It's too expensive to fetch the timestamps when the github
server is busy. See Dick Hollenbeck's comments at the top of
github_plugin.cpp for more info.
Also adds some safety to the other caching algorithms after
seeing github_plugin's wild-west usage of the kicad_plugin.
Fixes: lp:1753143
* https://bugs.launchpad.net/kicad/+bug/1753143
A few methods differed by the number or type of arguments in derived
classes. They were changed to match the base class method signature and
marked as 'override'.
Fixes: lp:1698697
https://bugs.launchpad.net/kicad/+bug/1698697
The incorrect method ZONE_CONTAINER::AppendCorner() is also fixed:
It was expecting the corner must be added to the main outline, but this is a false expectation:
it can be added to a hole inside the zone outline.
Removes the need of using the legacy code in polygon/PolyLine.{h,cpp},
refactoring all CPolyLine instances with SHAPE_POLY_SET instances.
The remaining legacy methods have been ported to SHAPE_POLY_SET;
mainly: Chamfer, Fillet, {,Un}Hatch.
The iteration over the polygon vertices have been simplified using the
family of ITERATOR classes.
When attempting to read a pcad file exported from Altium, kicad was
segfaulting because it was trying to access an empty array. This patch
fixes that.
The reason the array was empty was the the board outline in the pcad
file was composed of only arcs and the plugin only processes lines in
the board outline. Adding this functionality is for another patch I
suppose.
Signed-off-by: Clemens Koller <cko@embeon.de>
Make all EDA_TEXT data private and rename accessors to avoid function
name collisions in derived classes.
Overload EDA_TEXT's SetTextAngle() and SetEffects() in TEXTE_PCB.
Add support for preserving Reference text position, size, orientation
during a netlist import into a BOARD, as well as the one off footprint
update dialog.
Rename FPID to LIB_ID as is now used as a generic library identifier and
is no longer specific to footprints.
Remove all mention of footprint from the new LIB_ID doxygen comments and
code.
Rename files fpid.h and fpid.cpp to lib_id.h and lib_id.cpp.
Rename fp_lib_table.keywords file to lib_table.keywords and adjust CMake
build dependencies accordingly.
Update all source files effected by the code and file name changes.
Update .gitignore for file name changes.
2. Whole bunch of pointless casts removed
3. Unused variables removed
4. Fix bug caused by JP on April 25, 2015 where strings were adjusted for translation and the hotkeys section table accidentally swapped the footprint editor title with tag, resulting in "footprint editor" being exported instead of "[footprinteditor]"
No functional changes besides #4, technically it'll "break" imports hotkeys files but April 25 broke imports as well.
PAD_SHAPE_T and PAD_ATTR_T still have a double definition (new names and old names) to be sure python scripts are nor broken by the change.
PAD_DRILL_SHAPE_T does not have a double definition, because it is unlikely oblong holes are used in python scripts.
Double definitions will be removed in the (next) future.
legacy plugin: better compatibility with old brd files (current track width and current vias size, stored in SETUP section, were not read from file and incorrectly set)
2) Change from legacy Cu stack to counting down from top=(F_Cu or 0).
The old Cu stack required knowing the count of Cu layers to make
sense of the layer number when converting to many exported file types.
The new Cu stack is more commonly used, although ours still gives
B_Cu a fixed number.
3) Introduce class LSET and enum LAYER_ID.
4) Change *.kicad_pcb file format version to 4 from 3.
5) Change fixed names Inner1_Cu-Inner14_Cu to In1_Cu-In30_Cu and their
meanings are typically flipped.
6) Moved the #define LAYER_N_* stuff into legacy_plugin.cpp where they
can die a quiet death, and switch to enum LAYER_ID symbols throughout.
7) Removed the LEGACY_PLUGIN::Save() and FootprintSave() functions.
You will need to convert to the format immediately, *.kicad_pcb and
*.kicad_mod (=pretty) since legacy format was never going to know
about 32 Cu layers and additional technical layers and the reversed Cu
stack.