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18 Commits

Author SHA1 Message Date
Seth Hillbrand 10442b98df Unify thickness 
The removal of the pcbnew general section was meant for v6 but passed
the deadline.  This removes the duplication of thickness.  We do not
allow the thickness to be different between nominal and stackup, so
keeping separate text fields is unnecesarily confusing to users
 2021-02-11 11:28:00 -08:00
Dominik Wernberger 07635d2fc7 Minor adjustments 2021-01-12 20:51:31 +00:00
Dominik Wernberger ac94d72d2d Add more const specifiers 2021-01-12 20:51:31 +00:00
Werni 0e44f5128c Add const specifiers 2020-11-18 19:50:36 +00:00
Jeff Young 84dd5108ba Remove some "class_" prefixes from files. 2020-11-13 15:16:23 +00:00
Wayne Stambaugh 188232de6f Pcbnew: add user defined layers and allow all layers to have user names. 
This changes the file format.  All previous copper layers that had a user
defined name are forced back to the canonical name and the user defined
name is stored as an optional quoted string in the layer definition and
only used for UI and plotting purposes.  All copper object layer names
are now the canonical name for internal file use.

ADDED: Nine new user definable non-copper layers that can be optionally
added to the board layer stack.

CHANGED: All board layers can now be renamed by the user.

CHANGED: User defined layer names can now contain space characters.

Fixes https://gitlab.com/kicad/code/kicad/issues/1969
 2020-09-23 15:41:43 -04:00
jean-pierre charras 2d0582daa7 Pcbnew, stack-up manager: allows 2 digits in mantissa for EpsilonR 
Fixes #3942
https://gitlab.com/kicad/code/kicad/issues/3942
 2020-02-26 18:12:24 +01:00
Ian McInerney 00e58cd974 Fix unintialized values (from coverity scan) 2020-01-12 13:00:42 +00:00
jean-pierre charras 544867cf2a ADD: layer stack manager: support of multilayer dielectric between 2 copper layers 
This feature is useful for advanced microwave applications.
This is the last missing feature in the board stackup management.
 2019-11-15 14:33:10 +01:00
jean-pierre charras 2b201487e1 Board stackup manager: prepare code to allow multiple dielectric material by layer. 
For advanced microwave applications, sometime a dielectric between 2 copper layers
must be itself created by a stack of different materials.
 2019-11-12 14:43:47 +01:00
jean-pierre charras d3982d0cb2 board stackup manager: a few enhancements in code and make some strings translatable 2019-09-27 17:12:24 +02:00
jean-pierre charras cd6c1c48a4 Board stackup manager: add material selector to solder mask and silkscreen layers. 2019-09-24 16:30:25 +02:00
jean-pierre charras c3bd9b7b8f Stackup manager: better code. 2019-09-09 17:22:17 +02:00
Jeff Young 83a02e18eb Mac OSX changes for new board stackup panel. 
Fixes: lp:1843033
* https://bugs.launchpad.net/kicad/+bug/1843033
 2019-09-06 23:43:50 +01:00
jean-pierre charras e0c82fb003 Board stack manager: add a basic reporter to copy the current stackup to the clipboard. 2019-09-06 11:26:27 +02:00
jean-pierre charras f3f0e20a67 Pcbnew: add a board layer stack manager 
This is a new feature.
 2019-09-05 18:51:18 +02:00
jean-pierre charras fc2379ca8a Fix some issues in .gbrjob file. 
2 issues are fixed: a missing double quote, and a incorrect handling of unicode chars

Fixes: lp:1836448
https://bugs.launchpad.net/kicad/+bug/1836448
 2019-07-14 10:23:45 +02:00
jean-pierre charras c1eee56785 Prepare changes to support a better board stack management in .gbrjob file. 
In .gbrjob file, one can specify the thickness and color of some layers.
Currently, there is no way to enter these parameters.
This commit prepare a better support of .gbrjob files.
 2019-06-25 18:39:11 +02:00