* Complete encapsulation of the MODULE class.
* Complete encapsulation of the EDA_TEXT class.
* Encapsulate most of the ZONE_CONTAINER class.
* Add pcbcommon library as a dependency for reSWIGging the scripting
support. This should cover most dependency cases.
their type, by using the more abstract PLUGIN::Footprint*() functions.
This is an intermediate phase only, other changes will be necessary as library table support comes in.
Encapsulate usage of library path searching, since that will go away as library table support comes in.
Add FOOTPRINT_EDIT_FRAME::{get,set}LibPath() and FOOTPRINT_EDIT_FRAME::{get,set}LibNickName() functions
to provide this encapsulation.
This required the additional compiler command line option "-std=c++0x".
2) Switch to unique_ptr from auto_ptr which is C++ deprecated.
3) Change to new English layer names per mailing list discussion, see class_board.cpp.
4) When saving to *.kicad_pcb or *.kicad_mod, identify opportunities to use wildcard
layer sets, for pads so far.
5) Switch to two std::string hashtables in pcb_parser.cpp, away from one wxString based one
for layer names and layer sets mapping. One hashtable holds the mask, the other the index.
Layer sets are only in the mask table.
6) Move "LOCALE_IO toggle" into PCB_IO::Format() since it is a public API function and
caller should find it as convenient as possible to use. LOCALE_IO should handle
nesting OK in the case where public Format() is called from one of the Footprint*()
functions.
7) Drop support for "export module to new library". Creating new libraries will have to
be handled in concert with library table entries, and we've talked recently about
creating a better footprint library manager, one that resides in a DLL/DSO. So
this kind of functionality needs to be handled in there in the near future.
8) Change name of exported PCB_IO module/footprint to *.kicad_mod and not *.emp.
pad and via sizes from those settings when diameter is not given
in the local object. Calculation algorithms are inferred from the
UI help of the Eagle program.
For edge connector type of footprints, some copper pads can be on the
back side even within packages.
Flipping of packages to back was not being done correctly, but I think this
is working now.
There are still remaining issues with text positioning that I am working on.
* Derive the pcbnew copper zone and non-copper zone dialog windows from DIAG_SHIM,
which injects some template code.
* Update UIpolicies.txt to talk about DIALOG_SHIM support.
* Add zone support to eagle_plugin.
* Organize ZONE_CONTAINER class declaration for future privacy and accessors.
Wayne Stambaugh
Dick Hollenbeck
jean-pierre charras
Lorenzo Marcantonio