2) Change from legacy Cu stack to counting down from top=(F_Cu or 0).
The old Cu stack required knowing the count of Cu layers to make
sense of the layer number when converting to many exported file types.
The new Cu stack is more commonly used, although ours still gives
B_Cu a fixed number.
3) Introduce class LSET and enum LAYER_ID.
4) Change *.kicad_pcb file format version to 4 from 3.
5) Change fixed names Inner1_Cu-Inner14_Cu to In1_Cu-In30_Cu and their
meanings are typically flipped.
6) Moved the #define LAYER_N_* stuff into legacy_plugin.cpp where they
can die a quiet death, and switch to enum LAYER_ID symbols throughout.
7) Removed the LEGACY_PLUGIN::Save() and FootprintSave() functions.
You will need to convert to the format immediately, *.kicad_pcb and
*.kicad_mod (=pretty) since legacy format was never going to know
about 32 Cu layers and additional technical layers and the reversed Cu
stack.
* Use FPID instead of wxString in MODULE object.
* Use FPID instead of wxString when loading and saving files.
* Use FPID in COMPONENT object.
* Add wxString helper functions and comparison operators to FPID.
* Add fp_lib token to pcb and netlist file formats.
* Add code to load and save FPIDs to pcb file format.
* Fix segfault when deleting invalid footprint library tables in Pcbnew
in non footprint library table build.
* Fix bug when counting the number of mod files in
EDA_APP::SetFootprintLibTablePath();
* Encapsulate most of the MODULE class.
* Start encapsulating the DIMENSION class.
* Lay some groundwork for EDA_TEXT encapsulation.
* Move cleverly hidden MODULE functions into class_module.cpp.
* Use std::swap to exchange TEXTE_PCB values for undo/redo.
* Remove unused members from MODULE class.
* The usual coding policy and documentation fixes.