kicad/3d-viewer/3d_canvas/board_adapter.cpp

746 lines
27 KiB
C++

/*
* This program source code file is part of KiCad, a free EDA CAD application.
*
* Copyright (C) 2015-2022 Mario Luzeiro <mrluzeiro@ua.pt>
* Copyright (C) 1992-2022 KiCad Developers, see AUTHORS.txt for contributors.
*
* This program is free software; you can redistribute it and/or
* modify it under the terms of the GNU General Public License
* as published by the Free Software Foundation; either version 2
* of the License, or (at your option) any later version.
*
* This program is distributed in the hope that it will be useful,
* but WITHOUT ANY WARRANTY; without even the implied warranty of
* MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the
* GNU General Public License for more details.
*
* You should have received a copy of the GNU General Public License
* along with this program; if not, you may find one here:
* http://www.gnu.org/licenses/old-licenses/gpl-2.0.html
* or you may search the http://www.gnu.org website for the version 2 license,
* or you may write to the Free Software Foundation, Inc.,
* 51 Franklin Street, Fifth Floor, Boston, MA 02110-1301, USA
*/
#include "../3d_rendering/camera.h"
#include "board_adapter.h"
#include <board_design_settings.h>
#include <board_stackup_manager/board_stackup.h>
#include <board_stackup_manager/stackup_predefined_prms.h>
#include <3d_rendering/raytracing/shapes2D/polygon_2d.h>
#include <board.h>
#include <dialogs/dialog_color_picker.h>
#include <3d_math.h>
#include "3d_fastmath.h"
#include <geometry/geometry_utils.h>
#include <convert_to_biu.h>
#include <pgm_base.h>
#include <settings/settings_manager.h>
#include <wx/log.h>
#include <advanced_config.h>
#define DEFAULT_BOARD_THICKNESS Millimeter2iu( 1.6 )
#define DEFAULT_COPPER_THICKNESS Millimeter2iu( 0.035 ) // for 35 um
// The solder mask layer (and silkscreen) thickness
#define DEFAULT_TECH_LAYER_THICKNESS Millimeter2iu( 0.025 )
// The solder paste thickness is chosen bigger than the solder mask layer
// to be sure is covers the mask when overlapping.
#define SOLDERPASTE_LAYER_THICKNESS Millimeter2iu( 0.04 )
CUSTOM_COLORS_LIST BOARD_ADAPTER::g_SilkscreenColors;
CUSTOM_COLORS_LIST BOARD_ADAPTER::g_MaskColors;
CUSTOM_COLORS_LIST BOARD_ADAPTER::g_PasteColors;
CUSTOM_COLORS_LIST BOARD_ADAPTER::g_FinishColors;
CUSTOM_COLORS_LIST BOARD_ADAPTER::g_BoardColors;
KIGFX::COLOR4D BOARD_ADAPTER::g_DefaultBackgroundTop;
KIGFX::COLOR4D BOARD_ADAPTER::g_DefaultBackgroundBot;
KIGFX::COLOR4D BOARD_ADAPTER::g_DefaultSilkscreen;
KIGFX::COLOR4D BOARD_ADAPTER::g_DefaultSolderMask;
KIGFX::COLOR4D BOARD_ADAPTER::g_DefaultSolderPaste;
KIGFX::COLOR4D BOARD_ADAPTER::g_DefaultSurfaceFinish;
KIGFX::COLOR4D BOARD_ADAPTER::g_DefaultBoardBody;
// To be used in Raytracing render to create bevels on layer items
float g_BevelThickness3DU = 0.0f;
static bool g_ColorsLoaded = false;
/**
* Trace mask used to enable or disable the trace output of this class.
* The debug output can be turned on by setting the WXTRACE environment variable to
* "KI_TRACE_EDA_CINFO3D_VISU". See the wxWidgets documentation on wxLogTrace for
* more information.
*
* @ingroup trace_env_vars
*/
const wxChar *BOARD_ADAPTER::m_logTrace = wxT( "KI_TRACE_EDA_CINFO3D_VISU" );
BOARD_ADAPTER::BOARD_ADAPTER() :
m_Cfg( nullptr ),
m_IsBoardView( true ),
m_MousewheelPanning( true ),
m_IsPreviewer( false ),
m_board( nullptr ),
m_3dModelManager( nullptr ),
m_renderSettings( nullptr ),
m_colors( nullptr ),
m_layerZcoordTop(),
m_layerZcoordBottom()
{
wxLogTrace( m_logTrace, wxT( "BOARD_ADAPTER::BOARD_ADAPTER" ) );
if( PgmOrNull() )
m_colors = Pgm().GetSettingsManager().GetColorSettings();
m_boardPos = VECTOR2I();
m_boardSize = VECTOR2I();
m_boardCenter = SFVEC3F( 0.0f );
m_boardBoundingBox.Reset();
m_throughHoleIds.Clear();
m_throughHoleOds.Clear();
m_throughHoleAnnularRings.Clear();
m_copperLayersCount = 2;
m_biuTo3Dunits = 1.0;
m_boardBodyThickness3DU = DEFAULT_BOARD_THICKNESS * m_biuTo3Dunits;
m_frontCopperThickness3DU = DEFAULT_COPPER_THICKNESS * m_biuTo3Dunits;
m_backCopperThickness3DU = DEFAULT_COPPER_THICKNESS * m_biuTo3Dunits;
m_nonCopperLayerThickness3DU = DEFAULT_TECH_LAYER_THICKNESS * m_biuTo3Dunits;
m_solderPasteLayerThickness3DU = SOLDERPASTE_LAYER_THICKNESS * m_biuTo3Dunits;
m_trackCount = 0;
m_viaCount = 0;
m_averageViaHoleDiameter = 0.0f;
m_holeCount = 0;
m_averageHoleDiameter = 0.0f;
m_averageTrackWidth = 0.0f;
m_BgColorBot = SFVEC4F( 0.4, 0.4, 0.5, 1.0 );
m_BgColorTop = SFVEC4F( 0.8, 0.8, 0.9, 1.0 );
m_BoardBodyColor = SFVEC4F( 0.4, 0.4, 0.5, 0.9 );
m_SolderMaskColorTop = SFVEC4F( 0.1, 0.2, 0.1, 0.83 );
m_SolderMaskColorBot = SFVEC4F( 0.1, 0.2, 0.1, 0.83 );
m_SolderPasteColor = SFVEC4F( 0.4, 0.4, 0.4, 1.0 );
m_SilkScreenColorTop = SFVEC4F( 0.9, 0.9, 0.9, 1.0 );
m_SilkScreenColorBot = SFVEC4F( 0.9, 0.9, 0.9, 1.0 );
m_CopperColor = SFVEC4F( 0.75, 0.61, 0.23, 1.0 );
m_platedPadsFront = nullptr;
m_platedPadsBack = nullptr;
m_frontPlatedPadPolys = nullptr;
m_backPlatedPadPolys = nullptr;
if( !g_ColorsLoaded )
{
#define ADD_COLOR( list, r, g, b, a, name ) \
list.emplace_back( r/255.0, g/255.0, b/255.0, a, name )
ADD_COLOR( g_SilkscreenColors, 245, 245, 245, 1.0, NotSpecifiedPrm() ); // White
ADD_COLOR( g_SilkscreenColors, 20, 51, 36, 1.0, wxT( "Green" ) );
ADD_COLOR( g_SilkscreenColors, 181, 19, 21, 1.0, wxT( "Red" ) );
ADD_COLOR( g_SilkscreenColors, 2, 59, 162, 1.0, wxT( "Blue" ) );
ADD_COLOR( g_SilkscreenColors, 11, 11, 11, 1.0, wxT( "Black" ) );
ADD_COLOR( g_SilkscreenColors, 245, 245, 245, 1.0, wxT( "White" ) );
ADD_COLOR( g_SilkscreenColors, 32, 2, 53, 1.0, wxT( "Purple" ) );
ADD_COLOR( g_SilkscreenColors, 194, 195, 0, 1.0, wxT( "Yellow" ) );
ADD_COLOR( g_MaskColors, 20, 51, 36, 0.83, NotSpecifiedPrm() ); // Green
ADD_COLOR( g_MaskColors, 20, 51, 36, 0.83, wxT( "Green" ) );
ADD_COLOR( g_MaskColors, 91, 168, 12, 0.83, wxT( "Light Green" ) );
ADD_COLOR( g_MaskColors, 13, 104, 11, 0.83, wxT( "Saturated Green" ) );
ADD_COLOR( g_MaskColors, 181, 19, 21, 0.83, wxT( "Red" ) );
ADD_COLOR( g_MaskColors, 210, 40, 14, 0.83, wxT( "Light Red" ) );
ADD_COLOR( g_MaskColors, 239, 53, 41, 0.83, wxT( "Red/Orange" ) );
ADD_COLOR( g_MaskColors, 2, 59, 162, 0.83, wxT( "Blue" ) );
ADD_COLOR( g_MaskColors, 54, 79, 116, 0.83, wxT( "Light Blue 1" ) );
ADD_COLOR( g_MaskColors, 61, 85, 130, 0.83, wxT( "Light Blue 2" ) );
ADD_COLOR( g_MaskColors, 21, 70, 80, 0.83, wxT( "Green/Blue" ) );
ADD_COLOR( g_MaskColors, 11, 11, 11, 0.83, wxT( "Black" ) );
ADD_COLOR( g_MaskColors, 245, 245, 245, 0.83, wxT( "White" ) );
ADD_COLOR( g_MaskColors, 32, 2, 53, 0.83, wxT( "Purple" ) );
ADD_COLOR( g_MaskColors, 119, 31, 91, 0.83, wxT( "Light Purple" ) );
ADD_COLOR( g_MaskColors, 194, 195, 0, 0.83, wxT( "Yellow" ) );
ADD_COLOR( g_PasteColors, 128, 128, 128, 1.0, wxT( "Grey" ) );
ADD_COLOR( g_PasteColors, 90, 90, 90, 1.0, wxT( "Dark Grey" ) );
ADD_COLOR( g_PasteColors, 213, 213, 213, 1.0, wxT( "Silver" ) );
ADD_COLOR( g_FinishColors, 184, 115, 50, 1.0, wxT( "Copper" ) );
ADD_COLOR( g_FinishColors, 178, 156, 0, 1.0, wxT( "Gold" ) );
ADD_COLOR( g_FinishColors, 213, 213, 213, 1.0, wxT( "Silver" ) );
ADD_COLOR( g_FinishColors, 160, 160, 160, 1.0, wxT( "Tin" ) );
ADD_COLOR( g_BoardColors, 51, 43, 22, 0.83, wxT( "FR4 natural, dark" ) );
ADD_COLOR( g_BoardColors, 109, 116, 75, 0.83, wxT( "FR4 natural" ) );
ADD_COLOR( g_BoardColors, 252, 252, 250, 0.90, wxT( "PTFE natural" ) );
ADD_COLOR( g_BoardColors, 205, 130, 0, 0.68, wxT( "Polyimide" ) );
ADD_COLOR( g_BoardColors, 92, 17, 6, 0.90, wxT( "Phenolic natural" ) );
ADD_COLOR( g_BoardColors, 146, 99, 47, 0.83, wxT( "Brown 1" ) );
ADD_COLOR( g_BoardColors, 160, 123, 54, 0.83, wxT( "Brown 2" ) );
ADD_COLOR( g_BoardColors, 146, 99, 47, 0.83, wxT( "Brown 3" ) );
ADD_COLOR( g_BoardColors, 213, 213, 213, 1.0, wxT( "Aluminum" ) );
g_DefaultBackgroundTop = COLOR4D( 0.80, 0.80, 0.90, 1.0 );
g_DefaultBackgroundBot = COLOR4D( 0.40, 0.40, 0.50, 1.0 );
g_DefaultSilkscreen = COLOR4D( 0.94, 0.94, 0.94, 1.0 );
g_DefaultSolderMask = COLOR4D( 0.08, 0.20, 0.14, 0.83 );
g_DefaultSolderPaste = COLOR4D( 0.50, 0.50, 0.50, 1.0 );
g_DefaultSurfaceFinish = COLOR4D( 0.75, 0.61, 0.23, 1.0 );
g_DefaultBoardBody = COLOR4D( 0.43, 0.45, 0.30, 0.90 );
g_ColorsLoaded = true;
}
#undef ADD_COLOR
}
BOARD_ADAPTER::~BOARD_ADAPTER()
{
destroyLayers();
}
bool BOARD_ADAPTER::Is3dLayerEnabled( PCB_LAYER_ID aLayer ) const
{
wxASSERT( aLayer < PCB_LAYER_ID_COUNT );
if( m_board && !m_board->IsLayerEnabled( aLayer ) )
return false;
// see if layer needs to be shown
// check the flags
switch( aLayer )
{
case B_Adhes:
case F_Adhes:
return m_Cfg->m_Render.show_adhesive;
case B_Paste:
case F_Paste:
return m_Cfg->m_Render.show_solderpaste;
case B_SilkS:
case F_SilkS:
return m_Cfg->m_Render.show_silkscreen;
case B_Mask:
case F_Mask:
return m_Cfg->m_Render.show_soldermask;
case Dwgs_User:
case Cmts_User:
return !m_Cfg->m_Render.realistic && m_Cfg->m_Render.show_comments;
case Eco1_User:
case Eco2_User:
return !m_Cfg->m_Render.realistic && m_Cfg->m_Render.show_eco;
case Edge_Cuts:
return !m_Cfg->m_Render.realistic && !m_Cfg->m_Render.show_board_body;
case Margin:
return !m_Cfg->m_Render.realistic;
case B_Cu:
case F_Cu:
return !m_board || m_board->IsLayerVisible( aLayer ) || m_Cfg->m_Render.realistic;
default:
// the layer is an internal copper layer, used the visibility
return m_board && m_board->IsLayerVisible( aLayer );
}
}
bool BOARD_ADAPTER::IsFootprintShown( FOOTPRINT_ATTR_T aFPAttributes ) const
{
if( m_IsPreviewer ) // In panel Preview, footprints are always shown, of course
return true;
if( aFPAttributes & FP_SMD )
return m_Cfg->m_Render.show_footprints_insert;
else if( aFPAttributes & FP_THROUGH_HOLE )
return m_Cfg->m_Render.show_footprints_normal;
else
return m_Cfg->m_Render.show_footprints_virtual;
}
int BOARD_ADAPTER::GetHolePlatingThickness() const noexcept
{
return m_board ? m_board->GetDesignSettings().GetHolePlatingThickness()
: DEFAULT_COPPER_THICKNESS;
}
unsigned int BOARD_ADAPTER::GetCircleSegmentCount( float aDiameter3DU ) const
{
wxASSERT( aDiameter3DU > 0.0f );
return GetCircleSegmentCount( (int)( aDiameter3DU / m_biuTo3Dunits ) );
}
unsigned int BOARD_ADAPTER::GetCircleSegmentCount( int aDiameterBIU ) const
{
wxASSERT( aDiameterBIU > 0 );
return GetArcToSegmentCount( aDiameterBIU / 2, ARC_HIGH_DEF, FULL_CIRCLE );
}
void BOARD_ADAPTER::InitSettings( REPORTER* aStatusReporter, REPORTER* aWarningReporter )
{
wxLogTrace( m_logTrace, wxT( "BOARD_ADAPTER::InitSettings" ) );
if( aStatusReporter )
aStatusReporter->Report( _( "Build board outline" ) );
wxString msg;
const bool haveOutline = createBoardPolygon( &msg );
if( aWarningReporter )
{
if( !haveOutline )
aWarningReporter->Report( msg, RPT_SEVERITY_WARNING );
else
aWarningReporter->Report( wxEmptyString );
}
BOX2I bbbox;
if( m_board )
{
bbbox = m_board->ComputeBoundingBox( !m_board->IsFootprintHolder()
&& m_Cfg->m_Render.realistic
&& haveOutline );
}
// Gives a non null size to avoid issues in zoom / scale calculations
if( ( bbbox.GetWidth() == 0 ) && ( bbbox.GetHeight() == 0 ) )
bbbox.Inflate( Millimeter2iu( 10 ) );
m_boardSize = bbbox.GetSize();
m_boardPos = bbbox.Centre();
wxASSERT( (m_boardSize.x > 0) && (m_boardSize.y > 0) );
m_boardPos.y = -m_boardPos.y; // The y coord is inverted in 3D viewer
m_copperLayersCount = m_board ? m_board->GetCopperLayerCount() : 2;
// Ensure the board has 2 sides for 3D views, because it is hard to find
// a *really* single side board in the true life...
if( m_copperLayersCount < 2 )
m_copperLayersCount = 2;
// Calculate the conversion to apply to all positions.
m_biuTo3Dunits = RANGE_SCALE_3D / std::max( m_boardSize.x, m_boardSize.y );
m_boardBodyThickness3DU = DEFAULT_BOARD_THICKNESS * m_biuTo3Dunits;
m_frontCopperThickness3DU = DEFAULT_COPPER_THICKNESS * m_biuTo3Dunits;
m_backCopperThickness3DU = DEFAULT_COPPER_THICKNESS * m_biuTo3Dunits;
m_nonCopperLayerThickness3DU = DEFAULT_TECH_LAYER_THICKNESS * m_biuTo3Dunits;
m_solderPasteLayerThickness3DU = SOLDERPASTE_LAYER_THICKNESS * m_biuTo3Dunits;
g_BevelThickness3DU = Millimeter2iu( ADVANCED_CFG::GetCfg().m_3DRT_BevelHeight_um / 1000.0 ) * m_biuTo3Dunits;
if( m_board )
{
const BOARD_DESIGN_SETTINGS& bds = m_board->GetDesignSettings();
if( bds.GetStackupDescriptor().GetCount() )
{
int thickness = 0;
for( BOARD_STACKUP_ITEM* item : bds.GetStackupDescriptor().GetList() )
{
switch( item->GetType() )
{
case BS_ITEM_TYPE_DIELECTRIC:
thickness += item->GetThickness();
break;
case BS_ITEM_TYPE_COPPER:
if( item->GetBrdLayerId() == F_Cu )
m_frontCopperThickness3DU = item->GetThickness() * m_biuTo3Dunits;
else if( item->GetBrdLayerId() == B_Cu )
m_backCopperThickness3DU = item->GetThickness() * m_biuTo3Dunits;
else if( item->IsEnabled() )
thickness += item->GetThickness();
break;
default:
break;
}
}
m_boardBodyThickness3DU = thickness * m_biuTo3Dunits;
}
}
// Init Z position of each layer
// calculate z position for each copper layer
// Zstart = -m_epoxyThickness / 2.0 is the z position of the back (bottom layer) (layer id = 31)
// Zstart = +m_epoxyThickness / 2.0 is the z position of the front (top layer) (layer id = 0)
// ____==__________==________==______ <- Bottom = +m_epoxyThickness / 2.0,
// | | Top = Bottom + m_copperThickness
// |__________________________________|
// == == == == <- Bottom = -m_epoxyThickness / 2.0,
// Top = Bottom - m_copperThickness
unsigned int layer;
for( layer = 0; layer < m_copperLayersCount; ++layer )
{
// This approximates internal layer positions (because we're treating all the dielectric
// layers as having the same thickness). But we don't render them anyway so it doesn't
// really matter.
m_layerZcoordBottom[layer] = m_boardBodyThickness3DU / 2.0f -
(m_boardBodyThickness3DU * layer / (m_copperLayersCount - 1) );
if( layer < (m_copperLayersCount / 2) )
m_layerZcoordTop[layer] = m_layerZcoordBottom[layer] + m_frontCopperThickness3DU;
else
m_layerZcoordTop[layer] = m_layerZcoordBottom[layer] - m_backCopperThickness3DU;
}
#define layerThicknessMargin 1.1
const float zpos_offset = m_nonCopperLayerThickness3DU * layerThicknessMargin;
// Fill remaining unused copper layers and back layer zpos with -m_boardBodyThickness / 2.0
for( ; layer < MAX_CU_LAYERS; layer++ )
{
m_layerZcoordBottom[layer] = -( m_boardBodyThickness3DU / 2.0f );
m_layerZcoordTop[layer] = -( m_boardBodyThickness3DU / 2.0f ) - m_backCopperThickness3DU;
}
// This is the top of the copper layer thickness.
const float zpos_copperTop_back = m_layerZcoordTop[B_Cu];
const float zpos_copperTop_front = m_layerZcoordTop[F_Cu];
// calculate z position for each non copper layer
// Solder mask and Solder paste have the same Z position
for( int layer_id = MAX_CU_LAYERS; layer_id < PCB_LAYER_ID_COUNT; ++layer_id )
{
float zposTop;
float zposBottom;
switch( layer_id )
{
case B_Adhes:
zposBottom = zpos_copperTop_back - 2.0f * zpos_offset;
zposTop = zposBottom - m_nonCopperLayerThickness3DU;
break;
case F_Adhes:
zposBottom = zpos_copperTop_front + 2.0f * zpos_offset;
zposTop = zposBottom + m_nonCopperLayerThickness3DU;
break;
case B_Mask:
zposBottom = zpos_copperTop_back;
zposTop = zpos_copperTop_back - m_nonCopperLayerThickness3DU;
break;
case B_Paste:
zposBottom = zpos_copperTop_back;
zposTop = zpos_copperTop_back - m_solderPasteLayerThickness3DU;
break;
case F_Mask:
zposBottom = zpos_copperTop_front;
zposTop = zpos_copperTop_front + m_nonCopperLayerThickness3DU;
break;
case F_Paste:
zposBottom = zpos_copperTop_front;
zposTop = zpos_copperTop_front + m_solderPasteLayerThickness3DU;
break;
case B_SilkS:
zposBottom = zpos_copperTop_back - 1.0f * zpos_offset;
zposTop = zposBottom - m_nonCopperLayerThickness3DU;
break;
case F_SilkS:
zposBottom = zpos_copperTop_front + 1.0f * zpos_offset;
zposTop = zposBottom + m_nonCopperLayerThickness3DU;
break;
// !TODO: review
default:
zposTop = zpos_copperTop_front + (layer_id - MAX_CU_LAYERS + 3.0f) * zpos_offset;
zposBottom = zposTop - m_nonCopperLayerThickness3DU;
break;
}
m_layerZcoordTop[layer_id] = zposTop;
m_layerZcoordBottom[layer_id] = zposBottom;
}
m_boardCenter = SFVEC3F( m_boardPos.x * m_biuTo3Dunits, m_boardPos.y * m_biuTo3Dunits, 0.0f );
SFVEC3F boardSize = SFVEC3F( m_boardSize.x * m_biuTo3Dunits, m_boardSize.y * m_biuTo3Dunits,
0.0f );
boardSize /= 2.0f;
SFVEC3F boardMin = ( m_boardCenter - boardSize );
SFVEC3F boardMax = ( m_boardCenter + boardSize );
boardMin.z = m_layerZcoordTop[B_Adhes];
boardMax.z = m_layerZcoordTop[F_Adhes];
m_boardBoundingBox = BBOX_3D( boardMin, boardMax );
#ifdef PRINT_STATISTICS_3D_VIEWER
unsigned stats_startCreateBoardPolyTime = GetRunningMicroSecs();
#endif
if( aStatusReporter )
aStatusReporter->Report( _( "Create layers" ) );
createLayers( aStatusReporter );
COLOR_SETTINGS* colors = Pgm().GetSettingsManager().GetColorSettings();
auto to_SFVEC4F =
[]( const COLOR4D& src )
{
return SFVEC4F( src.r, src.g, src.b, src.a );
};
m_BgColorTop = to_SFVEC4F( colors->GetColor( LAYER_3D_BACKGROUND_TOP ) );
m_BgColorBot = to_SFVEC4F( colors->GetColor( LAYER_3D_BACKGROUND_BOTTOM ) );
m_SolderPasteColor = to_SFVEC4F( colors->GetColor( LAYER_3D_SOLDERPASTE ) );
if( m_board && colors->GetUseBoardStackupColors() )
{
const BOARD_STACKUP& stackup = m_board->GetDesignSettings().GetStackupDescriptor();
auto findColor =
[]( const wxString& aColorName, const CUSTOM_COLORS_LIST& aColorSet )
{
if( aColorName.StartsWith( wxT( "#" ) ) )
{
return KIGFX::COLOR4D( aColorName );
}
else
{
for( const CUSTOM_COLOR_ITEM& color : aColorSet )
{
if( color.m_ColorName == aColorName )
return color.m_Color;
}
}
return KIGFX::COLOR4D();
};
m_SilkScreenColorTop = to_SFVEC4F( g_DefaultSilkscreen );
m_SilkScreenColorBot = to_SFVEC4F( g_DefaultSilkscreen );
m_SolderMaskColorTop = to_SFVEC4F( g_DefaultSolderMask );
m_SolderMaskColorBot = to_SFVEC4F( g_DefaultSolderMask );
KIGFX::COLOR4D bodyColor( 0, 0, 0, 0 );
for( const BOARD_STACKUP_ITEM* stackupItem : stackup.GetList() )
{
wxString colorName = stackupItem->GetColor();
switch( stackupItem->GetType() )
{
case BS_ITEM_TYPE_SILKSCREEN:
if( stackupItem->GetBrdLayerId() == F_SilkS )
m_SilkScreenColorTop = to_SFVEC4F( findColor( colorName, g_SilkscreenColors ) );
else
m_SilkScreenColorBot = to_SFVEC4F( findColor( colorName, g_SilkscreenColors ) );
break;
case BS_ITEM_TYPE_SOLDERMASK:
if( stackupItem->GetBrdLayerId() == F_Mask )
m_SolderMaskColorTop = to_SFVEC4F( findColor( colorName, g_MaskColors ) );
else
m_SolderMaskColorBot = to_SFVEC4F( findColor( colorName, g_MaskColors ) );
break;
case BS_ITEM_TYPE_DIELECTRIC:
{
KIGFX::COLOR4D layerColor = findColor( colorName, g_BoardColors );
if( bodyColor == COLOR4D( 0, 0, 0, 0 ) )
bodyColor = layerColor;
else
bodyColor = bodyColor.Mix( layerColor, 1.0 - layerColor.a );
bodyColor.a += ( 1.0 - bodyColor.a ) * layerColor.a / 2;
break;
}
default:
break;
}
}
if( bodyColor != COLOR4D( 0, 0, 0, 0 ) )
m_BoardBodyColor = to_SFVEC4F( bodyColor );
else
m_BoardBodyColor = to_SFVEC4F( g_DefaultBoardBody );
const wxString& finishName = stackup.m_FinishType;
if( finishName.EndsWith( wxT( "OSP" ) ) )
{
m_CopperColor = to_SFVEC4F( findColor( wxT( "Copper" ), g_FinishColors ) );
}
else if( finishName.EndsWith( wxT( "IG" ) )
|| finishName.EndsWith( wxT( "gold" ) ) )
{
m_CopperColor = to_SFVEC4F( findColor( wxT( "Gold" ), g_FinishColors ) );
}
else if( finishName.StartsWith( wxT( "HAL" ) )
|| finishName.StartsWith( wxT( "HASL" ) )
|| finishName.EndsWith( wxT( "tin" ) )
|| finishName.EndsWith( wxT( "nickel" ) ) )
{
m_CopperColor = to_SFVEC4F( findColor( wxT( "Tin" ), g_FinishColors ) );
}
else if( finishName.EndsWith( wxT( "silver" ) ) )
{
m_CopperColor = to_SFVEC4F( findColor( wxT( "Silver" ), g_FinishColors ) );
}
else
{
m_CopperColor = to_SFVEC4F( g_DefaultSurfaceFinish );
}
}
else
{
m_SilkScreenColorBot = to_SFVEC4F( colors->GetColor( LAYER_3D_SILKSCREEN_BOTTOM ) );
m_SilkScreenColorTop = to_SFVEC4F( colors->GetColor( LAYER_3D_SILKSCREEN_TOP ) );
m_SolderMaskColorBot = to_SFVEC4F( colors->GetColor( LAYER_3D_SOLDERMASK_BOTTOM ) );
m_SolderMaskColorTop = to_SFVEC4F( colors->GetColor( LAYER_3D_SOLDERMASK_TOP ) );
m_CopperColor = to_SFVEC4F( colors->GetColor( LAYER_3D_COPPER ) );
m_BoardBodyColor = to_SFVEC4F( colors->GetColor( LAYER_3D_BOARD ) );
}
}
extern bool BuildFootprintPolygonOutlines( BOARD* aBoard, SHAPE_POLY_SET& aOutlines,
int aErrorMax, int aChainingEpsilon,
OUTLINE_ERROR_HANDLER* aErrorHandler = nullptr );
bool BOARD_ADAPTER::createBoardPolygon( wxString* aErrorMsg )
{
m_board_poly.RemoveAllContours();
if( !m_board )
return false;
bool success;
if( m_board->IsFootprintHolder() )
{
if( !m_board->GetFirstFootprint() )
{
if( aErrorMsg )
*aErrorMsg = _( "No footprint loaded." );
return false;
}
int chainingEpsilon = Millimeter2iu( 0.02 ); // max dist from one endPt to next startPt
success = BuildFootprintPolygonOutlines( m_board, m_board_poly,
m_board->GetDesignSettings().m_MaxError,
chainingEpsilon );
// Make polygon strictly simple to avoid issues (especially in 3D viewer)
m_board_poly.Simplify( SHAPE_POLY_SET::PM_STRICTLY_SIMPLE );
if( !success && aErrorMsg )
{
*aErrorMsg = _( "Footprint outline is missing or malformed. Run Footprint Checker for "
"a full analysis." );
}
}
else
{
success = m_board->GetBoardPolygonOutlines( m_board_poly );
if( !success && aErrorMsg )
*aErrorMsg = _( "Board outline is missing or malformed. Run DRC for a full analysis." );
}
return success;
}
float BOARD_ADAPTER::GetFootprintZPos( bool aIsFlipped ) const
{
if( aIsFlipped )
{
if( m_Cfg->m_Render.show_solderpaste )
return m_layerZcoordBottom[B_SilkS];
else
return m_layerZcoordBottom[B_Paste];
}
else
{
if( m_Cfg->m_Render.show_solderpaste )
return m_layerZcoordTop[F_SilkS];
else
return m_layerZcoordTop[F_Paste];
}
}
SFVEC4F BOARD_ADAPTER::GetLayerColor( PCB_LAYER_ID aLayerId ) const
{
wxASSERT( aLayerId < PCB_LAYER_ID_COUNT );
const COLOR4D color = m_colors->GetColor( aLayerId );
return SFVEC4F( color.r, color.g, color.b, color.a );
}
SFVEC4F BOARD_ADAPTER::GetItemColor( int aItemId ) const
{
return GetColor( m_colors->GetColor( aItemId ) );
}
SFVEC4F BOARD_ADAPTER::GetColor( const COLOR4D& aColor ) const
{
return SFVEC4F( aColor.r, aColor.g, aColor.b, aColor.a );
}
SFVEC2F BOARD_ADAPTER::GetSphericalCoord( int i ) const
{
SFVEC2F sphericalCoord =
SFVEC2F( ( m_Cfg->m_Render.raytrace_lightElevation[i] + 90.0f ) / 180.0f,
m_Cfg->m_Render.raytrace_lightAzimuth[i] / 180.0f );
sphericalCoord.x = glm::clamp( sphericalCoord.x, 0.0f, 1.0f );
sphericalCoord.y = glm::clamp( sphericalCoord.y, 0.0f, 2.0f );
return sphericalCoord;
}