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 0085adeb-3a20-47f7-a4e6-5df0c3b59f6c))
|
||||
(pad "45" smd roundrect (at -3 -3) (size 0.6 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 731cfdf3-cb27-4b8c-9f37-2c0399968575))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 731cfdf3-cb27-4b8c-9f37-2c0399968575))
|
||||
(pad "46" smd roundrect (at -3 -1.5) (size 0.6 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp d42a4cbf-d473-4b14-9fa2-d49456637127))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp d42a4cbf-d473-4b14-9fa2-d49456637127))
|
||||
(pad "47" smd roundrect (at -3 0) (size 0.6 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 25f149e5-3708-4a21-9dec-def3b813eb20))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 25f149e5-3708-4a21-9dec-def3b813eb20))
|
||||
(pad "48" smd roundrect (at -3 1.5) (size 0.6 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 87866021-42e3-4137-9834-65914c2e3126))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 87866021-42e3-4137-9834-65914c2e3126))
|
||||
(pad "49" smd roundrect (at -3 3) (size 0.6 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 736bbe84-7d7a-4006-a624-efd41a749926))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 736bbe84-7d7a-4006-a624-efd41a749926))
|
||||
(pad "50" smd roundrect (at -1.5 -3) (size 0.6 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 8989cec4-44f2-4819-a14e-f87d54bb879c))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 8989cec4-44f2-4819-a14e-f87d54bb879c))
|
||||
(pad "51" smd roundrect (at -1.5 -1.5) (size 0.6 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 882c8d19-4684-48ba-9c3d-62d57ff22ed0))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 882c8d19-4684-48ba-9c3d-62d57ff22ed0))
|
||||
(pad "52" smd roundrect (at -1.5 0) (size 0.6 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp f6738dd6-4cab-4489-a49a-a84297411bc9))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp f6738dd6-4cab-4489-a49a-a84297411bc9))
|
||||
(pad "53" smd roundrect (at -1.5 1.5) (size 0.6 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 58d9782c-6780-47a5-94b9-e535ce6e5b3c))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 58d9782c-6780-47a5-94b9-e535ce6e5b3c))
|
||||
(pad "54" smd roundrect (at -1.5 3) (size 0.6 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp b35fe4ff-e95f-40fe-98c5-cf54733f0c1b))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp b35fe4ff-e95f-40fe-98c5-cf54733f0c1b))
|
||||
(pad "55" smd roundrect (at 0 -3) (size 0.6 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 5e4b2c2f-bdbe-4553-b67c-dc63c1365bb5))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 5e4b2c2f-bdbe-4553-b67c-dc63c1365bb5))
|
||||
(pad "56" smd roundrect (at 0 -1.5) (size 0.6 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp b8cd479c-66e3-49ea-9091-ddde136f2fd5))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp b8cd479c-66e3-49ea-9091-ddde136f2fd5))
|
||||
(pad "57" smd roundrect (at 0 0) (size 0.6 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp d7c4395a-4ff0-4832-8718-a5b4a05a7e6e))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp d7c4395a-4ff0-4832-8718-a5b4a05a7e6e))
|
||||
(pad "58" smd roundrect (at 0 1.5) (size 0.6 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp ee2143c9-380f-448a-ba2a-9a14354d099b))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp ee2143c9-380f-448a-ba2a-9a14354d099b))
|
||||
(pad "59" smd roundrect (at 0 3) (size 0.6 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 938025f2-287a-424f-bcb4-4a5eb3978192))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 938025f2-287a-424f-bcb4-4a5eb3978192))
|
||||
(pad "60" smd roundrect (at 1.5 -3) (size 0.6 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp d0e00e6f-1a23-407a-800d-8ce622ae927a))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp d0e00e6f-1a23-407a-800d-8ce622ae927a))
|
||||
(pad "61" smd roundrect (at 1.5 -1.5) (size 0.6 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 64e65045-7d09-475f-893f-ecaf9a828c91))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 64e65045-7d09-475f-893f-ecaf9a828c91))
|
||||
(pad "62" smd roundrect (at 1.5 0) (size 0.6 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp c611c05b-c590-467e-a8c6-16d3e5ecd9cd))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp c611c05b-c590-467e-a8c6-16d3e5ecd9cd))
|
||||
(pad "63" smd roundrect (at 1.5 1.5) (size 0.6 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 3003bbfc-54d4-466a-9f06-0883dddae5fa))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 3003bbfc-54d4-466a-9f06-0883dddae5fa))
|
||||
(pad "64" smd roundrect (at 1.5 3) (size 0.6 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp d40b4fda-3e8d-4554-bd83-3dbb164d9f00))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp d40b4fda-3e8d-4554-bd83-3dbb164d9f00))
|
||||
(pad "65" smd roundrect (at 3 -3) (size 0.6 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 60796e6f-8b7c-4bd4-8801-dd7480689d4b))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 60796e6f-8b7c-4bd4-8801-dd7480689d4b))
|
||||
(pad "66" smd roundrect (at 3 -1.5) (size 0.6 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 495fff4a-18aa-4b60-9020-62257de04d64))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 495fff4a-18aa-4b60-9020-62257de04d64))
|
||||
(pad "67" smd roundrect (at 3 0) (size 0.6 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp bc625443-eb41-4bba-9f2c-8fd8c28bd956))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp bc625443-eb41-4bba-9f2c-8fd8c28bd956))
|
||||
(pad "68" smd roundrect (at 3 1.5) (size 0.6 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 0e03f931-d06a-4921-b7cd-a23edc874124))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 0e03f931-d06a-4921-b7cd-a23edc874124))
|
||||
(pad "69" smd roundrect (at 3 3) (size 0.6 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 4acc1edc-8f27-4d40-9c1e-5b7851bf1882))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 4acc1edc-8f27-4d40-9c1e-5b7851bf1882))
|
||||
)
|
||||
|
|
|
|||
|
|
@ -33,11 +33,11 @@
|
|||
(fp_line (start 2 1.2) (end -2 1.2)
|
||||
(stroke (width 0.05) (type solid)) (layer "F.Fab") (tstamp 30fb86ac-b90e-4465-b440-1ce7364bfc72))
|
||||
(pad "1" smd rect (at 1.6 -0.475) (size 0.8 0.65) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 7c392bed-ef64-4e68-a4b2-cef494ced79b))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 7c392bed-ef64-4e68-a4b2-cef494ced79b))
|
||||
(pad "2" smd rect (at 1.6 0.475) (size 0.8 0.65) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 50807ac6-6b59-4af7-83e3-f0a527f4b1c0))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 50807ac6-6b59-4af7-83e3-f0a527f4b1c0))
|
||||
(pad "3" smd rect (at -1.6 0) (size 0.8 1.6) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp f0621955-4a9b-4681-b3c2-bef6517009a0))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp f0621955-4a9b-4681-b3c2-bef6517009a0))
|
||||
(zone (net 0) (net_name "") (layer "F.Cu") (tstamp 47a94f57-ad3e-4a99-a660-bbe90d3d6c5c) (hatch edge 0.5)
|
||||
(connect_pads (clearance 0))
|
||||
(min_thickness 0.25) (filled_areas_thickness no)
|
||||
|
|
|
|||
|
|
@ -51,9 +51,9 @@
|
|||
|
||||
(stroke (width 0) (type default)) (fill solid) (layer "F.Fab") (tstamp 899e0c33-d929-49d0-8f8b-64d75287fb01))
|
||||
(pad "FEED" smd rect (at 3 0) (size 1.25 1.61) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 3b6e9a28-38f3-46f5-9589-a561707dd309))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 3b6e9a28-38f3-46f5-9589-a561707dd309))
|
||||
(pad "GND" smd rect (at -3 0) (size 1.25 1.61) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 1d165357-1f66-4868-9b44-0f0d561a87d8))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 1d165357-1f66-4868-9b44-0f0d561a87d8))
|
||||
(zone (net 0) (net_name "") (layer "F.Cu") (tstamp 1ffe7c06-22bc-47ab-a270-c70095739e36) (hatch edge 0.5)
|
||||
(connect_pads (clearance 0))
|
||||
(min_thickness 0.25) (filled_areas_thickness no)
|
||||
|
|
|
|||
|
|
@ -953,207 +953,207 @@
|
|||
|
||||
(stroke (width 0) (type default)) (fill solid) (layer "F.Fab") (tstamp aa37cda2-2b13-49d8-bdff-26ed612c59e8))
|
||||
(pad "1" smd rect (at -7.15 7.45 90) (size 1.52 0.85) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp d2e282ef-95ca-4f6f-be42-9924c17397df))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp d2e282ef-95ca-4f6f-be42-9924c17397df))
|
||||
(pad "2" smd rect (at -6.05 7.45 90) (size 1.52 0.85) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 8abfdeff-2cb6-480b-86ac-5131f827937a))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 8abfdeff-2cb6-480b-86ac-5131f827937a))
|
||||
(pad "3" smd rect (at -4.95 7.45 90) (size 1.52 0.85) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 09e9336f-64cc-428d-8308-877eedf8e62b))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 09e9336f-64cc-428d-8308-877eedf8e62b))
|
||||
(pad "4" smd rect (at -3.85 7.45 90) (size 1.52 0.85) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 8867e773-266f-4fff-b472-a1e19c41ba8f))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 8867e773-266f-4fff-b472-a1e19c41ba8f))
|
||||
(pad "5" smd rect (at -2.75 7.45 90) (size 1.52 0.85) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 7d1f78fa-fbc6-464c-8c13-8beecd7d0316))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 7d1f78fa-fbc6-464c-8c13-8beecd7d0316))
|
||||
(pad "6" smd rect (at -1.65 7.45 90) (size 1.52 0.85) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 92cc6387-a537-4960-8695-1a7b0f4ae765))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 92cc6387-a537-4960-8695-1a7b0f4ae765))
|
||||
(pad "7" smd rect (at -0.55 7.45 90) (size 1.52 0.85) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp e96acd8e-4b99-4ad0-98da-5dc8d39f6bdb))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp e96acd8e-4b99-4ad0-98da-5dc8d39f6bdb))
|
||||
(pad "8" smd rect (at 0.55 7.45 90) (size 1.52 0.85) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 83383a44-9ed2-4b7b-a5bf-6df5c7f6cbac))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 83383a44-9ed2-4b7b-a5bf-6df5c7f6cbac))
|
||||
(pad "9" smd rect (at 1.65 7.45 90) (size 1.52 0.85) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp c68eb7db-a2fb-41b5-a7f8-b25c455df435))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp c68eb7db-a2fb-41b5-a7f8-b25c455df435))
|
||||
(pad "10" smd rect (at 2.75 7.45 90) (size 1.52 0.85) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 360b86bd-b8e2-4a91-a351-657d8549aa21))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 360b86bd-b8e2-4a91-a351-657d8549aa21))
|
||||
(pad "11" smd rect (at 3.85 7.45 90) (size 1.52 0.85) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 8526b0a7-17aa-4c5d-b6f5-527143858a83))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 8526b0a7-17aa-4c5d-b6f5-527143858a83))
|
||||
(pad "12" smd rect (at 4.95 7.45 90) (size 1.52 0.85) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp a7396768-8915-483b-91f3-123336565d7c))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp a7396768-8915-483b-91f3-123336565d7c))
|
||||
(pad "13" smd rect (at 6.05 7.45 90) (size 1.52 0.85) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp b895fab3-eca7-4295-932f-3f72876e8429))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp b895fab3-eca7-4295-932f-3f72876e8429))
|
||||
(pad "14" smd rect (at 7.15 7.45 90) (size 1.52 0.85) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp dda84e4c-4957-4b34-a277-72003329cb66))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp dda84e4c-4957-4b34-a277-72003329cb66))
|
||||
(pad "15" smd rect (at 9.95 6.6) (size 1.52 0.85) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 7be4417f-0404-4fc0-a9b4-df4d94a3c9eb))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 7be4417f-0404-4fc0-a9b4-df4d94a3c9eb))
|
||||
(pad "16" smd rect (at 9.95 5.5) (size 1.52 0.85) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp f681d5d1-13f3-44df-a38e-90fbbcb1176b))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp f681d5d1-13f3-44df-a38e-90fbbcb1176b))
|
||||
(pad "17" smd rect (at 9.95 4.4) (size 1.52 0.85) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 0a6461e6-9387-4e5f-98da-2e1da3f87245))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 0a6461e6-9387-4e5f-98da-2e1da3f87245))
|
||||
(pad "18" smd rect (at 9.95 3.3) (size 1.52 0.85) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 0cac4072-8648-4ae7-80fe-d3b5beead170))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 0cac4072-8648-4ae7-80fe-d3b5beead170))
|
||||
(pad "19" smd rect (at 9.95 2.2) (size 1.52 0.85) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 10491fa4-9a0d-4344-b14b-c7f25f939835))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 10491fa4-9a0d-4344-b14b-c7f25f939835))
|
||||
(pad "20" smd rect (at 9.95 1.1) (size 1.52 0.85) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp a0dca434-890a-4347-aa5b-94260cd6ed89))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp a0dca434-890a-4347-aa5b-94260cd6ed89))
|
||||
(pad "21" smd rect (at 9.95 0) (size 1.52 0.85) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 86b95a9f-e09f-4c86-9bca-301dec60350a))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 86b95a9f-e09f-4c86-9bca-301dec60350a))
|
||||
(pad "22" smd rect (at 9.95 -1.1) (size 1.52 0.85) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 4ac70a02-7dbc-4859-b2d6-5e85b9c60ad9))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 4ac70a02-7dbc-4859-b2d6-5e85b9c60ad9))
|
||||
(pad "23" smd rect (at 9.95 -2.2) (size 1.52 0.85) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 714a80e3-634c-4280-9519-4b554d920032))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 714a80e3-634c-4280-9519-4b554d920032))
|
||||
(pad "24" smd rect (at 9.95 -3.3) (size 1.52 0.85) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp b8d29d66-9755-4b4d-94c4-315bc7ce52ac))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp b8d29d66-9755-4b4d-94c4-315bc7ce52ac))
|
||||
(pad "25" smd rect (at 9.95 -4.4) (size 1.52 0.85) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 81a503aa-a3af-4a46-94fd-8b672960ab63))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 81a503aa-a3af-4a46-94fd-8b672960ab63))
|
||||
(pad "26" smd rect (at 9.95 -5.5) (size 1.52 0.85) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 4950c7b2-42b7-4462-848d-2e8eb01cfd71))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 4950c7b2-42b7-4462-848d-2e8eb01cfd71))
|
||||
(pad "27" smd rect (at 9.95 -6.6) (size 1.52 0.85) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 7f3f92f7-1990-4545-b759-646abfc4fd0a))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 7f3f92f7-1990-4545-b759-646abfc4fd0a))
|
||||
(pad "28" smd rect (at 7.15 -7.45 270) (size 1.52 0.85) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp ea056d45-e926-450b-9bb4-8d42be4b5d59))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp ea056d45-e926-450b-9bb4-8d42be4b5d59))
|
||||
(pad "29" smd rect (at 6.05 -7.45 270) (size 1.52 0.85) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp ba29b404-d1f1-4416-b432-b2fbfce61a85))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp ba29b404-d1f1-4416-b432-b2fbfce61a85))
|
||||
(pad "30" smd rect (at 4.95 -7.45 270) (size 1.52 0.85) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 42dae952-dc6a-4014-88fe-b430036128e3))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 42dae952-dc6a-4014-88fe-b430036128e3))
|
||||
(pad "31" smd rect (at 3.85 -7.45 270) (size 1.52 0.85) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 4a722aec-d415-4607-a3f5-fa2cf066ccba))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 4a722aec-d415-4607-a3f5-fa2cf066ccba))
|
||||
(pad "32" smd rect (at 2.75 -7.45 270) (size 1.52 0.85) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 402bbb31-1b93-4d9f-b0fc-49ad3441bd09))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 402bbb31-1b93-4d9f-b0fc-49ad3441bd09))
|
||||
(pad "33" smd rect (at 1.65 -7.45 270) (size 1.52 0.85) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 7b751acf-50fc-4d1b-9ba8-ab9032f19608))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 7b751acf-50fc-4d1b-9ba8-ab9032f19608))
|
||||
(pad "34" smd rect (at 0.55 -7.45 270) (size 1.52 0.85) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp f3b45d3f-175a-4e3e-a988-76cea00a2aa1))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp f3b45d3f-175a-4e3e-a988-76cea00a2aa1))
|
||||
(pad "35" smd rect (at -0.55 -7.45 270) (size 1.52 0.85) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 834b2bfe-3a3b-4816-a239-3d5ec6f6674e))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 834b2bfe-3a3b-4816-a239-3d5ec6f6674e))
|
||||
(pad "36" smd rect (at -1.65 -7.45 270) (size 1.52 0.85) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp fb7649d5-5a72-4163-acde-3b38f7442eed))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp fb7649d5-5a72-4163-acde-3b38f7442eed))
|
||||
(pad "37" smd rect (at -2.75 -7.45 270) (size 1.52 0.85) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp a1fa4b2e-1a17-4f44-b761-bd96b193c5ae))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp a1fa4b2e-1a17-4f44-b761-bd96b193c5ae))
|
||||
(pad "38" smd rect (at -3.85 -7.45 270) (size 1.52 0.85) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp e2b87a18-c608-42af-af10-2dfce0369b07))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp e2b87a18-c608-42af-af10-2dfce0369b07))
|
||||
(pad "39" smd rect (at -4.95 -7.45 270) (size 1.52 0.85) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp d2a6ffb2-2761-41dc-873f-145749684bba))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp d2a6ffb2-2761-41dc-873f-145749684bba))
|
||||
(pad "40" smd rect (at -6.05 -7.45 270) (size 1.52 0.85) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 7595a785-7e17-4593-ac22-0e91614dc8cb))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 7595a785-7e17-4593-ac22-0e91614dc8cb))
|
||||
(pad "41" smd rect (at -7.15 -7.45 270) (size 1.52 0.85) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 8fcec758-cccd-4c98-ac16-def5d04674a6))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 8fcec758-cccd-4c98-ac16-def5d04674a6))
|
||||
(pad "42" smd rect (at -9.95 -6.6 180) (size 1.52 0.85) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp eb7f50d8-b618-4fda-b591-d2948db467c5))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp eb7f50d8-b618-4fda-b591-d2948db467c5))
|
||||
(pad "43" smd rect (at -9.95 -5.5 180) (size 1.52 0.85) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 739412ba-2a8a-4c29-90b8-6e36f4aebb7e))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 739412ba-2a8a-4c29-90b8-6e36f4aebb7e))
|
||||
(pad "44" smd rect (at -9.95 -4.4 180) (size 1.52 0.85) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 456391d3-7e5f-45a3-b93e-1fd447131730))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 456391d3-7e5f-45a3-b93e-1fd447131730))
|
||||
(pad "45" smd rect (at -9.95 -3.3 180) (size 1.52 0.85) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 5dd13951-b717-4827-abb5-4ff41fef8e73))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 5dd13951-b717-4827-abb5-4ff41fef8e73))
|
||||
(pad "46" smd rect (at -9.95 -2.2 180) (size 1.52 0.85) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 95db2302-52d6-4659-88e3-a3d643720626))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 95db2302-52d6-4659-88e3-a3d643720626))
|
||||
(pad "47" smd rect (at -9.95 -1.1 180) (size 1.52 0.85) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 89410fae-d369-465d-b4a6-252c82bcd436))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 89410fae-d369-465d-b4a6-252c82bcd436))
|
||||
(pad "48" smd rect (at -9.95 0 180) (size 1.52 0.85) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 8002dae3-2b96-44da-89d7-6fa2f27c19aa))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 8002dae3-2b96-44da-89d7-6fa2f27c19aa))
|
||||
(pad "49" smd rect (at -9.95 1.1 180) (size 1.52 0.85) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp f53a098e-cf70-40bd-bf64-fd621f3be119))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp f53a098e-cf70-40bd-bf64-fd621f3be119))
|
||||
(pad "50" smd rect (at -9.95 2.2 180) (size 1.52 0.85) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp f6bb6667-db7f-48a6-a37c-b821610c2b7f))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp f6bb6667-db7f-48a6-a37c-b821610c2b7f))
|
||||
(pad "51" smd rect (at -9.95 3.3 180) (size 1.52 0.85) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 77ec6058-32f7-4fa7-a15c-fc3193b10032))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 77ec6058-32f7-4fa7-a15c-fc3193b10032))
|
||||
(pad "52" smd rect (at -9.95 4.4 180) (size 1.52 0.85) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 98705b15-fd41-4fab-ae27-8ce514bfc47f))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 98705b15-fd41-4fab-ae27-8ce514bfc47f))
|
||||
(pad "53" smd rect (at -9.95 5.5 180) (size 1.52 0.85) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp a373f13a-6836-4ec0-92ab-6bbe9e79aefa))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp a373f13a-6836-4ec0-92ab-6bbe9e79aefa))
|
||||
(pad "54" smd rect (at -9.95 6.6 180) (size 1.52 0.85) (layers "F.Cu" "F.Paste" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 49348152-1d34-4dbd-a401-099e6ef9e7e3))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 49348152-1d34-4dbd-a401-099e6ef9e7e3))
|
||||
(pad "55" smd rect (at -1.05 1.05) (size 1.1 1.1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 6a7b46d6-04d6-44e8-8dff-4ef30ee5bd2a))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 6a7b46d6-04d6-44e8-8dff-4ef30ee5bd2a))
|
||||
(pad "56" smd rect (at -3.15 1.05) (size 1.1 1.1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp f92272e3-5462-4fac-8c20-6adc8a2fc4de))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp f92272e3-5462-4fac-8c20-6adc8a2fc4de))
|
||||
(pad "57" smd rect (at -5.25 1.05) (size 1.1 1.1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 7e16bfd5-8c17-4afd-86da-79d81cd87d4c))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 7e16bfd5-8c17-4afd-86da-79d81cd87d4c))
|
||||
(pad "58" smd rect (at -7.35 1.05) (size 1.1 1.1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 120ba20b-c92b-4d5c-9290-0fb43a4a7ebb))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 120ba20b-c92b-4d5c-9290-0fb43a4a7ebb))
|
||||
(pad "59" smd rect (at -1.05 3.1) (size 1.1 1.1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 239547ca-af41-4060-a6c2-9fb2f755dbc4))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 239547ca-af41-4060-a6c2-9fb2f755dbc4))
|
||||
(pad "60" smd rect (at -3.15 3.1) (size 1.1 1.1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 1f615999-551e-47ab-8386-a7517e10328e))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 1f615999-551e-47ab-8386-a7517e10328e))
|
||||
(pad "61" smd rect (at -5.25 3.1) (size 1.1 1.1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp eb57b514-378d-4fd8-aae5-d447bde16af4))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp eb57b514-378d-4fd8-aae5-d447bde16af4))
|
||||
(pad "62" smd rect (at -7.35 3.1) (size 1.1 1.1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 7e7fd5f9-2646-4676-be2c-483669e724aa))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 7e7fd5f9-2646-4676-be2c-483669e724aa))
|
||||
(pad "63" smd rect (at -1.05 5.15) (size 1.1 1.1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp c317b7e4-f8b8-4454-b6db-532e9ff4f428))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp c317b7e4-f8b8-4454-b6db-532e9ff4f428))
|
||||
(pad "64" smd rect (at -3.15 5.15) (size 1.1 1.1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp a5405289-3671-47d1-ab63-d43f8aed214d))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp a5405289-3671-47d1-ab63-d43f8aed214d))
|
||||
(pad "65" smd rect (at -5.25 5.15) (size 1.1 1.1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp e084c356-0ee1-409f-b225-91ffd7829b99))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp e084c356-0ee1-409f-b225-91ffd7829b99))
|
||||
(pad "66" smd rect (at -7.35 5.15) (size 1.1 1.1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp fa3bfe77-be7f-4309-8e4c-bbcaa28868e6))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp fa3bfe77-be7f-4309-8e4c-bbcaa28868e6))
|
||||
(pad "67" smd rect (at -1.05 -5.15) (size 1.1 1.1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 42060ad7-4af2-4c12-988b-b70ebcacb6f3))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 42060ad7-4af2-4c12-988b-b70ebcacb6f3))
|
||||
(pad "68" smd rect (at -3.15 -5.15) (size 1.1 1.1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 92290a7f-998e-4ab2-9a18-22c071fe4262))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 92290a7f-998e-4ab2-9a18-22c071fe4262))
|
||||
(pad "69" smd rect (at -5.25 -5.15) (size 1.1 1.1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp bb63f10c-f682-4950-baec-31d1c54f137e))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp bb63f10c-f682-4950-baec-31d1c54f137e))
|
||||
(pad "70" smd rect (at -7.35 -5.15) (size 1.1 1.1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp f3047a4b-ea3f-4de0-ad91-e51420eaa312))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp f3047a4b-ea3f-4de0-ad91-e51420eaa312))
|
||||
(pad "71" smd rect (at -1.05 -3.1) (size 1.1 1.1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 6b40bd5c-b51a-458f-8c99-84c5a56444ee))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 6b40bd5c-b51a-458f-8c99-84c5a56444ee))
|
||||
(pad "72" smd rect (at -3.15 -3.1) (size 1.1 1.1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp d87a8a3d-cc90-4ed0-a551-637b1a8db73c))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp d87a8a3d-cc90-4ed0-a551-637b1a8db73c))
|
||||
(pad "73" smd rect (at -5.25 -3.1) (size 1.1 1.1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp d3ea4880-d828-46e7-8db3-623d8c20b49a))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp d3ea4880-d828-46e7-8db3-623d8c20b49a))
|
||||
(pad "74" smd rect (at -7.35 -3.1) (size 1.1 1.1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 858358b6-cda8-430b-b2f6-21523e158f70))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 858358b6-cda8-430b-b2f6-21523e158f70))
|
||||
(pad "75" smd rect (at -1.05 -1.05) (size 1.1 1.1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 40224967-fd29-4c96-a114-ac2835bd4df1))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 40224967-fd29-4c96-a114-ac2835bd4df1))
|
||||
(pad "76" smd rect (at -3.15 -1.05) (size 1.1 1.1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp c215b19a-e4a1-4544-b821-f1c403660507))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp c215b19a-e4a1-4544-b821-f1c403660507))
|
||||
(pad "77" smd rect (at -5.25 -1.05) (size 1.1 1.1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 6d82a167-a852-4ddd-9cd8-c351a94a88cf))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 6d82a167-a852-4ddd-9cd8-c351a94a88cf))
|
||||
(pad "78" smd rect (at -7.35 -1.05) (size 1.1 1.1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp c6ec2c39-bd8b-48d6-a85b-23abc95c0dec))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp c6ec2c39-bd8b-48d6-a85b-23abc95c0dec))
|
||||
(pad "79" smd rect (at 1.05 -1.05 180) (size 1.1 1.1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp ba293d1d-dc89-4b33-ba9e-6aad9f2e22c7))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp ba293d1d-dc89-4b33-ba9e-6aad9f2e22c7))
|
||||
(pad "80" smd rect (at 3.15 -1.05 180) (size 1.1 1.1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 563d6aea-eeed-4ba7-9d0c-0722fa3248c3))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 563d6aea-eeed-4ba7-9d0c-0722fa3248c3))
|
||||
(pad "81" smd rect (at 5.25 -1.05 180) (size 1.1 1.1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 415ab30f-2c29-43b4-a641-91b22f1ac6d1))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 415ab30f-2c29-43b4-a641-91b22f1ac6d1))
|
||||
(pad "82" smd rect (at 7.35 -1.05 180) (size 1.1 1.1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp f3c520a0-4296-4819-bff3-5ee084274abe))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp f3c520a0-4296-4819-bff3-5ee084274abe))
|
||||
(pad "83" smd rect (at 1.05 -3.1 180) (size 1.1 1.1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp c6c6f7e9-3a46-499b-ab79-6881f926b5f1))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp c6c6f7e9-3a46-499b-ab79-6881f926b5f1))
|
||||
(pad "84" smd rect (at 3.15 -3.1 180) (size 1.1 1.1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 17fd9c06-e672-4b03-95c9-543f01944326))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 17fd9c06-e672-4b03-95c9-543f01944326))
|
||||
(pad "85" smd rect (at 5.25 -3.1 180) (size 1.1 1.1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 2758d685-2a6e-4711-8a72-5ad805d2f7b8))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 2758d685-2a6e-4711-8a72-5ad805d2f7b8))
|
||||
(pad "86" smd rect (at 7.35 -3.1 180) (size 1.1 1.1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 812a7f19-0791-4591-bf8d-fd6c9600b007))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 812a7f19-0791-4591-bf8d-fd6c9600b007))
|
||||
(pad "87" smd rect (at 1.05 -5.15 180) (size 1.1 1.1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 695209b1-8a7e-4a7d-9c9a-3c5e1a645d95))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 695209b1-8a7e-4a7d-9c9a-3c5e1a645d95))
|
||||
(pad "88" smd rect (at 3.15 -5.15 180) (size 1.1 1.1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp c4b03d73-99da-4816-8bd9-68a10a709d71))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp c4b03d73-99da-4816-8bd9-68a10a709d71))
|
||||
(pad "89" smd rect (at 5.25 -5.15 180) (size 1.1 1.1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp fafbeaea-627c-4a4c-9a14-b6a5aaaa0646))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp fafbeaea-627c-4a4c-9a14-b6a5aaaa0646))
|
||||
(pad "90" smd rect (at 7.35 -5.15 180) (size 1.1 1.1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 0bfa7e63-40a7-4a89-9f55-ec95da3f174a))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 0bfa7e63-40a7-4a89-9f55-ec95da3f174a))
|
||||
(pad "91" smd rect (at 1.05 5.15 180) (size 1.1 1.1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 9f065c31-2e92-4d3c-beaa-a862219c6e2a))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 9f065c31-2e92-4d3c-beaa-a862219c6e2a))
|
||||
(pad "92" smd rect (at 3.15 5.15 180) (size 1.1 1.1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp d665b09e-b6d2-43e1-b068-346565836c8f))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp d665b09e-b6d2-43e1-b068-346565836c8f))
|
||||
(pad "93" smd rect (at 5.25 5.15 180) (size 1.1 1.1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 221a165d-8cdd-4f35-9da7-8a1b6d2a186a))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 221a165d-8cdd-4f35-9da7-8a1b6d2a186a))
|
||||
(pad "94" smd rect (at 7.35 5.15 180) (size 1.1 1.1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp daa7b971-9261-4774-932a-c5b1dad52520))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp daa7b971-9261-4774-932a-c5b1dad52520))
|
||||
(pad "95" smd rect (at 1.05 3.1 180) (size 1.1 1.1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp ed9692ab-9a31-4971-9164-b1c9527ecce9))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp ed9692ab-9a31-4971-9164-b1c9527ecce9))
|
||||
(pad "96" smd rect (at 3.15 3.1 180) (size 1.1 1.1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 21a62ed4-801d-4018-98df-361c3699bf36))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 21a62ed4-801d-4018-98df-361c3699bf36))
|
||||
(pad "97" smd rect (at 5.25 3.1 180) (size 1.1 1.1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 3d63d5af-2037-4551-ba9b-3da51a7a5756))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 3d63d5af-2037-4551-ba9b-3da51a7a5756))
|
||||
(pad "98" smd rect (at 7.35 3.1 180) (size 1.1 1.1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp e57e0f76-b278-456e-992a-8a618bbe4bc4))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp e57e0f76-b278-456e-992a-8a618bbe4bc4))
|
||||
(pad "99" smd rect (at 1.05 1.05 180) (size 1.1 1.1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp a8aa2063-5031-47a5-9e67-d067df9af78e))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp a8aa2063-5031-47a5-9e67-d067df9af78e))
|
||||
(pad "100" smd rect (at 3.15 1.05 180) (size 1.1 1.1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp f5cbb6dd-8063-4611-b32e-99495cd8b4ae))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp f5cbb6dd-8063-4611-b32e-99495cd8b4ae))
|
||||
(pad "101" smd rect (at 5.25 1.05 180) (size 1.1 1.1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 2210b076-f99c-451c-8dc1-b166d9a26ba8))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 2210b076-f99c-451c-8dc1-b166d9a26ba8))
|
||||
(pad "102" smd rect (at 7.35 1.05 180) (size 1.1 1.1) (layers "F.Cu" "F.Mask")
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 45) (tstamp 5d35bd81-b045-452a-a5b2-0c94edffa656))
|
||||
(solder_mask_margin 0.1016) (thermal_bridge_angle 0) (tstamp 5d35bd81-b045-452a-a5b2-0c94edffa656))
|
||||
)
|
||||
|
|
|
|||
Loading…
Reference in New Issue