Jeff Young 3450610977 Add ability to allow thermal vias to be implemented as pads. ... This is mostly just for CADSTAR. Since we don't (yet) have general purpose footprint attributes, this reuses the "net tie" hack. Fixes https://gitlab.com/kicad/code/kicad/issues/8141		2021-04-09 14:02:13 +01:00
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CMakeLists.txt	CADSTAR PCB Archive Importer: Formatting fixes	2020-09-08 21:21:21 +00:00
cadstar_pcb_archive_loader.cpp	Add ability to allow thermal vias to be implemented as pads.	2021-04-09 14:02:13 +01:00
cadstar_pcb_archive_loader.h	CADSTAR PCB: Handle route offset	2021-03-25 17:50:33 +00:00
cadstar_pcb_archive_parser.cpp	CADSTAR Importer: Fix Code Style	2021-02-22 13:24:00 +00:00
cadstar_pcb_archive_parser.h	CADSTAR PCB: DrillXoffset and DrillYoffset are zero when not specified	2021-03-30 13:03:56 +00:00
cadstar_pcb_archive_plugin.cpp	Non-Kicad Project Importers: Fix the creation of project fp libraries	2021-02-10 18:49:20 +00:00
cadstar_pcb_archive_plugin.h	Non-Kicad Project Importers: Fix the creation of project fp libraries	2021-02-10 18:49:20 +00:00