110 lines
4.9 KiB
Plaintext
110 lines
4.9 KiB
Plaintext
(footprint "W3011" (version 20231007) (generator pcbnew)
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(layer "F.Cu")
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(effects (font (size 0.184 0.184) (thickness 0.016)))
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(effects (font (size 1.27 1.27)))
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(effects (font (size 1.27 1.27)))
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(tstamp f58abdec-a0bc-497b-84c7-b077e420b38b)
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(tstamp 1d639bcb-7bdd-4b68-865e-09225cc61d2a)
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(pad "3" smd rect (at -1.6 0) (size 0.8 1.6) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.1016) (thermal_bridge_angle 0)
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(tstamp 7fc07ea4-7c0f-4080-b30a-376fea48bfb6)
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(connect_pads (clearance 0))
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(min_thickness 0.25) (filled_areas_thickness no)
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(zone (net 0) (net_name "") (layer "F.Cu") (tstamp e16151f4-71e0-4b02-b1f8-857809564296) (hatch edge 0.5)
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(connect_pads (clearance 0))
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(min_thickness 0.25) (filled_areas_thickness no)
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(keepout (tracks not_allowed) (vias not_allowed) (pads not_allowed) (copperpour not_allowed) (footprints allowed))
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(zone (net 0) (net_name "") (layer "B.Cu") (tstamp 8d5f0e28-3938-4953-a61c-93a457c93661) (hatch edge 0.5)
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(connect_pads (clearance 0))
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(keepout (tracks not_allowed) (vias not_allowed) (pads not_allowed) (copperpour not_allowed) (footprints allowed))
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