3462 lines
172 KiB
Plaintext
3462 lines
172 KiB
Plaintext
(kicad_pcb (version 20231007) (generator pcbnew)
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(general
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(thickness 1.6062)
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)
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(paper "A4")
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(title_block
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(title "grblPANEL")
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(date "2023-04-28")
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(rev "B")
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(company "dresco")
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)
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(layers
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(0 "F.Cu" signal)
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(1 "In1.Cu" power)
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(2 "In2.Cu" power)
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(31 "B.Cu" signal)
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(32 "B.Adhes" user "B.Adhesive")
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(33 "F.Adhes" user "F.Adhesive")
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(34 "B.Paste" user)
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(35 "F.Paste" user)
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(36 "B.SilkS" user "B.Silkscreen")
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(37 "F.SilkS" user "F.Silkscreen")
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(38 "B.Mask" user)
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(39 "F.Mask" user)
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(40 "Dwgs.User" user "User.Drawings")
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(41 "Cmts.User" user "User.Comments")
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(42 "Eco1.User" user "User.Eco1")
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(43 "Eco2.User" user "User.Eco2")
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(44 "Edge.Cuts" user)
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(45 "Margin" user)
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(46 "B.CrtYd" user "B.Courtyard")
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(47 "F.CrtYd" user "F.Courtyard")
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(48 "B.Fab" user)
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(49 "F.Fab" user)
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(50 "User.1" user)
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(51 "User.2" user)
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(52 "User.3" user)
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(53 "User.4" user)
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(54 "User.5" user)
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(55 "User.6" user)
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(56 "User.7" user)
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(57 "User.8" user)
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(58 "User.9" user)
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)
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(setup
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(stackup
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(layer "F.SilkS" (type "Top Silk Screen"))
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(layer "F.Paste" (type "Top Solder Paste"))
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(layer "F.Mask" (type "Top Solder Mask") (color "Black") (thickness 0.01))
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(layer "F.Cu" (type "copper") (thickness 0.035))
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(layer "dielectric 1" (type "prepreg") (thickness 0.2104) (material "FR4") (epsilon_r 4.6) (loss_tangent 0.02))
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(layer "In1.Cu" (type "copper") (thickness 0.0152))
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(layer "dielectric 2" (type "core") (thickness 1.065) (material "FR4") (epsilon_r 4.6) (loss_tangent 0.02))
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(layer "In2.Cu" (type "copper") (thickness 0.0152))
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(layer "dielectric 3" (type "prepreg") (thickness 0.2104) (material "FR4") (epsilon_r 4.6) (loss_tangent 0.02))
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(layer "B.Cu" (type "copper") (thickness 0.035))
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(layer "B.Mask" (type "Bottom Solder Mask") (color "Black") (thickness 0.01))
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(layer "B.Paste" (type "Bottom Solder Paste"))
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(layer "B.SilkS" (type "Bottom Silk Screen"))
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(copper_finish "ENIG")
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(dielectric_constraints yes)
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)
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(pad_to_mask_clearance 0)
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(pcbplotparams
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(layerselection 0x00010fc_ffffffff)
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(plot_on_all_layers_selection 0x0000000_00000000)
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(disableapertmacros false)
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(usegerberextensions true)
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(usegerberattributes true)
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(usegerberadvancedattributes false)
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(creategerberjobfile false)
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(dashed_line_dash_ratio 12.000000)
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(dashed_line_gap_ratio 3.000000)
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(svgprecision 6)
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(plotframeref false)
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(viasonmask false)
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(mode 1)
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(useauxorigin false)
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(hpglpennumber 1)
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(hpglpenspeed 20)
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(hpglpendiameter 15.000000)
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(pdf_front_fp_property_popups true)
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(pdf_back_fp_property_popups true)
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(dxfpolygonmode true)
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(dxfimperialunits true)
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(dxfusepcbnewfont true)
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(psnegative false)
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(psa4output false)
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(plotreference true)
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(plotvalue false)
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(plotfptext true)
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(plotinvisibletext false)
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(sketchpadsonfab false)
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(subtractmaskfromsilk true)
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(outputformat 1)
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(mirror false)
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(drillshape 0)
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(scaleselection 1)
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(outputdirectory "manufacturing/")
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)
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)
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(net 0 "")
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(net 1 "GND")
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(net 2 "/Power/VIN_PI_OUT")
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(net 3 "+3V3")
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(net 4 "/MCU/~{RST}")
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(net 5 "/Power/PWR_LED_K")
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(net 6 "DISPLAY_D{slash}C")
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(net 7 "DISPLAY_SDA")
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(net 8 "Net-(JP401-B)")
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(net 9 "Net-(R202-Pad1)")
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(net 10 "/MCU/LED_K")
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(net 11 "/MCU/SWCLK{slash}BOOT0")
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(net 12 "MODBUS_RX")
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(net 13 "MODBUS_TX")
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(net 14 "/Modbus/CONN_RS485_A")
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(net 15 "/Modbus/CONN_RS485_B")
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(net 16 "/Modbus/RS485_B")
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(net 17 "/Modbus/RS485_A")
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(net 18 "/Modbus/RS485_MODE_SELECT")
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(net 19 "/Display/CONN_SCL")
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(footprint "TestPoint:TestPoint_THTPad_D2.0mm_Drill1.0mm" (layer "F.Cu")
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(tstamp 0000468b-72e2-4a41-a1c6-bb64ad8b1463)
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(at 161 100.5)
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(descr "THT pad as test Point, diameter 2.0mm, hole diameter 1.0mm")
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(tags "test point THT pad")
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(property "Reference" "TP502" (at 0 -1.998 0) (layer "F.SilkS") hide (tstamp ddbec07b-201e-4d15-a60d-bbce6f0c43ae)
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(effects (font (size 1 1) (thickness 0.15)))
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)
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(property "Value" "TestPoint" (at 0 2.05 0) (layer "F.Fab") hide (tstamp 4ec50636-4d6d-4b7a-b9f0-f300fd1ec630)
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(effects (font (size 1 1) (thickness 0.15)))
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(effects (font (size 1.27 1.27)))
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(path "/2c60fe6e-45f9-484b-a2a4-9c1dd728d5af/2818bd06-857c-4f88-99f8-f837cac02934")
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(sheetname "Display")
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(sheetfile "grblPANEL_display.kicad_sch")
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(fp_circle (center 0 0) (end 0 1.2)
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(stroke (width 0.12) (type solid)) (fill none) (layer "F.SilkS") (tstamp 640e8dd2-e448-4bd4-a4b3-36c648d34ddf))
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(effects (font (size 1 1) (thickness 0.15)))
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)
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(pad "1" thru_hole circle (at 0 0) (size 2 2) (drill 1) (layers "*.Cu" "*.Mask")
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(net 19 "/Display/CONN_SCL") (pinfunction "1") (pintype "passive")
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(tstamp 71a135f7-7135-4f66-b1e5-f4c9e06c7f85)
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)
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)
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(footprint "Resistor_SMD:R_0603_1608Metric" (layer "F.Cu")
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(tstamp 03a5680f-1a43-4752-b5bb-6a2b3cff277e)
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(at 178.3 107 90)
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(descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
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(tags "resistor")
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(property "Reference" "R202" (at 0 -1.43 90) (layer "F.SilkS") hide (tstamp ed2d8701-6848-4dc8-a8ff-012a5d7a0cab)
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(effects (font (size 1 1) (thickness 0.15)))
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(path "/437f2ceb-712b-41a0-9e79-c6c2becba629/df571d19-3631-45b0-a40b-90b7c04354a7")
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(sheetname "MCU")
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(sheetfile "grblPANEL_mcu.kicad_sch")
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(attr smd)
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(fp_line (start -0.237258 -0.5225) (end 0.237258 -0.5225)
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(pad "1" smd roundrect (at -0.825 0 90) (size 0.8 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
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(net 9 "Net-(R202-Pad1)") (pintype "passive")
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(tstamp 97f2fdf3-a80c-4a1b-9acc-097bca187fe7)
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)
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(pad "2" smd roundrect (at 0.825 0 90) (size 0.8 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
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(net 3 "+3V3") (pintype "passive")
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(tstamp 3f6497ad-9438-4ee4-bd4d-4039f66e12fc)
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)
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(model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl"
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(offset (xyz 0 0 0))
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(scale (xyz 1 1 1))
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(rotate (xyz 0 0 0))
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)
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)
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(footprint "TestPoint:TestPoint_THTPad_D2.0mm_Drill1.0mm" (layer "F.Cu")
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(tstamp 1d83d55e-536a-4294-bde0-a90c94fe37f8)
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(at 161 97)
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(descr "THT pad as test Point, diameter 2.0mm, hole diameter 1.0mm")
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(tags "test point THT pad")
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(sheetname "Display")
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