753 lines
27 KiB
C++
753 lines
27 KiB
C++
/*
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* This program source code file is part of KiCad, a free EDA CAD application.
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*
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* Copyright (C) 2015-2022 Mario Luzeiro <mrluzeiro@ua.pt>
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* Copyright (C) 1992-2022 KiCad Developers, see AUTHORS.txt for contributors.
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*
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* This program is free software; you can redistribute it and/or
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* modify it under the terms of the GNU General Public License
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* as published by the Free Software Foundation; either version 2
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* of the License, or (at your option) any later version.
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*
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* This program is distributed in the hope that it will be useful,
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* but WITHOUT ANY WARRANTY; without even the implied warranty of
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* MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the
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* GNU General Public License for more details.
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*
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* You should have received a copy of the GNU General Public License
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* along with this program; if not, you may find one here:
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* http://www.gnu.org/licenses/old-licenses/gpl-2.0.html
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* or you may search the http://www.gnu.org website for the version 2 license,
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* or you may write to the Free Software Foundation, Inc.,
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* 51 Franklin Street, Fifth Floor, Boston, MA 02110-1301, USA
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*/
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#include "../3d_rendering/camera.h"
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#include "board_adapter.h"
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#include <board_design_settings.h>
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#include <board_stackup_manager/board_stackup.h>
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#include <board_stackup_manager/stackup_predefined_prms.h>
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#include <3d_rendering/raytracing/shapes2D/polygon_2d.h>
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#include <board.h>
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#include <dialogs/dialog_color_picker.h>
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#include <3d_math.h>
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#include "3d_fastmath.h"
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#include <geometry/geometry_utils.h>
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#include <pgm_base.h>
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#include <settings/settings_manager.h>
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#include <wx/log.h>
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#include <advanced_config.h>
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#define DEFAULT_BOARD_THICKNESS pcbIUScale.mmToIU( 1.6 )
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#define DEFAULT_COPPER_THICKNESS pcbIUScale.mmToIU( 0.035 ) // for 35 um
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// The solder mask layer (and silkscreen) thickness
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#define DEFAULT_TECH_LAYER_THICKNESS pcbIUScale.mmToIU( 0.025 )
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// The solder paste thickness is chosen bigger than the solder mask layer
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// to be sure is covers the mask when overlapping.
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#define SOLDERPASTE_LAYER_THICKNESS pcbIUScale.mmToIU( 0.04 )
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CUSTOM_COLORS_LIST BOARD_ADAPTER::g_SilkscreenColors;
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CUSTOM_COLORS_LIST BOARD_ADAPTER::g_MaskColors;
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CUSTOM_COLORS_LIST BOARD_ADAPTER::g_PasteColors;
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CUSTOM_COLORS_LIST BOARD_ADAPTER::g_FinishColors;
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CUSTOM_COLORS_LIST BOARD_ADAPTER::g_BoardColors;
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KIGFX::COLOR4D BOARD_ADAPTER::g_DefaultBackgroundTop;
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KIGFX::COLOR4D BOARD_ADAPTER::g_DefaultBackgroundBot;
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KIGFX::COLOR4D BOARD_ADAPTER::g_DefaultSilkscreen;
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KIGFX::COLOR4D BOARD_ADAPTER::g_DefaultSolderMask;
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KIGFX::COLOR4D BOARD_ADAPTER::g_DefaultSolderPaste;
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KIGFX::COLOR4D BOARD_ADAPTER::g_DefaultSurfaceFinish;
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KIGFX::COLOR4D BOARD_ADAPTER::g_DefaultBoardBody;
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// To be used in Raytracing render to create bevels on layer items
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float g_BevelThickness3DU = 0.0f;
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static bool g_ColorsLoaded = false;
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/**
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* Trace mask used to enable or disable the trace output of this class.
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* The debug output can be turned on by setting the WXTRACE environment variable to
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* "KI_TRACE_EDA_CINFO3D_VISU". See the wxWidgets documentation on wxLogTrace for
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* more information.
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*
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* @ingroup trace_env_vars
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*/
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const wxChar *BOARD_ADAPTER::m_logTrace = wxT( "KI_TRACE_EDA_CINFO3D_VISU" );
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BOARD_ADAPTER::BOARD_ADAPTER() :
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m_Cfg( nullptr ),
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m_IsBoardView( true ),
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m_MousewheelPanning( true ),
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m_IsPreviewer( false ),
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m_board( nullptr ),
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m_3dModelManager( nullptr ),
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m_renderSettings( nullptr ),
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m_colors( nullptr ),
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m_layerZcoordTop(),
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m_layerZcoordBottom()
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{
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wxLogTrace( m_logTrace, wxT( "BOARD_ADAPTER::BOARD_ADAPTER" ) );
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if( PgmOrNull() )
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m_colors = Pgm().GetSettingsManager().GetColorSettings();
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m_boardPos = VECTOR2I();
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m_boardSize = VECTOR2I();
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m_boardCenter = SFVEC3F( 0.0f );
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m_boardBoundingBox.Reset();
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m_throughHoleIds.Clear();
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m_throughHoleOds.Clear();
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m_throughHoleAnnularRings.Clear();
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m_copperLayersCount = 2;
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m_biuTo3Dunits = 1.0;
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m_boardBodyThickness3DU = DEFAULT_BOARD_THICKNESS * m_biuTo3Dunits;
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m_frontCopperThickness3DU = DEFAULT_COPPER_THICKNESS * m_biuTo3Dunits;
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m_backCopperThickness3DU = DEFAULT_COPPER_THICKNESS * m_biuTo3Dunits;
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m_nonCopperLayerThickness3DU = DEFAULT_TECH_LAYER_THICKNESS * m_biuTo3Dunits;
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m_solderPasteLayerThickness3DU = SOLDERPASTE_LAYER_THICKNESS * m_biuTo3Dunits;
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m_trackCount = 0;
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m_viaCount = 0;
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m_averageViaHoleDiameter = 0.0f;
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m_holeCount = 0;
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m_averageHoleDiameter = 0.0f;
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m_averageTrackWidth = 0.0f;
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m_BgColorBot = SFVEC4F( 0.4, 0.4, 0.5, 1.0 );
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m_BgColorTop = SFVEC4F( 0.8, 0.8, 0.9, 1.0 );
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m_BoardBodyColor = SFVEC4F( 0.4, 0.4, 0.5, 0.9 );
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m_SolderMaskColorTop = SFVEC4F( 0.1, 0.2, 0.1, 0.83 );
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m_SolderMaskColorBot = SFVEC4F( 0.1, 0.2, 0.1, 0.83 );
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m_SolderPasteColor = SFVEC4F( 0.4, 0.4, 0.4, 1.0 );
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m_SilkScreenColorTop = SFVEC4F( 0.9, 0.9, 0.9, 1.0 );
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m_SilkScreenColorBot = SFVEC4F( 0.9, 0.9, 0.9, 1.0 );
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m_CopperColor = SFVEC4F( 0.75, 0.61, 0.23, 1.0 );
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m_platedPadsFront = nullptr;
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m_platedPadsBack = nullptr;
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m_frontPlatedPadPolys = nullptr;
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m_backPlatedPadPolys = nullptr;
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if( !g_ColorsLoaded )
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{
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#define ADD_COLOR( list, r, g, b, a, name ) \
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list.emplace_back( r/255.0, g/255.0, b/255.0, a, name )
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ADD_COLOR( g_SilkscreenColors, 245, 245, 245, 1.0, NotSpecifiedPrm() ); // White
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ADD_COLOR( g_SilkscreenColors, 20, 51, 36, 1.0, wxT( "Green" ) );
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ADD_COLOR( g_SilkscreenColors, 181, 19, 21, 1.0, wxT( "Red" ) );
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ADD_COLOR( g_SilkscreenColors, 2, 59, 162, 1.0, wxT( "Blue" ) );
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ADD_COLOR( g_SilkscreenColors, 11, 11, 11, 1.0, wxT( "Black" ) );
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ADD_COLOR( g_SilkscreenColors, 245, 245, 245, 1.0, wxT( "White" ) );
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ADD_COLOR( g_SilkscreenColors, 32, 2, 53, 1.0, wxT( "Purple" ) );
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ADD_COLOR( g_SilkscreenColors, 194, 195, 0, 1.0, wxT( "Yellow" ) );
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ADD_COLOR( g_MaskColors, 20, 51, 36, 0.83, NotSpecifiedPrm() ); // Green
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ADD_COLOR( g_MaskColors, 20, 51, 36, 0.83, wxT( "Green" ) );
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ADD_COLOR( g_MaskColors, 91, 168, 12, 0.83, wxT( "Light Green" ) );
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ADD_COLOR( g_MaskColors, 13, 104, 11, 0.83, wxT( "Saturated Green" ) );
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ADD_COLOR( g_MaskColors, 181, 19, 21, 0.83, wxT( "Red" ) );
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ADD_COLOR( g_MaskColors, 210, 40, 14, 0.83, wxT( "Light Red" ) );
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ADD_COLOR( g_MaskColors, 239, 53, 41, 0.83, wxT( "Red/Orange" ) );
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ADD_COLOR( g_MaskColors, 2, 59, 162, 0.83, wxT( "Blue" ) );
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ADD_COLOR( g_MaskColors, 54, 79, 116, 0.83, wxT( "Light Blue 1" ) );
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ADD_COLOR( g_MaskColors, 61, 85, 130, 0.83, wxT( "Light Blue 2" ) );
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ADD_COLOR( g_MaskColors, 21, 70, 80, 0.83, wxT( "Green/Blue" ) );
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ADD_COLOR( g_MaskColors, 11, 11, 11, 0.83, wxT( "Black" ) );
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ADD_COLOR( g_MaskColors, 245, 245, 245, 0.83, wxT( "White" ) );
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ADD_COLOR( g_MaskColors, 32, 2, 53, 0.83, wxT( "Purple" ) );
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ADD_COLOR( g_MaskColors, 119, 31, 91, 0.83, wxT( "Light Purple" ) );
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ADD_COLOR( g_MaskColors, 194, 195, 0, 0.83, wxT( "Yellow" ) );
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ADD_COLOR( g_PasteColors, 128, 128, 128, 1.0, wxT( "Grey" ) );
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ADD_COLOR( g_PasteColors, 90, 90, 90, 1.0, wxT( "Dark Grey" ) );
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ADD_COLOR( g_PasteColors, 213, 213, 213, 1.0, wxT( "Silver" ) );
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ADD_COLOR( g_FinishColors, 184, 115, 50, 1.0, wxT( "Copper" ) );
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ADD_COLOR( g_FinishColors, 178, 156, 0, 1.0, wxT( "Gold" ) );
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ADD_COLOR( g_FinishColors, 213, 213, 213, 1.0, wxT( "Silver" ) );
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ADD_COLOR( g_FinishColors, 160, 160, 160, 1.0, wxT( "Tin" ) );
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ADD_COLOR( g_BoardColors, 51, 43, 22, 0.83, wxT( "FR4 natural, dark" ) );
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ADD_COLOR( g_BoardColors, 109, 116, 75, 0.83, wxT( "FR4 natural" ) );
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ADD_COLOR( g_BoardColors, 252, 252, 250, 0.90, wxT( "PTFE natural" ) );
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ADD_COLOR( g_BoardColors, 205, 130, 0, 0.68, wxT( "Polyimide" ) );
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ADD_COLOR( g_BoardColors, 92, 17, 6, 0.90, wxT( "Phenolic natural" ) );
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ADD_COLOR( g_BoardColors, 146, 99, 47, 0.83, wxT( "Brown 1" ) );
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ADD_COLOR( g_BoardColors, 160, 123, 54, 0.83, wxT( "Brown 2" ) );
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ADD_COLOR( g_BoardColors, 146, 99, 47, 0.83, wxT( "Brown 3" ) );
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ADD_COLOR( g_BoardColors, 213, 213, 213, 1.0, wxT( "Aluminum" ) );
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g_DefaultBackgroundTop = COLOR4D( 0.80, 0.80, 0.90, 1.0 );
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g_DefaultBackgroundBot = COLOR4D( 0.40, 0.40, 0.50, 1.0 );
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g_DefaultSilkscreen = COLOR4D( 0.94, 0.94, 0.94, 1.0 );
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g_DefaultSolderMask = COLOR4D( 0.08, 0.20, 0.14, 0.83 );
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g_DefaultSolderPaste = COLOR4D( 0.50, 0.50, 0.50, 1.0 );
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g_DefaultSurfaceFinish = COLOR4D( 0.75, 0.61, 0.23, 1.0 );
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g_DefaultBoardBody = COLOR4D( 0.43, 0.45, 0.30, 0.90 );
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g_ColorsLoaded = true;
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}
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#undef ADD_COLOR
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}
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BOARD_ADAPTER::~BOARD_ADAPTER()
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{
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destroyLayers();
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}
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bool BOARD_ADAPTER::Is3dLayerEnabled( PCB_LAYER_ID aLayer ) const
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{
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wxASSERT( aLayer < PCB_LAYER_ID_COUNT );
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if( m_board && !m_board->IsLayerEnabled( aLayer ) )
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return false;
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// see if layer needs to be shown
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// check the flags
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switch( aLayer )
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{
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case B_Adhes:
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case F_Adhes:
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return m_Cfg->m_Render.show_adhesive;
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case B_Paste:
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case F_Paste:
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return m_Cfg->m_Render.show_solderpaste;
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case B_SilkS:
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case F_SilkS:
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return m_Cfg->m_Render.show_silkscreen;
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case B_Mask:
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case F_Mask:
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return m_Cfg->m_Render.show_soldermask;
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case Dwgs_User:
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case Cmts_User:
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return !m_Cfg->m_Render.realistic && m_Cfg->m_Render.show_comments;
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case Eco1_User:
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case Eco2_User:
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return !m_Cfg->m_Render.realistic && m_Cfg->m_Render.show_eco;
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case Edge_Cuts:
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return !m_Cfg->m_Render.realistic && !m_Cfg->m_Render.show_board_body;
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case Margin:
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return !m_Cfg->m_Render.realistic;
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case B_Cu:
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case F_Cu:
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return !m_board || m_board->IsLayerVisible( aLayer ) || m_Cfg->m_Render.realistic;
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default:
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// the layer is an internal copper layer, used the visibility
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return m_board && m_board->IsLayerVisible( aLayer );
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}
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}
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bool BOARD_ADAPTER::IsFootprintShown( FOOTPRINT_ATTR_T aFPAttributes ) const
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{
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if( m_IsPreviewer ) // In panel Preview, footprints are always shown, of course
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return true;
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if( aFPAttributes & FP_EXCLUDE_FROM_POS_FILES )
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{
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if( !m_Cfg->m_Render.show_footprints_not_in_posfile )
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return false;
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}
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if( aFPAttributes & FP_SMD )
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return m_Cfg->m_Render.show_footprints_insert;
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if( aFPAttributes & FP_THROUGH_HOLE )
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return m_Cfg->m_Render.show_footprints_normal;
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return m_Cfg->m_Render.show_footprints_virtual;
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}
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int BOARD_ADAPTER::GetHolePlatingThickness() const noexcept
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{
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return m_board ? m_board->GetDesignSettings().GetHolePlatingThickness()
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: DEFAULT_COPPER_THICKNESS;
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}
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unsigned int BOARD_ADAPTER::GetCircleSegmentCount( float aDiameter3DU ) const
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{
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wxASSERT( aDiameter3DU > 0.0f );
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return GetCircleSegmentCount( (int)( aDiameter3DU / m_biuTo3Dunits ) );
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}
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unsigned int BOARD_ADAPTER::GetCircleSegmentCount( int aDiameterBIU ) const
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{
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wxASSERT( aDiameterBIU > 0 );
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return GetArcToSegmentCount( aDiameterBIU / 2, ARC_HIGH_DEF, FULL_CIRCLE );
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}
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void BOARD_ADAPTER::InitSettings( REPORTER* aStatusReporter, REPORTER* aWarningReporter )
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{
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wxLogTrace( m_logTrace, wxT( "BOARD_ADAPTER::InitSettings" ) );
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if( aStatusReporter )
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aStatusReporter->Report( _( "Build board outline" ) );
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wxString msg;
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const bool haveOutline = createBoardPolygon( &msg );
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if( aWarningReporter )
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{
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if( !haveOutline )
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aWarningReporter->Report( msg, RPT_SEVERITY_WARNING );
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else
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aWarningReporter->Report( wxEmptyString );
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}
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BOX2I bbbox;
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if( m_board )
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{
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bbbox = m_board->ComputeBoundingBox( !m_board->IsFootprintHolder()
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&& m_Cfg->m_Render.realistic
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&& haveOutline );
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}
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// Gives a non null size to avoid issues in zoom / scale calculations
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if( ( bbbox.GetWidth() == 0 ) && ( bbbox.GetHeight() == 0 ) )
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bbbox.Inflate( pcbIUScale.mmToIU( 10 ) );
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m_boardSize = bbbox.GetSize();
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m_boardPos = bbbox.Centre();
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wxASSERT( (m_boardSize.x > 0) && (m_boardSize.y > 0) );
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m_boardPos.y = -m_boardPos.y; // The y coord is inverted in 3D viewer
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m_copperLayersCount = m_board ? m_board->GetCopperLayerCount() : 2;
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// Ensure the board has 2 sides for 3D views, because it is hard to find
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// a *really* single side board in the true life...
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if( m_copperLayersCount < 2 )
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m_copperLayersCount = 2;
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// Calculate the conversion to apply to all positions.
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m_biuTo3Dunits = RANGE_SCALE_3D / std::max( m_boardSize.x, m_boardSize.y );
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m_boardBodyThickness3DU = DEFAULT_BOARD_THICKNESS * m_biuTo3Dunits;
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m_frontCopperThickness3DU = DEFAULT_COPPER_THICKNESS * m_biuTo3Dunits;
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m_backCopperThickness3DU = DEFAULT_COPPER_THICKNESS * m_biuTo3Dunits;
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m_nonCopperLayerThickness3DU = DEFAULT_TECH_LAYER_THICKNESS * m_biuTo3Dunits;
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m_solderPasteLayerThickness3DU = SOLDERPASTE_LAYER_THICKNESS * m_biuTo3Dunits;
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g_BevelThickness3DU = pcbIUScale.mmToIU( ADVANCED_CFG::GetCfg().m_3DRT_BevelHeight_um / 1000.0 ) * m_biuTo3Dunits;
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if( m_board )
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{
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const BOARD_DESIGN_SETTINGS& bds = m_board->GetDesignSettings();
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if( bds.GetStackupDescriptor().GetCount() )
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{
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int thickness = 0;
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for( BOARD_STACKUP_ITEM* item : bds.GetStackupDescriptor().GetList() )
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{
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switch( item->GetType() )
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{
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case BS_ITEM_TYPE_DIELECTRIC:
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for( int sublayer = 0; sublayer < item->GetSublayersCount(); sublayer++ )
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thickness += item->GetThickness( sublayer );
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break;
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case BS_ITEM_TYPE_COPPER:
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if( item->GetBrdLayerId() == F_Cu )
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m_frontCopperThickness3DU = item->GetThickness() * m_biuTo3Dunits;
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else if( item->GetBrdLayerId() == B_Cu )
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m_backCopperThickness3DU = item->GetThickness() * m_biuTo3Dunits;
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else if( item->IsEnabled() )
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thickness += item->GetThickness();
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break;
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default:
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break;
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}
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}
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m_boardBodyThickness3DU = thickness * m_biuTo3Dunits;
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}
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}
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// Init Z position of each layer
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// calculate z position for each copper layer
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// Zstart = -m_epoxyThickness / 2.0 is the z position of the back (bottom layer) (layer id = 31)
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// Zstart = +m_epoxyThickness / 2.0 is the z position of the front (top layer) (layer id = 0)
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// ____==__________==________==______ <- Bottom = +m_epoxyThickness / 2.0,
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// | | Top = Bottom + m_copperThickness
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// |__________________________________|
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// == == == == <- Bottom = -m_epoxyThickness / 2.0,
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// Top = Bottom - m_copperThickness
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unsigned int layer;
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for( layer = 0; layer < m_copperLayersCount; ++layer )
|
|
{
|
|
// This approximates internal layer positions (because we're treating all the dielectric
|
|
// layers as having the same thickness). But we don't render them anyway so it doesn't
|
|
// really matter.
|
|
m_layerZcoordBottom[layer] = m_boardBodyThickness3DU / 2.0f -
|
|
(m_boardBodyThickness3DU * layer / (m_copperLayersCount - 1) );
|
|
|
|
if( layer < (m_copperLayersCount / 2) )
|
|
m_layerZcoordTop[layer] = m_layerZcoordBottom[layer] + m_frontCopperThickness3DU;
|
|
else
|
|
m_layerZcoordTop[layer] = m_layerZcoordBottom[layer] - m_backCopperThickness3DU;
|
|
}
|
|
|
|
#define layerThicknessMargin 1.1
|
|
const float zpos_offset = m_nonCopperLayerThickness3DU * layerThicknessMargin;
|
|
|
|
// Fill remaining unused copper layers and back layer zpos with -m_boardBodyThickness / 2.0
|
|
for( ; layer < MAX_CU_LAYERS; layer++ )
|
|
{
|
|
m_layerZcoordBottom[layer] = -( m_boardBodyThickness3DU / 2.0f );
|
|
m_layerZcoordTop[layer] = -( m_boardBodyThickness3DU / 2.0f ) - m_backCopperThickness3DU;
|
|
}
|
|
|
|
// This is the top of the copper layer thickness.
|
|
const float zpos_copperTop_back = m_layerZcoordTop[B_Cu];
|
|
const float zpos_copperTop_front = m_layerZcoordTop[F_Cu];
|
|
|
|
// calculate z position for each non copper layer
|
|
// Solder mask and Solder paste have the same Z position
|
|
for( int layer_id = MAX_CU_LAYERS; layer_id < PCB_LAYER_ID_COUNT; ++layer_id )
|
|
{
|
|
float zposTop;
|
|
float zposBottom;
|
|
|
|
switch( layer_id )
|
|
{
|
|
case B_Adhes:
|
|
zposBottom = zpos_copperTop_back - 2.0f * zpos_offset;
|
|
zposTop = zposBottom - m_nonCopperLayerThickness3DU;
|
|
break;
|
|
|
|
case F_Adhes:
|
|
zposBottom = zpos_copperTop_front + 2.0f * zpos_offset;
|
|
zposTop = zposBottom + m_nonCopperLayerThickness3DU;
|
|
break;
|
|
|
|
case B_Mask:
|
|
zposBottom = zpos_copperTop_back;
|
|
zposTop = zpos_copperTop_back - m_nonCopperLayerThickness3DU;
|
|
break;
|
|
|
|
case B_Paste:
|
|
zposBottom = zpos_copperTop_back;
|
|
zposTop = zpos_copperTop_back - m_solderPasteLayerThickness3DU;
|
|
break;
|
|
|
|
case F_Mask:
|
|
zposBottom = zpos_copperTop_front;
|
|
zposTop = zpos_copperTop_front + m_nonCopperLayerThickness3DU;
|
|
break;
|
|
|
|
case F_Paste:
|
|
zposBottom = zpos_copperTop_front;
|
|
zposTop = zpos_copperTop_front + m_solderPasteLayerThickness3DU;
|
|
break;
|
|
|
|
case B_SilkS:
|
|
zposBottom = zpos_copperTop_back - 1.0f * zpos_offset;
|
|
zposTop = zposBottom - m_nonCopperLayerThickness3DU;
|
|
break;
|
|
|
|
case F_SilkS:
|
|
zposBottom = zpos_copperTop_front + 1.0f * zpos_offset;
|
|
zposTop = zposBottom + m_nonCopperLayerThickness3DU;
|
|
break;
|
|
|
|
// !TODO: review
|
|
default:
|
|
zposTop = zpos_copperTop_front + (layer_id - MAX_CU_LAYERS + 3.0f) * zpos_offset;
|
|
zposBottom = zposTop - m_nonCopperLayerThickness3DU;
|
|
break;
|
|
}
|
|
|
|
m_layerZcoordTop[layer_id] = zposTop;
|
|
m_layerZcoordBottom[layer_id] = zposBottom;
|
|
}
|
|
|
|
m_boardCenter = SFVEC3F( m_boardPos.x * m_biuTo3Dunits, m_boardPos.y * m_biuTo3Dunits, 0.0f );
|
|
|
|
SFVEC3F boardSize = SFVEC3F( m_boardSize.x * m_biuTo3Dunits, m_boardSize.y * m_biuTo3Dunits,
|
|
0.0f );
|
|
boardSize /= 2.0f;
|
|
|
|
SFVEC3F boardMin = ( m_boardCenter - boardSize );
|
|
SFVEC3F boardMax = ( m_boardCenter + boardSize );
|
|
|
|
boardMin.z = m_layerZcoordTop[B_Adhes];
|
|
boardMax.z = m_layerZcoordTop[F_Adhes];
|
|
|
|
m_boardBoundingBox = BBOX_3D( boardMin, boardMax );
|
|
|
|
#ifdef PRINT_STATISTICS_3D_VIEWER
|
|
unsigned stats_startCreateBoardPolyTime = GetRunningMicroSecs();
|
|
#endif
|
|
|
|
if( aStatusReporter )
|
|
aStatusReporter->Report( _( "Create layers" ) );
|
|
|
|
createLayers( aStatusReporter );
|
|
|
|
COLOR_SETTINGS* colors = Pgm().GetSettingsManager().GetColorSettings();
|
|
|
|
auto to_SFVEC4F =
|
|
[]( const COLOR4D& src )
|
|
{
|
|
return SFVEC4F( src.r, src.g, src.b, src.a );
|
|
};
|
|
|
|
m_BgColorTop = to_SFVEC4F( colors->GetColor( LAYER_3D_BACKGROUND_TOP ) );
|
|
m_BgColorBot = to_SFVEC4F( colors->GetColor( LAYER_3D_BACKGROUND_BOTTOM ) );
|
|
|
|
m_SolderPasteColor = to_SFVEC4F( colors->GetColor( LAYER_3D_SOLDERPASTE ) );
|
|
|
|
if( m_board && colors->GetUseBoardStackupColors() )
|
|
{
|
|
const BOARD_STACKUP& stackup = m_board->GetDesignSettings().GetStackupDescriptor();
|
|
|
|
auto findColor =
|
|
[]( const wxString& aColorName, const CUSTOM_COLORS_LIST& aColorSet )
|
|
{
|
|
if( aColorName.StartsWith( wxT( "#" ) ) )
|
|
{
|
|
return KIGFX::COLOR4D( aColorName );
|
|
}
|
|
else
|
|
{
|
|
for( const CUSTOM_COLOR_ITEM& color : aColorSet )
|
|
{
|
|
if( color.m_ColorName == aColorName )
|
|
return color.m_Color;
|
|
}
|
|
}
|
|
|
|
return KIGFX::COLOR4D();
|
|
};
|
|
|
|
m_SilkScreenColorTop = to_SFVEC4F( g_DefaultSilkscreen );
|
|
m_SilkScreenColorBot = to_SFVEC4F( g_DefaultSilkscreen );
|
|
m_SolderMaskColorTop = to_SFVEC4F( g_DefaultSolderMask );
|
|
m_SolderMaskColorBot = to_SFVEC4F( g_DefaultSolderMask );
|
|
|
|
KIGFX::COLOR4D bodyColor( 0, 0, 0, 0 );
|
|
|
|
for( const BOARD_STACKUP_ITEM* stackupItem : stackup.GetList() )
|
|
{
|
|
wxString colorName = stackupItem->GetColor();
|
|
|
|
switch( stackupItem->GetType() )
|
|
{
|
|
case BS_ITEM_TYPE_SILKSCREEN:
|
|
if( stackupItem->GetBrdLayerId() == F_SilkS )
|
|
m_SilkScreenColorTop = to_SFVEC4F( findColor( colorName, g_SilkscreenColors ) );
|
|
else
|
|
m_SilkScreenColorBot = to_SFVEC4F( findColor( colorName, g_SilkscreenColors ) );
|
|
break;
|
|
|
|
case BS_ITEM_TYPE_SOLDERMASK:
|
|
if( stackupItem->GetBrdLayerId() == F_Mask )
|
|
m_SolderMaskColorTop = to_SFVEC4F( findColor( colorName, g_MaskColors ) );
|
|
else
|
|
m_SolderMaskColorBot = to_SFVEC4F( findColor( colorName, g_MaskColors ) );
|
|
|
|
break;
|
|
|
|
case BS_ITEM_TYPE_DIELECTRIC:
|
|
{
|
|
KIGFX::COLOR4D layerColor = findColor( colorName, g_BoardColors );
|
|
|
|
if( bodyColor == COLOR4D( 0, 0, 0, 0 ) )
|
|
bodyColor = layerColor;
|
|
else
|
|
bodyColor = bodyColor.Mix( layerColor, 1.0 - layerColor.a );
|
|
|
|
bodyColor.a += ( 1.0 - bodyColor.a ) * layerColor.a / 2;
|
|
break;
|
|
}
|
|
|
|
default:
|
|
break;
|
|
}
|
|
}
|
|
|
|
if( bodyColor != COLOR4D( 0, 0, 0, 0 ) )
|
|
m_BoardBodyColor = to_SFVEC4F( bodyColor );
|
|
else
|
|
m_BoardBodyColor = to_SFVEC4F( g_DefaultBoardBody );
|
|
|
|
const wxString& finishName = stackup.m_FinishType;
|
|
|
|
if( finishName.EndsWith( wxT( "OSP" ) ) )
|
|
{
|
|
m_CopperColor = to_SFVEC4F( findColor( wxT( "Copper" ), g_FinishColors ) );
|
|
}
|
|
else if( finishName.EndsWith( wxT( "IG" ) )
|
|
|| finishName.EndsWith( wxT( "gold" ) ) )
|
|
{
|
|
m_CopperColor = to_SFVEC4F( findColor( wxT( "Gold" ), g_FinishColors ) );
|
|
}
|
|
else if( finishName.StartsWith( wxT( "HAL" ) )
|
|
|| finishName.StartsWith( wxT( "HASL" ) )
|
|
|| finishName.EndsWith( wxT( "tin" ) )
|
|
|| finishName.EndsWith( wxT( "nickel" ) ) )
|
|
{
|
|
m_CopperColor = to_SFVEC4F( findColor( wxT( "Tin" ), g_FinishColors ) );
|
|
}
|
|
else if( finishName.EndsWith( wxT( "silver" ) ) )
|
|
{
|
|
m_CopperColor = to_SFVEC4F( findColor( wxT( "Silver" ), g_FinishColors ) );
|
|
}
|
|
else
|
|
{
|
|
m_CopperColor = to_SFVEC4F( g_DefaultSurfaceFinish );
|
|
}
|
|
}
|
|
else
|
|
{
|
|
m_SilkScreenColorBot = to_SFVEC4F( colors->GetColor( LAYER_3D_SILKSCREEN_BOTTOM ) );
|
|
m_SilkScreenColorTop = to_SFVEC4F( colors->GetColor( LAYER_3D_SILKSCREEN_TOP ) );
|
|
m_SolderMaskColorBot = to_SFVEC4F( colors->GetColor( LAYER_3D_SOLDERMASK_BOTTOM ) );
|
|
m_SolderMaskColorTop = to_SFVEC4F( colors->GetColor( LAYER_3D_SOLDERMASK_TOP ) );
|
|
m_CopperColor = to_SFVEC4F( colors->GetColor( LAYER_3D_COPPER ) );
|
|
m_BoardBodyColor = to_SFVEC4F( colors->GetColor( LAYER_3D_BOARD ) );
|
|
}
|
|
}
|
|
|
|
|
|
extern bool BuildFootprintPolygonOutlines( BOARD* aBoard, SHAPE_POLY_SET& aOutlines,
|
|
int aErrorMax, int aChainingEpsilon,
|
|
OUTLINE_ERROR_HANDLER* aErrorHandler = nullptr );
|
|
|
|
|
|
bool BOARD_ADAPTER::createBoardPolygon( wxString* aErrorMsg )
|
|
{
|
|
m_board_poly.RemoveAllContours();
|
|
|
|
if( !m_board )
|
|
return false;
|
|
|
|
bool success;
|
|
|
|
if( m_board->IsFootprintHolder() )
|
|
{
|
|
if( !m_board->GetFirstFootprint() )
|
|
{
|
|
if( aErrorMsg )
|
|
*aErrorMsg = _( "No footprint loaded." );
|
|
|
|
return false;
|
|
}
|
|
|
|
int chainingEpsilon = pcbIUScale.mmToIU( 0.02 ); // max dist from one endPt to next startPt
|
|
|
|
success = BuildFootprintPolygonOutlines( m_board, m_board_poly,
|
|
m_board->GetDesignSettings().m_MaxError,
|
|
chainingEpsilon );
|
|
|
|
// Make polygon strictly simple to avoid issues (especially in 3D viewer)
|
|
m_board_poly.Simplify( SHAPE_POLY_SET::PM_STRICTLY_SIMPLE );
|
|
|
|
if( !success && aErrorMsg )
|
|
{
|
|
*aErrorMsg = _( "Footprint outline is missing or malformed. Run Footprint Checker for "
|
|
"a full analysis." );
|
|
}
|
|
}
|
|
else
|
|
{
|
|
success = m_board->GetBoardPolygonOutlines( m_board_poly );
|
|
|
|
if( !success && aErrorMsg )
|
|
*aErrorMsg = _( "Board outline is missing or malformed. Run DRC for a full analysis." );
|
|
}
|
|
|
|
return success;
|
|
}
|
|
|
|
|
|
float BOARD_ADAPTER::GetFootprintZPos( bool aIsFlipped ) const
|
|
{
|
|
if( aIsFlipped )
|
|
{
|
|
if( m_Cfg->m_Render.show_solderpaste )
|
|
return m_layerZcoordBottom[B_SilkS];
|
|
else
|
|
return m_layerZcoordBottom[B_Paste];
|
|
}
|
|
else
|
|
{
|
|
if( m_Cfg->m_Render.show_solderpaste )
|
|
return m_layerZcoordTop[F_SilkS];
|
|
else
|
|
return m_layerZcoordTop[F_Paste];
|
|
}
|
|
}
|
|
|
|
|
|
SFVEC4F BOARD_ADAPTER::GetLayerColor( PCB_LAYER_ID aLayerId ) const
|
|
{
|
|
wxASSERT( aLayerId < PCB_LAYER_ID_COUNT );
|
|
|
|
const COLOR4D color = m_colors->GetColor( aLayerId );
|
|
|
|
return SFVEC4F( color.r, color.g, color.b, color.a );
|
|
}
|
|
|
|
|
|
SFVEC4F BOARD_ADAPTER::GetItemColor( int aItemId ) const
|
|
{
|
|
return GetColor( m_colors->GetColor( aItemId ) );
|
|
}
|
|
|
|
|
|
SFVEC4F BOARD_ADAPTER::GetColor( const COLOR4D& aColor ) const
|
|
{
|
|
return SFVEC4F( aColor.r, aColor.g, aColor.b, aColor.a );
|
|
}
|
|
|
|
|
|
SFVEC2F BOARD_ADAPTER::GetSphericalCoord( int i ) const
|
|
{
|
|
SFVEC2F sphericalCoord =
|
|
SFVEC2F( ( m_Cfg->m_Render.raytrace_lightElevation[i] + 90.0f ) / 180.0f,
|
|
m_Cfg->m_Render.raytrace_lightAzimuth[i] / 180.0f );
|
|
|
|
sphericalCoord.x = glm::clamp( sphericalCoord.x, 0.0f, 1.0f );
|
|
sphericalCoord.y = glm::clamp( sphericalCoord.y, 0.0f, 2.0f );
|
|
|
|
return sphericalCoord;
|
|
}
|