Property is a pad info used mainly for fabrication or test.
Currently, supported properties are:
BGA property (variant of SMD pad)
Fiducial (global to the board or local to the footprint)
Test Point
Heat sink
Castellated.
And are used in Gerber files (copper layers and drill files)
Increment BOARD_FILE_VERSION to 20200104
The aperture option created a Connector pad only on the paste layer.
This is incorrect: the SMD type only is acceptable.
5connector is *only* for edge card connectors.
Moreover, The dialog did not even accept the setting defined by this dialog...
The thermal spokes are anchored at the pad anchor. They may or may
not make sense, depending on the pad shape. It's up to the author
to move the anchor around as necessary or to not use thermals.
Allows 0 to 4 chamfered corners, not only one.
A custom shape allow this kind of shape. However because it is a primitive,
it is easier to edit and it support thermal reliefs.
The standard DIM() macro was not typesafe as it happily deferred errors
to runtime that can be caught at compile time. Replacing it with a
generic C++11 constexpr allows for typecasting, comparison and compile
time error checking.
When designing pads, it can be helpful to not only see the resulting
rounded rectangle radius from a given percentage but also to set it,
constraining the related percentage. This adjusts the dialog to allow
editing the rounded rectangle corner radius. It does not change the
file format as the resulting ratio is saved. Further updates of the pad
size or ratio will modify the radius.
Fixes: lp:1668020
* https://bugs.launchpad.net/kicad/+bug/1668020
Also fixes a bug where nets wouldn't get changed because the
pads weren't changed and so the pad nets would propagate and
wipe out the changed nets on the tracks.
Also includes warning dialogs that pad nets will be changed if the
track nets are.
Fixes: lp:1779854
* https://bugs.launchpad.net/kicad/+bug/1779854
Well, almost anyway. We can't use a pad attribute for them as
that would change the file format. So they're currently
defined as a CONN pad with no copper layers.
However, when figuring out of existing pads should be *treated*
as aperture pads, we just check for no copper layers.
Fixes: lp:1781760
* https://bugs.launchpad.net/kicad/+bug/1781760
... and GetMsgPanelInfo.
Step 4 in the g_UserUnit eradication effort.
Also removes a couple of conversion routines that were close
enough to extinction.
(cherry picked from commit c75da51)
Footprint properties dialogs: add test for negative net clearance, similar to the Pad properties dialog test.
Add also a info message in dialogs, to avoid mistakes when setting the local clearances.