880 lines
16 KiB
Plaintext
880 lines
16 KiB
Plaintext
(kicad_pcb
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(version 20240108)
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(generator "pcbnew")
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(generator_version "8.0")
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(general
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(thickness 1.6)
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(legacy_teardrops no)
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)
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(paper "A4")
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(layers
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(0 "F.Cu" signal)
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(1 "In1.Cu" signal)
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(2 "In2.Cu" signal)
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(3 "In3.Cu" signal)
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(4 "In4.Cu" signal)
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(31 "B.Cu" signal)
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(32 "B.Adhes" user "B.Adhesive")
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(33 "F.Adhes" user "F.Adhesive")
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(34 "B.Paste" user)
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(35 "F.Paste" user)
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(36 "B.SilkS" user "B.Silkscreen")
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(37 "F.SilkS" user "F.Silkscreen")
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(38 "B.Mask" user)
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(39 "F.Mask" user)
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(40 "Dwgs.User" user "User.Drawings")
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(41 "Cmts.User" user "User.Comments")
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(42 "Eco1.User" user "User.Eco1")
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(43 "Eco2.User" user "User.Eco2")
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(44 "Edge.Cuts" user)
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(45 "Margin" user)
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(46 "B.CrtYd" user "B.Courtyard")
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(47 "F.CrtYd" user "F.Courtyard")
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(48 "B.Fab" user)
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(49 "F.Fab" user)
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(50 "User.1" user)
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(51 "User.2" user)
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(52 "User.3" user)
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(53 "User.4" user)
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(54 "User.5" user)
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(55 "User.6" user)
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(56 "User.7" user)
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(57 "User.8" user)
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(58 "User.9" user)
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)
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(setup
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(stackup
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(layer "F.SilkS"
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(type "Top Silk Screen")
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)
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(layer "F.Paste"
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(type "Top Solder Paste")
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)
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(layer "F.Mask"
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(type "Top Solder Mask")
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(thickness 0.01)
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)
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(layer "F.Cu"
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(type "copper")
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(thickness 0.035)
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)
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(layer "dielectric 1"
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(type "prepreg")
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(thickness 0.1)
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(material "FR4")
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(epsilon_r 4.5)
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(loss_tangent 0.02)
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)
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(layer "In1.Cu"
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(type "copper")
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(thickness 0.035)
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)
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(layer "dielectric 2"
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(type "core")
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(thickness 0.535)
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(material "FR4")
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(epsilon_r 4.5)
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(loss_tangent 0.02)
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)
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(layer "In2.Cu"
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(type "copper")
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(thickness 0.035)
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)
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(layer "dielectric 3"
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(type "prepreg")
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(thickness 0.1)
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(material "FR4")
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(epsilon_r 4.5)
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(loss_tangent 0.02)
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)
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(layer "In3.Cu"
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(type "copper")
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(thickness 0.035)
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)
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(layer "dielectric 4"
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(type "core")
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(thickness 0.535)
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(material "FR4")
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(epsilon_r 4.5)
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(loss_tangent 0.02)
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)
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(layer "In4.Cu"
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(type "copper")
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(thickness 0.035)
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)
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(layer "dielectric 5"
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(type "prepreg")
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(thickness 0.1)
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(material "FR4")
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(epsilon_r 4.5)
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(loss_tangent 0.02)
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)
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(layer "B.Cu"
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(type "copper")
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(thickness 0.035)
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)
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(layer "B.Mask"
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(type "Bottom Solder Mask")
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(thickness 0.01)
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)
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(layer "B.Paste"
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(type "Bottom Solder Paste")
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)
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(layer "B.SilkS"
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(type "Bottom Silk Screen")
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)
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(copper_finish "None")
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(dielectric_constraints no)
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)
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(pad_to_mask_clearance 0)
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(allow_soldermask_bridges_in_footprints no)
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(pcbplotparams
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(layerselection 0x00010fc_ffffffff)
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(plot_on_all_layers_selection 0x0000000_00000000)
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(disableapertmacros no)
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(usegerberextensions no)
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(usegerberattributes yes)
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(usegerberadvancedattributes yes)
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(creategerberjobfile yes)
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(dashed_line_dash_ratio 12.000000)
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(dashed_line_gap_ratio 3.000000)
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(svgprecision 4)
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(plotframeref no)
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(viasonmask no)
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(mode 1)
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(useauxorigin no)
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(hpglpennumber 1)
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(hpglpenspeed 20)
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(hpglpendiameter 15.000000)
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(pdf_front_fp_property_popups yes)
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(pdf_back_fp_property_popups yes)
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(dxfpolygonmode yes)
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(dxfimperialunits yes)
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(dxfusepcbnewfont yes)
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(psnegative no)
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(psa4output no)
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(plotreference yes)
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(plotvalue yes)
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(plotfptext yes)
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(plotinvisibletext no)
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(sketchpadsonfab no)
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(subtractmaskfromsilk no)
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(outputformat 1)
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(mirror no)
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(drillshape 1)
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(scaleselection 1)
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(outputdirectory "")
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)
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)
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(net 0 "")
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(net 1 "A")
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(net 2 "B")
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(footprint "TestPoint:TestPoint_Pad_D2.0mm"
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(layer "F.Cu")
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(uuid "0c12f606-2e6b-4b10-8aee-13ada275880a")
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(at 125 89)
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(descr "SMD pad as test Point, diameter 2.0mm")
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(tags "test point SMD pad")
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(property "Reference" "P2"
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(at 0 -1.998 0)
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(layer "F.SilkS")
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(uuid "29533062-1c68-45f1-aa62-808c999e5f83")
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(effects
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)
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)
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(property "Value" "TestPoint_Pad_D2.0mm"
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(at 0 2.05 0)
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(layer "F.Fab")
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(hide yes)
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(effects
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(property "Footprint" "TestPoint:TestPoint_Pad_D2.0mm"
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(at 0 0 0)
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(unlocked yes)
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(layer "F.Fab")
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(property "Datasheet" ""
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(property "Description" ""
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(attr exclude_from_pos_files exclude_from_bom)
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(fp_circle
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(stroke
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(width 0.12)
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(type solid)
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(layer "F.SilkS")
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(uuid "c03d6f26-7038-4706-b2fb-d9a9feae2ab3")
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(fp_circle
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(fill none)
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(layer "F.CrtYd")
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(uuid "04545c49-ee36-461e-8b2e-f8747ad85b16")
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(fp_text user "${REFERENCE}"
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(pad "1" smd circle
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(at 0 0 90)
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(size 2 2)
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(layers "F.Cu" "F.Mask")
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(uuid "d37584cd-2e2f-40b5-822b-12791118953d")
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(footprint "TestPoint:TestPoint_Pad_D2.0mm"
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(layer "F.Cu")
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(uuid "516f904c-b21d-49d3-bbc4-a9b97f897bb1")
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(at 137 89)
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(descr "SMD pad as test Point, diameter 2.0mm")
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(tags "test point SMD pad")
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(property "Reference" "P5"
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(at 0 -1.998 0)
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(layer "F.SilkS")
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(uuid "68cba2b6-b596-4711-a20c-f5aace777c21")
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(effects
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(property "Value" "TestPoint_Pad_D2.0mm"
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(at 0 2.05 0)
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(layer "F.Fab")
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(hide yes)
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(uuid "6f02e655-dc34-4a7e-bd71-f79a95274878")
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(effects
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(font
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(property "Footprint" "TestPoint:TestPoint_Pad_D2.0mm"
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(at 0 0 0)
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(unlocked yes)
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(layer "F.Fab")
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(hide yes)
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(uuid "b44ac9da-098a-4f00-9ae0-9e18cb78e77b")
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(property "Datasheet" ""
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(layer "F.Fab")
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(property "Description" ""
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(at 0 0 0)
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(unlocked yes)
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(layer "F.Fab")
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(uuid "1eb2de7a-10c7-45c6-9b2b-f1878805e977")
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(attr exclude_from_pos_files exclude_from_bom)
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(fp_circle
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(width 0.12)
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(uuid "2aacb056-b289-4231-8a9b-cdad899fcc6e")
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(pad "2" smd trapezoid
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(at 0 0 315)
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(uuid "f98951ae-c7c4-445b-a39a-a4d57888a02e")
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(footprint "TestPoint:TestPoint_Pad_D2.0mm"
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(uuid "72233f75-c54b-4983-a966-c01867960037")
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(at 133 89)
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(descr "SMD pad as test Point, diameter 2.0mm")
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(tags "test point SMD pad")
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(property "Reference" "P4"
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(at 0 -1.998 0)
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(property "Value" "TestPoint_Pad_D2.0mm"
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(property "Description" ""
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(fp_circle
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(at 0 0 45)
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(layers "F.Cu" "F.Paste" "F.Mask")
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|
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|
|
(at 121 89)
|
|
(descr "SMD pad as test Point, diameter 2.0mm")
|
|
(tags "test point SMD pad")
|
|
(property "Reference" "P1"
|
|
(at 0 -1.998 0)
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