Commit Graph

16 Commits

Author SHA1 Message Date
Jeff Young 1aad2fb37b Change via keep-start-end to be start/end, not top/bottom.
The implementation used to always check F_Cu and B_Cu, rather than
where the via started and ended (which will be different for blind/
buried vias and microvias).
2022-11-23 21:37:50 +00:00
jean-pierre charras b791fff963 DIALOG_UNUSED_PAD_LAYERS: minor enhancement: pads and vias can be handled all at once 2022-09-03 10:41:14 +02:00
Jeff Young c3552a940a Make sure standard OK/Cancel buttons respond to current language.
Fixes https://gitlab.com/kicad/code/kicad/issues/9635
2021-12-24 18:13:11 +00:00
Jeff Young 096e342386 Prefix TRACK, ARC and VIA. 2021-06-11 22:07:02 +01:00
Ian McInerney 4f05262705 Cleanup includes in board.h and footprint.h 2021-06-03 20:19:52 +01:00
Jon Evans 18037e2f65 Rework bitmap system to load from archived PNGs
Bitmaps are now identified by an enum class instead of by pointers.
Bitmap loading and caching is now handled by a class in common, and
we no longer compile most bitmaps into the binary, so there is no
longer a bitmaps static library.

Instead, bitmaps are archived to a .tar.gz file which is installed
in ${KICAD_DATA}/resources/images.tar.gz

The source PNGs are checked in to Git as the original CPP files were,
so that people can build without the required dependencies to convert
SVGs to PNGs.

Initial support is also added for dark theme icons, although this
is not yet exposed in the GUI.

Stubs are present for multi-resolution image resources, but this is
not fully-baked yet and could use some refinement.
2021-03-11 08:37:35 -05:00
jean-pierre charras d738c91dd7 minor fix in DIALOG_SYMBOL_PROPERTIES: make m_cbPreservePads ON the default
Keep Through Hole pads on external layers should be ON by default, because
such a pad does not allow soldering/unsoldering, if this option this option is OFF
Also rename dialog_enum_pads.fbp as dialog_enum_pads_base.fbp, as usual
2021-02-10 12:47:11 +01:00
Jeff Young ad8136541b Improve layout and terminology of Remove Unused Pads.
Also removes the limitation of removing outside layers for pads.
It's already supported in Pad Properties so it's odd to not support
it here.
2021-01-07 01:27:12 +00:00
Jeff Young acfbcb4beb Make distinction between PCBNew-wide tools and Board-specific tools.
The old names were really hard to keep straight (even for me, who named
many of them).
2020-12-16 13:32:46 +00:00
Jeff Young a207bd97bb Naming conventions. 2020-11-17 16:05:49 +00:00
Jeff Young bdbb68f813 MODULE -> FOOTPRINT. 2020-11-13 16:04:03 +00:00
Jeff Young 3451ac3088 PCB_MODULE_T -> PCB_FOOTPRINT_T 2020-11-13 15:16:24 +00:00
Jeff Young 52a46341db More module -> footprint. 2020-11-13 15:16:24 +00:00
Jeff Young f5443de7f9 D_PAD -> PAD. 2020-11-13 15:16:24 +00:00
Jeff Young 84dd5108ba Remove some "class_" prefixes from files. 2020-11-13 15:16:23 +00:00
Seth Hillbrand 5fc6b74c89 ADDED: Remove unused pads
This option removes copper layers from pads and vias where they are not
connected to other board elements.  This allows the inner layers to be
more closely routed if the via landing pad is not needed.

Fixes https://gitlab.com/kicad/code/kicad/issues/1835
2020-08-10 03:27:26 +00:00