- SEGVIA becomes VIA
- Drill size moved from TRACK to VIA
- Removed shape from TRACK, becomes ViaType in VIA
- GetTrace becomes GetTrack, for uniformity
- Some minor constification and typo fixes
*) add hotkey for setting the grid origin as 'S', in board editor, module editor.
*) re-position the function interface for cursor movement from BASE_SCREEN into
class EDA_DRAW_FRAME. This is a prelude to getting rid of BASE_SCREEN or
splitting it up.
* All items shapes are converted to polygons.
* Polygons are merged layer by layer (for calculation time reasons,zones are not merged)
* for copper layers, vias and pads holes are substracted from polygons (but, for calculation time reasons, not inside zones areas).
* the look is better, mainly when displaying the copper thickness
* solder and paste layers are now shown in 3D viewer.
* the code was seriously cleaned (but still needs to be enhanced).
* Note this is a work in progress which needs refinements.
* Complete encapsulation of the MODULE class.
* Complete encapsulation of the EDA_TEXT class.
* Encapsulate most of the ZONE_CONTAINER class.
* Add pcbcommon library as a dependency for reSWIGging the scripting
support. This should cover most dependency cases.
jean-pierre charras
Tomasz Wlostowski
Lorenzo Marcantonio
Dick Hollenbeck
Wayne Stambaugh
Heikki Pulkkinen
Marco Mattila