kicad/demos/tiny_tapeout/tinytapeout-kicad-libs/footprints/TinyTapeout.pretty/CUI_UJC-HP-3-SMT-TR.kicad_mod

65 lines
4.4 KiB
Plaintext

(footprint "CUI_UJC-HP-3-SMT-TR" (version 20221018) (generator pcbnew)
(layer "F.Cu")
(descr "USB Connectors USB jack, C type, power only, 6 pin, horizonal, gold flash plating, surface mount, T&R\n")
(tags "USB-C, Power, USB")
(attr smd)
(fp_text reference "REF**" (at -3.5 -1.8) (layer "F.SilkS")
(effects (font (size 0.787402 0.787402) (thickness 0.15)))
(tstamp fcf8be7f-56e1-4fac-9032-845fd53b875e)
)
(fp_text value "CUI_UJC-HP-3-SMT-TR" (at 0.1 7.3) (layer "F.Fab")
(effects (font (size 0.787402 0.787402) (thickness 0.15)))
(tstamp 9fbf1a9c-7de6-4422-98b2-28bfd82f4e2e)
)
(fp_text user "${REFERENCE}" (at -2.8 3.2 unlocked) (layer "F.Fab")
(effects (font (size 1 1) (thickness 0.15)) (justify left bottom))
(tstamp 494a1375-2afb-4904-85b6-fca45fbcd200)
)
(fp_line (start -4.47 2.45) (end -4.47 1.35)
(stroke (width 0.127) (type solid)) (layer "F.SilkS") (tstamp 92f69cf0-af3b-4129-bdc9-1cf73908efbb))
(fp_line (start -4.47 6.4) (end -4.47 5.15)
(stroke (width 0.127) (type solid)) (layer "F.SilkS") (tstamp 2c95434e-c5c2-43ec-8099-2c30b4d5895d))
(fp_line (start -4.47 6.4) (end 4.47 6.4)
(stroke (width 0.127) (type solid)) (layer "F.SilkS") (tstamp f5f76f6f-194b-467b-97ef-e076c3f63340))
(fp_line (start 4.47 2.45) (end 4.47 1.35)
(stroke (width 0.127) (type solid)) (layer "F.SilkS") (tstamp bdae0ddc-3750-4389-a660-cfde291a50ee))
(fp_line (start 4.47 6.4) (end 4.47 5.15)
(stroke (width 0.127) (type solid)) (layer "F.SilkS") (tstamp a43295b0-24d7-4301-9ae7-06f2c27da71d))
(fp_line (start -5.07 -1.25) (end -5.07 6.65)
(stroke (width 0.05) (type solid)) (layer "F.CrtYd") (tstamp 67eda45d-afbf-481f-96ec-315074befae2))
(fp_line (start -5.07 6.65) (end 5.07 6.65)
(stroke (width 0.05) (type solid)) (layer "F.CrtYd") (tstamp cb91494b-0819-4faa-98ff-181d21f60ab7))
(fp_line (start 5.07 -1.25) (end -5.07 -1.25)
(stroke (width 0.05) (type solid)) (layer "F.CrtYd") (tstamp 7095ca62-3e31-41d0-960e-66442305dcaa))
(fp_line (start 5.07 6.65) (end 5.07 -1.25)
(stroke (width 0.05) (type solid)) (layer "F.CrtYd") (tstamp c4973ee6-ceb9-46f3-8003-d41d63403874))
(fp_line (start -4.47 -0.5) (end -4.47 6.4)
(stroke (width 0.127) (type solid)) (layer "F.Fab") (tstamp 736e7acf-6d6e-467a-b67a-9a1ff1f2f1e5))
(fp_line (start -4.47 6.4) (end 4.47 6.4)
(stroke (width 0.127) (type solid)) (layer "F.Fab") (tstamp 5dbe69e3-9f3e-4058-9d03-adc08499cc05))
(fp_line (start 4.47 -0.5) (end -4.47 -0.5)
(stroke (width 0.127) (type solid)) (layer "F.Fab") (tstamp 6cdc0f74-fdd4-4bff-88f6-30b0fd7faa73))
(fp_line (start 4.47 6.4) (end 4.47 -0.5)
(stroke (width 0.127) (type solid)) (layer "F.Fab") (tstamp 4ba21e52-d148-4de2-a88c-51de9570c29c))
(pad "A5" smd rect (at -0.5 -0.005 90) (size 1.15 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.102) (tstamp e194ec2e-14ef-4f50-b003-defbe9323d55))
(pad "A9" smd rect (at 1.52 -0.005 90) (size 1.15 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.102) (tstamp e1cfca70-2c30-4017-a999-0fa8a42993e4))
(pad "A12" smd rect (at 2.75 -0.005 90) (size 1.15 0.9) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.102) (tstamp 5f9b5bdb-3ec5-468c-b45c-c356a2912895))
(pad "B5" smd rect (at 0.5 -0.005 90) (size 1.15 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.102) (tstamp e8667893-0376-4f0c-acfc-25ae9fceedb4))
(pad "B9" smd rect (at -1.52 -0.005 90) (size 1.15 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.102) (tstamp ad1fb2e4-d1b8-4107-9f24-4fa1ce185013))
(pad "B12" smd rect (at -2.75 -0.005 90) (size 1.15 0.9) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.102) (tstamp 48b96b29-0c0f-4959-a3c6-51b5a316803e))
(pad "S1" thru_hole oval (at -4.32 0) (size 1 2) (drill oval 0.5 1.2) (layers "*.Cu" "*.Mask")
(solder_mask_margin 0.102) (tstamp f28d56d7-3fbc-448d-8cdf-066f7d3eaf3b))
(pad "S2" thru_hole oval (at 4.32 0) (size 1 2) (drill oval 0.5 1.2) (layers "*.Cu" "*.Mask")
(solder_mask_margin 0.102) (tstamp a48b7cd5-c1a9-4768-9398-300357cabf74))
(pad "S3" thru_hole oval (at -4.32 3.8) (size 1 2) (drill oval 0.5 1.2) (layers "*.Cu" "*.Mask")
(solder_mask_margin 0.102) (tstamp baa39a81-4e58-492b-85d0-5192368399b3))
(pad "S4" thru_hole oval (at 4.32 3.8) (size 1 2) (drill oval 0.5 1.2) (layers "*.Cu" "*.Mask")
(solder_mask_margin 0.102) (tstamp cc92a888-d455-4083-ac01-3acc173628aa))
)